COMPOSITION FOR FILM FORMATION, INSULATING FILM, AND SEMICONDUCTOR DEVICE
    1.
    发明公开
    COMPOSITION FOR FILM FORMATION, INSULATING FILM, AND SEMICONDUCTOR DEVICE 审中-公开
    联络资料ZUSAMMENSETZUNG,ISOLATIONSFILM UND HALBLEITERBAUELEMENT

    公开(公告)号:EP2457932A1

    公开(公告)日:2012-05-30

    申请号:EP10802148.6

    申请日:2010-06-25

    摘要: A composition for film formation according to the present invention includes polymerizable compounds each having at least one polymerizable functional group, and the polymerizable compound includes a partial structure containing an adamantane type cage structure and at least one polymerizable reactive group contributing to polymerization reaction in one molecule thereof. Further, the polymerizable reactive group contains an aromatic ring and at least one ethynyl or vinyl group directly bonded to the aromatic ring as the polymerizable functional group, and the number of carbon atoms derived from the aromatic ring is in the range of 15 to 38% with respect to the number of total carbon atoms of the polymerizable compound.

    摘要翻译: 根据本发明的用于成膜的组合物包括各自具有至少一个可聚合官能团的可聚合化合物,并且可聚合化合物包括含有金刚烷型笼状结构的部分结构和在一个分子中有助于聚合反应的至少一个可聚合反应性基团 它们。 此外,可聚合反应性基团包含芳环和至少一个直接键合到作为可聚合官能团的芳环上的乙炔基或乙烯基,并且来自芳环的碳原子数在15至38%的范围内, 相对于可聚合化合物的总碳原子数。