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1.发明授权
公开(公告)号：EP2126550B1
公开(公告)日：2019-08-14
申请号：EP08780378.9
申请日：2008-01-24
申请人： SpectraSensors, Inc.
发明人： LIU, Xiang , ZHOU, Xin , FEITISCH, Alfred , SANGER, Gregory, M.
IPC分类号： G01N21/39 , G01N21/3504 , G01N21/27 , G01N21/31
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公开(公告)号：EP3344961A1
公开(公告)日：2018-07-11
申请号：EP16766421.8
申请日：2016-08-31
申请人： SpectraSensors, Inc.
CPC分类号： G01N21/01 , G01J3/0286 , G01J3/42 , G01N21/27 , G01N2201/0231 , G01N2201/0636 , G02B7/008 , G02B7/028 , H01S3/0071 , H01S3/1317 , H01S5/0071 , H01S5/06804
摘要： An optical head assembly for use in a spectrometer is provided that is configured to characterize one or more constituents within a sample gas. The assembly includes a thermoelectric cooler (TEC) having a cold side on one end and a hot side on an opposite end, a cold plate in thermal communication with the cold side of the TEC, a hot block in thermal communication with the hot side of the TEC, a light source in thermal communication with the cold plate such that a change in temperature of the TEC causes one or more properties of the light source (e.g., wavelength, etc.) to change, and an optical element in thermal communication with the cold plate positioned to collimate light emitted by the light source through the sample gas (such that properties of the optical element vary based on a change in temperature of the TEC).
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公开(公告)号：EP2140246B1
公开(公告)日：2016-08-03
申请号：EP08745688.5
申请日：2008-04-11
申请人： SpectraSensors, Inc.
发明人： ZHOU, Xin , LIU, Xiang , FEITISCH, Alfred , SANGER, Gregory, M.
IPC分类号： G01N21/3504 , G01N21/39
CPC分类号： G01N21/3504 , G01N2021/3545 , G01N2021/399 , G01N2201/1215
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公开(公告)号：EP2203242A2
公开(公告)日：2010-07-07
申请号：EP08799027.1
申请日：2008-08-29
申请人： SpectraSensors, Inc.
发明人： BAUM, Marc, M. , MOSS, John , FEITISCH, Alfred , ZHOU, Xin , LIU, Xiang , KWAN, Alex
CPC分类号： B01D53/685 , B01D53/42 , B01D53/52 , B01D53/58 , B01D2251/512 , B01D2251/602 , B01D2251/606 , B01D2259/40
摘要： Scrubber media for reactive gases, that can include but are not necessarily limited to hydrogen chloride (HCl), hydrogen sulfide (H2S), hydrogen fluoride (HF), and ammonia (NH3), can include reactive particles, potentially as small as nano-scale, that can optionally be suspended on macro-scale carrier particles. Reactive gases can be converted to non-volatile compounds by being passed through a bed of such scrubber media. Such scrubber media can be used to remove reactive gases from gas mixtures. Potential applications include differential absorption spectroscopy, air pollutant emission controls, and the like. Methods of preparing scrubber media are also described.
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公开(公告)号：EP3332230A2
公开(公告)日：2018-06-13
申请号：EP16753523.6
申请日：2016-08-03
申请人： SpectraSensors, Inc.
CPC分类号： G01J3/0286 , G01J3/10 , G01J3/28 , G01J3/42 , G01J3/433 , G01J2003/4332 , G01J2003/4334 , G01N21/274 , G01N21/3504
摘要： Frequency registration deviations occurring during a scan of a frequency or wavelength range by a spectroscopic analysis system can be corrected using passive and/or active approaches. A passive approach can include determining and applying mathematical conversions to a recorded field spectrum. An active approach can include modifying one or more operating parameters of the spectroscopic analysis system to reduce frequency registration deviation.
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公开(公告)号：EP3066453A2
公开(公告)日：2016-09-14
申请号：EP14802567.9
申请日：2014-11-06
申请人： SpectraSensors, Inc.
发明人： SCOTT, Peter , FEITISCH, Alfred , DORN, Peter , CHAIMOWITZ, Adam, S. , HUANG, Hsu-hung , SCHREMPEL, Mthias , KELLER, Lutz
CPC分类号： G01N21/031 , G01J3/42 , G01J2003/423 , G01N21/01 , G01N21/0303 , G01N21/05 , G01N21/27 , G01N2021/0307 , G01N2201/06113
摘要： A sample cell can be designed to minimize excess gas volume. Described features can be advantageous in reducing an amount of gas required to flow through the sample cell during spectroscopic measurements, and in reducing a time (e.g. a total volume of gas) required to flush the cell between sampling events. In some examples, contours of the inners surfaces of the sample cell that contact the contained gas can be shaped, dimensioned, etc. such that a maximum clearance distance is provided between the inner surfaces at one or more locations. Systems, methods, and articles, etc. are described.
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公开(公告)号：EP2373978B1
公开(公告)日：2016-03-16
申请号：EP09837058.8
申请日：2009-12-24
申请人： SpectraSensors, Inc.
发明人： HU, Xuejiao , FEITISCH, Alfred
CPC分类号： G01N21/39 , G01N2201/022 , G01N2201/023 , G01N2201/0231
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公开(公告)号：EP2179271B1
公开(公告)日：2014-09-10
申请号：EP08796724.6
申请日：2008-07-28
申请人： SpectraSensors, Inc.
发明人： FEITISCH, Alfred , LIU, Xiang , ZHOU, Xin , LANGHAM, Dale , COOK, Charles, F.
CPC分类号： G01N21/39 , G01N21/3504 , G01N21/75 , G01N2021/399 , Y10T436/20 , Y10T436/204998
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9.发明公开SEMICONDUCTOR LASER MOUNTING WITH INTACT DIFFUSION BARRIER LAYER 审中-公开HT UNG UNG UNG HT HT HT HT HT HT HT HT HT HT HT HT HT HT HT HT
公开(公告)号：EP2745361A1
公开(公告)日：2014-06-25
申请号：EP12750958.6
申请日：2012-08-14
申请人： SpectraSensors, Inc.
IPC分类号： H01S5/022 , H01S5/042 , H01L23/485
CPC分类号： H01S5/02272 , H01L24/03 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/0383 , H01L2224/04026 , H01L2224/05573 , H01L2224/05624 , H01L2224/05663 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/0567 , H01L2224/0568 , H01L2224/05681 , H01L2224/05684 , H01L2224/05686 , H01L2224/29109 , H01L2224/29111 , H01L2224/29139 , H01L2224/29144 , H01L2224/32245 , H01L2224/83801 , H01L2924/12042 , H01L2924/15747 , H01S5/02212 , H01S5/0425 , H01L2924/04941 , H01L2924/01022 , H01L2924/053 , H01L2924/049 , H01L2924/00014 , H01L2924/01032 , H01L2924/01014 , H01L2924/014 , H01L2924/0105 , H01L2924/01029 , H01L2924/01082 , H01L2924/00
摘要： A first contact surface of a semiconductor laser chip can be formed to a target surface roughness selected to have a maximum peak to valley height that is substantially smaller than a barrier layer thickness. A barrier layer that includes a non-metallic, electrically-conducting compound and that has the barrier layer thickness can be applied to the first contact surface, and the semiconductor laser chip can be soldered to a carrier mounting along the first contact surface using a solder composition by heating the soldering composition to less than a threshold temperature at which dissolution of the barrier layer into the soldering composition occurs. Related systems, methods, articles of manufacture, and the like are also described.
摘要翻译： 可以将半导体激光器芯片的第一接触表面形成为选择为具有基本上小于阻挡层厚度的最大峰谷高度的目标表面粗糙度。 可以将包含非金属导电性化合物并且具有阻挡层厚度的阻挡层施加到第一接触表面，并且可以使用焊料将半导体激光器芯片焊接到沿着第一接触表面安装的载体上 通过将焊料组合物加热到低于阻挡层溶入焊料组合物的阈值温度的组合物。 还描述了相关系统，方法，制品等。
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公开(公告)号：EP2440893B1
公开(公告)日：2019-09-11
申请号：EP10786945.5
申请日：2010-06-11
申请人： SpectraSensors, Inc.
发明人： LIU, Xiang , FEITISCH, Alfred , ZHOU, Xin
IPC分类号： G01N21/39 , G01N21/3504 , G01N21/27 , G01J3/433
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