DISPOSITIF MEMS COMPRENANT UN ACTIONNEUR APTE A GENERER UN MOUVEMENT D'ENTRAINEMENT A HYSTERESIS.

    公开(公告)号:EP1599766A2

    公开(公告)日:2005-11-30

    申请号:EP04717655.7

    申请日:2004-03-05

    IPC分类号: G04C3/12 H02N1/00

    CPC分类号: H02N1/008 G04C3/12

    摘要: The invention relates to a self-assembling device formed by engraving in a block of a semi-conductive material, said engraving being carried out in a thickness higher than 10νm. The inventive device comprises the following elements: a driving element (250) sequentially meshing with a toothed driven element (10), an actuator (20) displacing the driving element according to a hysteresis motion in such a way that said driving element (250) meshes with the successive teeth (11, 12, 13) of the driving element (10). The actuator (20) comprises an actuating module (201,202) consisting of at least one fixed comb (225, 226) and a movable comb (235, 236), each comb being provided with a series of fingers. Said movable comb (235, 236) is arranged with respect to the fixed comb (225, 226) in such a way that the fingers thereof and the fingers of the movable comb interlock between each other. Said invention is characterised in that the movable comb (235, 236) is displaceable with respect to the fixed comb (225, 226) in a parallel direction to the fingers thereof when a potential difference is applied between the fixed comb and the movable comb, thereby displacing the driving element (250) in a corresponding direction.

    INDEXATION PASSIVE D'UN ÉLÉMENT MOBILE PRÉSENTANT DES DENTS
    6.
    发明公开
    INDEXATION PASSIVE D'UN ÉLÉMENT MOBILE PRÉSENTANT DES DENTS 有权
    被动的INDEXIERUNG EINES BEWEGLICHEN元素MITZÄHNEN

    公开(公告)号:EP2802852A1

    公开(公告)日:2014-11-19

    申请号:EP13700171.5

    申请日:2013-01-11

    申请人: Silmach

    摘要: The invention relates to a device including: a movable element (1) comprising teeth (11; 11
    i , i, 11
    i+1 , 11
    i+2 ,11
    i+3 , 11
    i+4 ); a driving element (2) for engaging with the teeth (11; 11
    i , 11
    i+1 , 11
    i+2 ,11
    i+3 , 11
    i+4 ) of the movable element (1) so as to set the movable element (1) in motion in a direction of movement; an actuator element (3) capable of generating an alternating movement so as to move the driving element (2) according to at least two phases, i.e. a driving phase, during which the driving element (2) is engaged with a tooth (11; 11
    i , 11
    i+1 , 11
    i+2 ,11
    i+3 , 11
    i+4 ) of the movable element (1), and a return phase without driving, during which the driving element (2) is shifted with respect to the movable element (1); and a first indexing element (4), which includes a first indexing finger (41) to be positioned between two teeth (11; 11
    i , 11
    i+1 , 11
    i+2 ,11
    i+3 , 11
    i+4 ) of the movable element (1), and which is connected to the actuator element (3) in order to move the driving element (2) and the first indexing finger (41) simultaneously.

    摘要翻译: 本发明涉及一种装置,包括:包括齿(11; 11i,i,11i + 1,11i + 2,11i + 3,11i + 4)的可移动元件(1) 驱动元件(2),用于与可动元件(1)的齿(11; 11i,11i + 1,11i + 2,11i + 3,11i + 4)接合,以将可动元件(1) 移动方向的运动; 致动器元件(3)能够产生交替运动,以便根据驱动相位至少两个相位驱动驱动元件(2),驱动元件(2)与齿(11; 11i,11i + 1,11i + 2,11i + 3,11i + 4)和无驱动的返回相位,驱动元件(2)相对于可移动元件 1); 以及第一分度元件(4),其包括位于可动元件的两个齿(11; 11i,11i + 1,11i + 2,11i + 3,11i + 4)之间的第一分度指(41) 1),并且其连接到致动器元件(3),以便同时移动驱动元件(2)和第一分度指(41)。

    PROCEDE ET DISPOSITIF POUR DEPLACER UN ELEMENT A ENTRAINER UTILISANT UN ELEMENT ACTIONNEUR FORME PAR GRAVURE DANS UN MATERIAU SEMI-CONDUCTEUR
    7.
    发明公开
    PROCEDE ET DISPOSITIF POUR DEPLACER UN ELEMENT A ENTRAINER UTILISANT UN ELEMENT ACTIONNEUR FORME PAR GRAVURE DANS UN MATERIAU SEMI-CONDUCTEUR 审中-公开
    在半导体材料中移动使用的驱动元件通过蚀刻方法和设备进行控制元件

    公开(公告)号:EP1864374A1

    公开(公告)日:2007-12-12

    申请号:EP06725112.4

    申请日:2006-03-16

    申请人: Silmach

    IPC分类号: H02N1/00

    摘要: The invention concerns an element to be driven (10), a driving element (250) designed to be urged into engagement with the element to be driven (10) and an actuating element (200) adapted to move the driving element (250) so that it drives the element to be driven (10) in step-by-step displacement, the driving element (250) and the actuating element (200) being formed by etching in a semiconductor material wafer (21). The invention is characterized in that it comprises elastic prestressing means (212) for maintaining the driving element (250) in contact with the element to be driven (10).

    摘要翻译: 元件的本发明涉及要被驱动,设计成可推入接合的驱动元件与所述元件被驱动和操作元件angepasst以移动驱动元件这样做的驱动元件,以在步骤一步位移来驱动 中,驱动元件和致动元件通过在半导体材料晶片进行蚀刻而形成。 本发明的特征中那样,它包括弹性预加应力装置用于与该元件接触保持所述驱动元件被驱动。

    PROCEDE ET DISPOSITIF POUR DEPLACER UN ELEMENT A ENTRAINER UTILISANT UN ELEMENT ACTIONNEUR FORME PAR GRAVURE DANS UN MATERIAU SEMI-CONDUCTEUR
    10.
    发明公开
    PROCEDE ET DISPOSITIF POUR DEPLACER UN ELEMENT A ENTRAINER UTILISANT UN ELEMENT ACTIONNEUR FORME PAR GRAVURE DANS UN MATERIAU SEMI-CONDUCTEUR 审中-公开
    在半导体材料中移动使用的驱动元件通过蚀刻方法和设备进行控制元件

    公开(公告)号:EP1878108A1

    公开(公告)日:2008-01-16

    申请号:EP06708779.1

    申请日:2006-03-15

    申请人: Silmach

    IPC分类号: H02N1/00

    摘要: The invention concerns a device comprising an element to be driven (10) and a driving element (250) designed to be urged into engagement with the element to be driven (10) and an actuating element (202) adapted to generate a reciprocating movement to move the driving element (250), the driving element (250) and the actuating element (202) being formed by etching in a semiconductor material block. The invention is characterized in that it is arranged such that: during a first alternation (a) of the movement generated by the actuating element (202), the driving element (250) is urged into engagement with the element to be driven (10) to pull the element to be driven (10), during a second alternation (b) in the opposite direction generated by the actuating element (202), the driving element (250) slides on the element to be driven (10), such that the element to be driven (10) is displaced in a step-by-step movement by the driving element (250).

    摘要翻译: 包括元件被驱动的装置和设计的驱动元件被推动到与所述元件被驱动和操作元件angepasst以产生往复运动来移动所述驱动元件,所述驱动元件和致动元件由形成 在半导体材料中蚀刻块,提供。 在第一交替的(a)由所述致动元件产生的运动,所述驱动元件被推动到与所述元件被驱动到拉被驱动元件。 过程中通过致动元件产生的相反方向的第二交替(b)所示,在元件上的驱动元件滑动,以被驱动,求DASS压模件被驱动在由驱动元件的一步一步的移动位移。