公开(公告)号：EP2947685A1

公开(公告)日：2015-11-25

申请号：EP14861114.8

申请日：2014-04-03

申请人： Silicone Valley Co., Ltd

发明人： YOUN, Kyoungseob

IPC分类号： H01L21/66

CPC分类号： H01L22/32 ,  G01R1/0408 ,  G01R1/0466 ,  G01R3/00 ,  H01L21/02118 ,  H01L21/288 ,  H01L21/321 ,  H01L21/32133

摘要： The present invention relates to a semiconductor test pad used in a semiconductor test, and more specifically, to a semiconductor test pad with stacked metal sheets, which is manufactured by preparing a first sheet using a thin metal plate, etching and stacking and then vertically cutting the first sheet, and a method for manufacturing the same. The semiconductor test pad includes first layers, each of which includes an insulator rectangular in cross section and having a predetermined length along a Y-axis direction, and second layers, each of which includes a plurality of rectangular conductors passing, in a Z-axis direction and at predetermined intervals, through insulators each rectangular in cross section and having the same height along the Z-axis direction as the first layer and the same length along the Y-axis direction, wherein the first layers and the second layers are alternately stacked along the X-axis direction, thus allowing the semiconductor test pad to overall look like a rectangular pad, and wherein first layers are positioned at both end portions along the X-axis.

摘要翻译： 本发明涉及半导体测试中使用的半导体测试垫，更具体地说，涉及一种具有堆叠金属片的半导体测试垫，其通过使用薄金属板制备第一片，蚀刻和堆叠，然后垂直切割 第一片及其制造方法。 半导体测试焊盘包括第一层，每个第一层包括横截面为矩形且具有沿Y轴方向的预定长度的绝缘体，以及第二层，每个第二层包括多个矩形导体，其在Z轴上 方向并且以预定间隔通过绝缘体，每个矩形截面并且沿着Z轴方向具有与第一层相同的高度和沿Y轴方向具有相同的长度，其中第一层和第二层交替堆叠 沿X轴方向，从而允许半导体测试焊盘整体看起来像矩形焊盘，并且其中第一层沿着X轴位于两个端部。