IMAGING ELEMENT AND IMAGING DEVICE
    2.
    发明公开

    公开(公告)号:EP4131380A1

    公开(公告)日:2023-02-08

    申请号:EP21778940.3

    申请日:2021-03-24

    摘要: An imaging element according to an embodiment of the present disclosure includes: a first electrode and a second electrode; a third electrode; a photoelectric conversion layer; and a semiconductor layer. The first electrode and the second electrode are disposed in parallel. The third electrode is disposed to be opposed to the first electrode and the second electrode. The photoelectric conversion layer is provided between the first electrode and second electrode and the third electrode. The photoelectric conversion layer includes an organic material. The semiconductor layer includes a first layer and a second layer that are stacked in order from the first electrode and second electrode side between the first electrode and second electrode and the photoelectric conversion layer. The first layer has a larger value for C5s indicating a contribution ratio of a 5s orbital to a conduction band minimum than a value of the second layer for C5s. The second layer has a larger value for E VO indicating oxygen deficiency generation energy or a larger value for E VN indicating nitrogen deficiency generation energy than a value of the first layer for E VO or E VN .

    IMAGING ELEMENT, LAMINATED IMAGING ELEMENT, SOLID-STATE IMAGING ELEMENT, AND METHOD FOR MANUFACTURING IMAGING ELEMENT

    公开(公告)号:EP3951902A1

    公开(公告)日:2022-02-09

    申请号:EP20785342.5

    申请日:2020-02-25

    发明人: MORIWAKI, Toshiki

    摘要: An imaging element includes a photoelectric conversion section 23 including a first electrode 21, a photoelectric conversion layer 23A including an organic material, and a second electrode 22 that are stacked. An inorganic oxide semiconductor material layer 23B including a first layer 23C and a second layer 23D, from side of the first electrode, is formed between the first electrode 21 and the photoelectric conversion layer 23A, and ρ 1 ≥ 5.9 g/cm 3 and ρ 1 - ρ 2 ≥ 0.1 g/cm 3 are satisfied, where ρ 1 is an average film density of the first layer 23C and ρ 2 is an average film density of the second layer 23D in a portion extending for 3 nm from an interface between the first electrode 21 and the inorganic oxide semiconductor material layer 23B.