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公开(公告)号：EP3329315A1
公开(公告)日：2018-06-06
申请号：EP16751020.5
申请日：2016-07-19
发明人： YAMAMOTO, Atsushi , TAKEUCHI, Koichi , KUROBE, Toshihiro , MATSUGAI, Hiroyasu , ITOU, Hiroyuki , SAITO, Suguru , OHSHIMA, Keiji , FUJII, Nobutoshi , TAZAWA, Hiroshi , SHIRAIWA, Toshiaki , ISHIDA, Minoru
IPC分类号： G02B13/00 , B29D11/00 , G02B3/00 , H01L27/146 , G02B27/32
CPC分类号： G02B3/0075 , B29C43/04 , B29C43/18 , B29D11/00307 , B29D11/00375 , G02B3/0062 , G02B3/0068 , G02B13/0085 , G02B27/32 , H01L27/14625 , H01L27/14627 , H01L27/14685 , H01L27/14687
摘要： Substrates with lenses having lenses disposed therein are aligned with high accuracy. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are direct-bonded and stacked based on an alignment mark. The alignment mark is formed simultaneously with the through-hole. The present technique can be applied to a camera module or the like in which a stacked lens structure in which at least three substrates with lenses including first to third substrates with lenses which are substrates with lenses in which a through-hole is formed in the substrate and a lens is formed on an inner side of the through-hole is integrated with a light receiving element, for example.
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2.发明公开
公开(公告)号：EP3329312A1
公开(公告)日：2018-06-06
申请号：EP16751021.3
申请日：2016-07-19
发明人： YOSHIOKA, Hirotaka , MATSUGAI, Hiroyasu , ITOU, Hiroyuki , SAITO, Suguru , OHSHIMA, Keiji , FUJII, Nobutoshi , TAZAWA, Hiroshi , SHIRAIWA, Toshiaki , ISHIDA, Minoru
摘要： Substrates with lenses having lenses disposed therein are aligned with high accuracy. A stacked lens structure has a configuration in which substrates with lenses having a lens disposed on an inner side of a through-hole formed in the substrate are direct-bonded and stacked. In particular, one or more air grooves formed in surfaces of the substrates reduces an influence of air inside a void portion between adjacent lenses of a layered lens structure.
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3.发明授权
公开(公告)号：EP3329312B1
公开(公告)日：2020-09-23
申请号：EP16751021.3
申请日：2016-07-19
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4.发明公开
公开(公告)号：EP3329313A1
公开(公告)日：2018-06-06
申请号：EP16751016.3
申请日：2016-07-15
发明人： MORIYA, Yusuke , IWASAKI, Masanori , OINOUE, Takashi , HAGIMOTO, Yoshiya , MATSUGAI, Hiroyasu , ITOU, Hiroyuki , SAITO, Suguru , OHSHIMA, Keiji , FUJII, Nobutoshi , TAZAWA, Hiroshi , SHIRAIWA, Toshiaki , ISHIDA, Minoru
CPC分类号： G02B13/0085 , B29D11/00298 , B29D11/00375 , G02B3/0056 , G02B5/003 , G02B27/0018
摘要： The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
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公开(公告)号：EP3328623A1
公开(公告)日：2018-06-06
申请号：EP16751674.9
申请日：2016-07-19
发明人： SHIRAIWA, Toshiaki , OKAMOTO, Masaki , MATSUGAI, Hiroyasu , ITOU, Hiroyuki , SAITO, Suguru , OHSHIMA, Keiji , FUJII, Nobutoshi , TAZAWA, Hiroshi , ISHIDA, Minoru
CPC分类号： G02B3/0062 , B29D11/00009 , B29D11/00307 , B29D11/00375 , G02B3/0031 , G02B3/0068 , G02B3/0075 , G02B13/0085 , H01L27/14627 , H04N5/2254
摘要： Influence of chipping in case of dicing a plurality of stacked substrates is reduced. Provided is a semiconductor device where a substrate, in which a groove surrounding a pattern configured with a predetermined circuit or part is formed, is stacked. The present technology can be applied to, for example, a stacked lens structure where through-holes are formed in each substrate and lenses are disposed in inner sides of the through-holes, a camera module where a stacked lens structure and a light-receiving device are incorporated, a solid-state imaging device where a pixel substrate and a control substrate are stacked, and the like.
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