公开(公告)号：EP1230059A1

公开(公告)日：2002-08-14

申请号：EP00989760.4

申请日：2000-11-07

申请人： Speedline Technologies, Inc.

发明人： RICH, Randall, L. ,  DALTON, Shean, R.

IPC分类号： B23K1/008 ,  B23K1/20 ,  H05K3/34 ,  H05K3/26

CPC分类号： H05K3/26 ,  B23K1/008 ,  B23K1/206 ,  B23K2201/36 ,  H05K3/3494 ,  H05K2203/0786 ,  H05K2203/086 ,  H05K2203/1509

摘要： A compact reflow oven and cleaning apparatus combines in a unitary housing for both the reflow and cleaning function. This results in the saving of valuable floor space in the printed circuit board assembly areas. The unitary housing and control of temperatures in the reflow and cleaning areas facilitate the removal of contaminants before solidification of such contaminants.

公开(公告)号：EP1152862A1

公开(公告)日：2001-11-14

申请号：EP00908666.1

申请日：2000-02-16

申请人： Speedline Technologies, Inc.

发明人： RICH, Randall, L.

IPC分类号： B23K1/20 ,  H01L21/48 ,  H05K3/34

CPC分类号： H05K3/26 ,  B23K1/206 ,  B23K2201/36 ,  H05K3/3494 ,  H05K2203/0786 ,  H05K2203/086 ,  H05K2203/1509

摘要： A compact reflow oven and cleaning apparatus combines in a unitary housing for both the reflow and cleaning function. This results in the saving of valuable floor space in the printed circuit board assembly areas. The unitary housing and control of temperatures in the reflow and cleaning areas facilitate the removal of contaminants before solidification of such contaminants.