公开(公告)号：EP2548678B1

公开(公告)日：2018-07-11

申请号：EP10847952.8

申请日：2010-04-23

申请人： DOWA Electronics Materials Co., Ltd.

发明人： ENDOH, Keiichi ,  HISAEDA, Yutaka ,  MIYAZAWA, Akihiro ,  NAGAHARA, Aiko ,  UEYAMA, Toshihiko

IPC分类号： B22F1/00 ,  B22F1/02 ,  B22F7/06 ,  B22F9/24 ,  C22C5/06 ,  H01B1/02 ,  H05K3/32 ,  H01L21/52 ,  H01L23/00 ,  B23K1/00 ,  B23K35/00 ,  B23K35/36 ,  B82Y30/00 ,  B23K1/20 ,  B23K35/30 ,  B23K35/02

CPC分类号： H01L24/83 ,  B22F1/0014 ,  B22F1/0018 ,  B22F1/0062 ,  B22F7/064 ,  B22F9/24 ,  B22F2301/255 ,  B22F2303/01 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2999/00 ,  B23K1/0008 ,  B23K1/0016 ,  B23K1/20 ,  B23K1/203 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/36 ,  B23K35/3618 ,  B23K2101/42 ,  B82Y30/00 ,  C09J11/06 ,  C22C5/06 ,  H01B1/02 ,  H01L24/11 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29139 ,  H01L2224/29339 ,  H01L2224/2949 ,  H01L2224/32145 ,  H01L2224/32221 ,  H01L2224/83011 ,  H01L2224/83048 ,  H01L2224/83075 ,  H01L2224/83203 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/203 ,  H05K3/32 ,  H05K3/3489 ,  H05K2201/0257 ,  H05K2203/086 ,  H05K2203/1131 ,  H01L2224/2919 ,  H01L2924/3512

摘要： A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures without performing conventionally used pressurization. The paste is a bonding material configured to include: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 8 or less carbon atoms; a flux component having at least two carboxyl groups; and a dispersion medium. The use of this bonding material allows materials to be bonded even at a temperature of 300°C or lower.

公开(公告)号：EP2932809A1

公开(公告)日：2015-10-21

申请号：EP13795509.2

申请日：2013-11-26

申请人： L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude

发明人： RODRIGUES, Luiz Felipe ,  NERYZ, Maicon Renan

IPC分类号： H05K3/34 ,  B23K35/38

CPC分类号： B23K35/383 ,  B23K1/0016 ,  B23K1/012 ,  B23K3/082 ,  B23K35/38 ,  H05K3/34 ,  H05K3/3494 ,  H05K2203/086 ,  H05K2203/16 ,  H05K2203/163

摘要： The present invention describes a portable device for monitoring and controlling the level of residual oxygen in reflow oven atmosphere (1). This referred equipment is able to determine the quality of the atmosphere of a reflow oven, using parameters predetermined by the user. Therefore, the equipment performs the monitoring of the reflow oven atmosphere (1) controlling the level of residual oxygen of the reflow oven (1) by increasing or decreasing of the feed flow rate of nitrogen by the control that the microcontroller exerts over the proportional valve of nitrogen flow control (9), by opening or closing the valves to kept such predetermined values.

公开(公告)号：EP2171119A1

公开(公告)日：2010-04-07

申请号：EP08779036.6

申请日：2008-07-16

申请人： Nederlandse Organisatie voor Toegepast- Natuurwetenschappelijk Onderzoek TNO

发明人： HOUBEN, René Jos ,  OOSTERHUIS, Gerrit

IPC分类号： C23C4/12 ,  C23C18/08 ,  C23C18/14 ,  B05D7/24 ,  B05B17/06

CPC分类号： B05D7/24 ,  C23C18/08 ,  C23C18/14 ,  H01L31/022425 ,  H05K3/105 ,  H05K3/125 ,  H05K2203/013 ,  H05K2203/086 ,  Y02E10/50 ,  Y10T428/24802

摘要： The invention provides a method for applying a material onto a substrate using a droplet printing technique wherein a gas stream is released into the direction of a substrate, which gas stream comprises a carrier gas and droplets of a suspension of the material or droplets of a solution of a precursor of the material or droplets of a precursor of the material as such, whereby the droplets in the gas stream are first maintained in a steady flow and subsequently in a converging flow before the droplets are contacted with the substrate. The invention further provides an apparatus for carrying out said method.

公开(公告)号：EP1553630A4

公开(公告)日：2008-08-13

申请号：EP03733512

申请日：2003-06-19

申请人： SONY CORP

发明人： OKUBORA AKIHIKO

IPC分类号： H01L23/12 ,  H01L25/16 ,  H01L21/60 ,  H01L21/607 ,  H01L23/00 ,  H01L23/04 ,  H01L23/10 ,  H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01L25/00 ,  H01P1/12 ,  H05K1/02 ,  H05K1/18 ,  H05K3/46

CPC分类号： H01L25/165 ,  B81C1/0023 ,  H01L23/04 ,  H01L23/10 ,  H01L23/552 ,  H01L23/564 ,  H01L24/48 ,  H01L24/81 ,  H01L25/162 ,  H01L2223/6677 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/0237 ,  H05K1/0272 ,  H05K1/16 ,  H05K1/186 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/0179 ,  H05K2201/09072 ,  H05K2201/09981 ,  H05K2201/10053 ,  H05K2203/061 ,  H05K2203/086 ,  H05K2203/1147 ,  H05K2203/1178 ,  Y10T29/49126 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A high frequency module employed in a radio communication module, comprising a first organic board (11) having a conductor pattern formed on the major surface and mounting one or more element body (7) thereon, and a second organic board (12) having a recess (2) corresponding to the mounting region of the element body (7) in the surface thereof bonded to the first organic board (11). Under a state where the second organic board (12) is bonded to the first organic board (11), the recess (22) defines an element body storing space section (24) for sealing the element body (7) while sustaining moisture resistant characteristics and oxidation resistant characteristics.

公开(公告)号：EP1265469A3

公开(公告)日：2005-01-19

申请号：EP02011615.8

申请日：2002-05-28

申请人： NEC CORPORATION

发明人： Sakai, Hiroshi ,  Suzuki, Motoji ,  Igarashi, Makoto ,  Tanaka, Akihiro

IPC分类号： H05K3/12

CPC分类号： H05K3/3484 ,  H05K3/1233 ,  H05K3/3463 ,  H05K2203/086

摘要： The solder paste printing method of the present invention mounts a solder paste containing therein as a solder material a Sn-Zn system solder on a mask, and urges the solder paste to make rolling over the mask from one end thereof toward the opposite thereof by means of a squeegee to thereby fill the solder paste into apertures formed in the mask. At this time, by maintaining moisture contained in the atmosphere surrounding the solder paste at a value equal to or less than a predetermined value, as the solder paste is suppressed from causing an increase in the viscosity thereof due to the reaction with the moisture in the surrounding atmosphere during the solder paste printing process, the rolling ability of the solder paste during the printing process can be kept, and attachment of the solder paste to the squeegee can be prevented.

公开(公告)号：EP1230059A1

公开(公告)日：2002-08-14

申请号：EP00989760.4

申请日：2000-11-07

申请人： Speedline Technologies, Inc.

发明人： RICH, Randall, L. ,  DALTON, Shean, R.

IPC分类号： B23K1/008 ,  B23K1/20 ,  H05K3/34 ,  H05K3/26

CPC分类号： H05K3/26 ,  B23K1/008 ,  B23K1/206 ,  B23K2201/36 ,  H05K3/3494 ,  H05K2203/0786 ,  H05K2203/086 ,  H05K2203/1509

摘要： A compact reflow oven and cleaning apparatus combines in a unitary housing for both the reflow and cleaning function. This results in the saving of valuable floor space in the printed circuit board assembly areas. The unitary housing and control of temperatures in the reflow and cleaning areas facilitate the removal of contaminants before solidification of such contaminants.

公开(公告)号：EP1152862A1

公开(公告)日：2001-11-14

申请号：EP00908666.1

申请日：2000-02-16

申请人： Speedline Technologies, Inc.

发明人： RICH, Randall, L.

IPC分类号： B23K1/20 ,  H01L21/48 ,  H05K3/34

CPC分类号： H05K3/26 ,  B23K1/206 ,  B23K2201/36 ,  H05K3/3494 ,  H05K2203/0786 ,  H05K2203/086 ,  H05K2203/1509

摘要： A compact reflow oven and cleaning apparatus combines in a unitary housing for both the reflow and cleaning function. This results in the saving of valuable floor space in the printed circuit board assembly areas. The unitary housing and control of temperatures in the reflow and cleaning areas facilitate the removal of contaminants before solidification of such contaminants.

公开(公告)号：EP0681418B1

公开(公告)日：1999-08-25

申请号：EP95400900.7

申请日：1995-04-21

申请人： L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE

发明人： McKean, Kevin P. ,  Rotman, Frédéric ,  Connors, Robert W.

IPC分类号： H05K3/34 ,  B23K1/08 ,  B23K1/008 ,  B23K1/015 ,  B23K1/20 ,  B23K35/38

CPC分类号： H05K3/3468 ,  B23K1/085 ,  B23K2201/36 ,  H05K2203/086 ,  H05K2203/111

公开(公告)号：EP0681418A3

公开(公告)日：1997-01-29

申请号：EP95400900.7

申请日：1995-04-21

申请人： L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE

发明人： McKean, Kevin P. ,  Rotman, Frédéric ,  Connors, Robert W.

IPC分类号： H05K3/34 ,  B23K1/08

CPC分类号： H05K3/3468 ,  B23K1/085 ,  B23K2201/36 ,  H05K2203/086 ,  H05K2203/111

摘要： The present invention relates to a wave soldering process wherein an inert gas atmosphere is injected inside the wave soldering machine, said inert gas atmosphere having a temperature which might be controlled. Particularly, the atmosphere can be heated at the same or different temperatures before injection, for example in the preheating zones, in the machine. The atmosphere can also be cooled (or injected at ambient temperature) e.g. in the cooling zone. Various atmospheres can be used (similar or different from one zone to another). The thermal efficiency of the heat transfer between the atmosphere and the printed circuit boards is thus greatly enhanced, which means less solder defects, higher components density and decrease of energy consumption and inert gas flow rate.

公开(公告)号：EP0546443B1

公开(公告)日：1996-04-10

申请号：EP92120607.4

申请日：1992-12-03

申请人： MOTOROLA, INC.

发明人： Frei, John K. ,  Florenzo, Russell T.

IPC分类号： H05K3/34 ,  B23K1/20 ,  B23K1/005 ,  B23K1/012

CPC分类号： B23K1/20 ,  B23K1/012 ,  H01L21/4853 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/10734 ,  H05K2203/086 ,  H05K2203/095