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    Method of mounting terminal to flexible printed circuit board
    2.
    发明公开
    Method of mounting terminal to flexible printed circuit board 失效
    Verfahren zur Montage einer在einer flexiblen Leiterplatte中提供Anschlussstiftes

    公开(公告)号：EP0714226A1

    公开(公告)日：1996-05-29

    申请号：EP95117349.1

    申请日：1995-11-03

    申请人： Sumitomo Wiring Systems, Ltd.

    发明人： Noda, Haruo, c/o Sumimoto Wiring Sys, Ltd

    IPC分类号： H05K3/34 ,  B23K3/08

    CPC分类号： H05K3/3447 ,  B23K3/08 ,  B23K2201/42 ,  H05K1/0393 ,  H05K3/007 ,  H05K3/3452 ,  H05K3/3468 ,  H05K2203/0156 ,  H05K2203/0557 ,  Y10T29/49144 ,  Y10T29/49153

    摘要： For soldering a terminal (14) to a land (13) formed on an FPC (12) made of a material having a softening point below 230°C, such as PET, by using a flow soldering or reflow soldering technique, an opening (17) larger than the land (13) is formed in a thermal insulation holder (11) including a phenolic paper base copper clad laminate board or the like so that the land (13) and the terminal (14) are within sight, and the thermal insulation holder (11) is held in contact with a surface of the FPC (12) to which solder is applied so that the land (13) and the terminal (14) are located within the opening (17) to perform the soldering using the flow soldering or reflow soldering technique, whereby molten solder readily reaches the land (13) through the opening (17) which need not be worked into a conventional trapezoidal configuration in vertical section, thereby preventing poor soldering.

    摘要翻译： 为了将端子（14）焊接到由软化点低于230℃的材料制成的FPC（12）上形成的焊盘（13），例如PET，通过流焊或回流焊接技术，将开口（14） 17）比包括酚醛纸基铜覆层压板等的绝热保持器（11）中形成的平台（13）大，以使得接地区（13）和端子（14）在视野内，并且 保温保持器（11）与施加有焊料的FPC（12）的表面保持接触，使得焊盘（13）和端子（14）位于开口（17）内，以使用 流动焊接或回流焊接技术，其中熔融焊料通过开口（17）容易地到达焊盘（13），这不需要在垂直截面中被加工成常规的梯形结构，从而防止焊接不良。