公开(公告)号：EP4429840A1

公开(公告)日：2024-09-18

申请号：EP22809051.0

申请日：2022-10-24

申请人： Ersa GmbH

发明人： HOFMANN, Uwe ,  ENDRESS, Lothar

IPC分类号： B23K1/008

CPC分类号： B23K3/08 ,  B23K1/008

公开(公告)号：EP3771875B1

公开(公告)日：2024-07-03

申请号：EP20188295.8

申请日：2020-07-29

IPC分类号： F27B9/30 ,  B23K1/008 ,  B23K1/012 ,  F27B9/40 ,  F27D1/18 ,  F27D19/00 ,  F27D21/00 ,  B23K3/047 ,  B23K3/08

CPC分类号： F27D1/1858 ,  F27D19/00 ,  F27D21/00 ,  F27B9/40 ,  F27B9/30 ,  B23K1/008 ,  B23K3/047 ,  B23K3/08

公开(公告)号：EP4374998A1

公开(公告)日：2024-05-29

申请号：EP21951053.4

申请日：2021-12-21

申请人： LS Electric Co., Ltd.

发明人： KWON, Ki Jeong ,  KANG, Rae Suk

IPC分类号： B23K1/00 ,  B23K3/08 ,  B23K3/06 ,  B23Q7/04 ,  B23K35/02 ,  B23K31/12 ,  B23K11/30 ,  B24B27/033

CPC分类号： B23Q7/04 ,  B23K11/30 ,  B23K1/00 ,  B23K35/02 ,  B24B27/033 ,  B23K3/08 ,  B23K31/12 ,  B23K3/06

摘要： A brazing system according to an embodiment of the present invention, which is for brazing an object to be bonded to a base material, comprises: a turntable provided with a reception part for receiving the base material and rotatable clockwise or counterclockwise; a base material supply device for supplying the base material to the reception part; a brazing filler metal supply device for supplying a brazing filler metal to an upper side of the base material; a first heating device for bonding the brazing filler metal to the base material; a bonding object supply device for supplying the object to be bonded to an upper side of the brazing filler metal bonded to the base material; a second heating device which is in contact with opposite sides of the base material to fix the base material and is provided with electrodes for supplying electric current to the base material so as to bond the object to be bonded to the base material; and a cooling device which comes into contact with the object to be bonded to cool the object to be bonded.

公开(公告)号：EP3307468A1

公开(公告)日：2018-04-18

申请号：EP16753242.3

申请日：2016-06-14

申请人： Hesse GmbH

发明人： WALTHER, Frank ,  HESSE, Hans-Jürgen ,  JOCHHEIM, Andreas

IPC分类号： B23K3/08 ,  B23K20/26

CPC分类号： G01L25/00 ,  B23K3/08 ,  B23K20/004 ,  B23K20/26 ,  H01L24/78 ,  H01L2224/78001 ,  H01L2224/783

摘要： The invention relates to a calibration method for a bonder, wherein characteristics of a force actuator of the bonder are measured and stored in such a way that the force actuator can be controlled optimally during productive operation of the bonder on the basis of the measured data. The invention further relates to a device for fully automatic or partially automatic bonding force calibration.

公开(公告)号：EP3098012A4

公开(公告)日：2017-08-23

申请号：EP15740740

申请日：2015-01-06

申请人： ORIGIN ELECTRIC

发明人： KOBAYASHI HIDEO ,  OZAWA NAOTO ,  MATSUDA JUN

IPC分类号： B23K1/008 ,  B23K1/00 ,  B23K1/20 ,  G01J5/00 ,  G01N21/3504

CPC分类号： B23K3/08 ,  B23K1/20 ,  G01J5/0014 ,  G01N21/3504 ,  G01N25/00 ,  G01N33/0047

摘要： Provided is a method for estimating carboxylic acid gas concentration allowing safe measuring in real time of the carboxylic acid gas concentration of formic acid gas or the like inside the chamber (10) of a soldering device, and a soldering device allowing estimation of the chamber-interior concentration of carboxylic acid gas. The surface temperature of an object placed inside the chamber is measured at the same time using a thermometer (first thermometer) (37) that can measure temperature without being affected by carboxylic-acid-induced infrared ray absorption, and a radiation thermometer (second thermometer) (38) for measuring temperature using infrared radiation in a wavelength band in which carboxylic acid is absorbed, and the concentration of carboxylic acid gas inside the chamber is estimated based on the temperature difference between the first thermometer and the second thermometer (”Tx). The soldering device is provided with a heating stage (30), a means (25) for introducing a mixed gas comprising an inert gas and carboxylic acid gas, a gas discharge means (26), the first thermometer (37), and the second thermometer (38).

摘要翻译： 本发明提供一种能够实时安全地测量焊接装置的腔室（10）内的甲酸气体等的羧酸气体浓度的羧酸气体浓度的估计方法以及能够估计腔室内温度的焊接装置， 羧酸气体的内部浓度。 使用可以测量温度而不受羧酸诱导的红外线吸收影响的温度计（第一温度计）（37）同时测量放置在腔室内的物体的表面温度，并且使用辐射温度计（第二温度计 ）（38），利用吸收了羧酸的波段的红外线测定温度，基于第一温度计与第二温度计的温度差（“Tx”）推定腔室内的羧酸气体的浓度 。 该焊接装置具有加热台（30），用于导入惰性气体和羧酸气体的混合气体的装置（25），气体排出装置（26），第一温度计（37）和第二温度计 温度计（38）。

公开(公告)号：EP3205904A1

公开(公告)日：2017-08-16

申请号：EP15848309.9

申请日：2015-10-07

申请人： SENJU METAL INDUSTRY CO., LTD.

发明人： SUGIHARA Takashi ,  TAGUCHI Hiroshi ,  HIYAMA Tsutomu

IPC分类号： F16H25/24 ,  B23K1/08 ,  F16H25/20 ,  H05K3/34 ,  B23K101/42

CPC分类号： H05K3/34 ,  B23K1/08 ,  B23K3/06 ,  B23K3/0676 ,  B23K3/08 ,  B23Q1/265 ,  F16H25/20 ,  F16H25/24 ,  F16H25/2418

摘要： Provided are a nut, an attachment for nut and a screw shaft, which are fitted to a coating material coating device or a soldering device and can change a fixed position of the nut easier than that of a convention example even if any adhered matters generated when each device is used for a long time are fixed, and a soldering device using the same. The nut 10 screws on to the screw shaft 2 having a predetermined length. The nut 10 is provided with a non-meshing part 11 composed of a notch 12 that is formed parallel to a movement direction thereof by cutting off screw threads and a flange portion 13, which has connecting holes 14 for connecting another member. Under such a configuration, by forward and/or backward movement of the nut 10, the notch 12 functions as if it scraps the fixed matters 6.

摘要翻译： 本发明提供一种螺母，螺母用附件以及螺杆轴，它们与涂料涂覆装置或钎焊装置相配合，并且即使在任何附着物产生时也能够比一般示例更容易地改变螺母的固定位置 每个设备使用很长时间都是固定的，并且焊接设备使用相同的。 螺母10拧到具有预定长度的螺杆轴2上。 螺母10设置有非啮合部分11，该非啮合部分11由切口12构成，该切口12通过切断螺纹而平行于其移动方向形成，并且凸缘部分13具有用于连接另一个构件的连接孔14。 在这种构造下，通过螺母10的向前和/或向后移动，切口12起到如同切割固定物6的作用。

公开(公告)号：EP3115142A1

公开(公告)日：2017-01-11

申请号：EP15201706.7

申请日：2015-12-21

申请人： OK International, Inc.

发明人： Marino, Kenneth D. ,  Nguyen, Hoa

IPC分类号： B23K3/03 ,  B23K3/08 ,  B23K1/00 ,  B23K31/12 ,  G06T15/08 ,  G01B11/00 ,  H05K3/22 ,  H05K3/34

CPC分类号： B23K3/033 ,  B23K1/0016 ,  B23K3/08 ,  B23K31/125 ,  H05K3/225 ,  H05K3/3494 ,  H05K2203/0195 ,  H05K2203/163

摘要： An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.

摘要翻译： 一种智能焊接盒，包括：壳体; 一个烙铁头; 用于加热焊接​​头的加热器; 存储装置，用于存储关于盒的特性的信息; 处理器，用于检索关于盒的特性的信息，监测传送到焊接头的功率水平以检测焊接点处的液相线出现，使用一些检索到的信息确定焊接接头的金属间化合物（IMC）的厚度 确定所述IMC的厚度是否在预定范围内，并且当所述IMC的厚度在所述预定范围内时，生成指示形成可靠焊点连接的指示信号; 以及用于发送指示信号的接口。

公开(公告)号：EP3111522A1

公开(公告)日：2017-01-04

申请号：EP14815982.5

申请日：2014-11-19

申请人： Illinois Tool Works Inc.

发明人： KLOCHKOV, Aleksey ,  GEFTER, Peter ,  HEYMAN, Steven Bernard

IPC分类号： H01T23/00

CPC分类号： H05F3/06 ,  B23K1/0016 ,  B23K1/008 ,  B23K3/0653 ,  B23K3/08 ,  F27B9/029 ,  F27B17/0025 ,  H01T23/00 ,  Y10T29/49826

摘要： Ionizing bars for delivering charged carriers to charge neutralization target objects may include an ion emitter for establishing an ion cloud of charge carriers in response to application of an ionizing voltage. Disclosed bars may also include a reference electrode that presents a non-ionizing electric field to urge ions to move away from the ion emitter. The disclosed bars may also include a manifold. The manifold may receive and divide gas into plural gas streams directed past the ion emitter in a pattern to thereby urge charge carriers toward the target. The manifold may have plural apertures with nozzled inserts received therein. At least some of the inserts may have at least one aperture through which gas may flow and the nozzle inserts may collectively direct the divided gas streams away from the manifold and toward the target in one or more predetermined patterns.

摘要翻译： 用于递送带电载流子以对中和目标物体进行电荷的电离条可包括用于响应于施加电离电压建立电荷载流子的离子云的离子发射器。 公开的棒还可以包括参考电极，其提供非电离电场以促使离子离开离子发射器。 所公开的杆还可以包括歧管。 歧管可以将气体接收并分成多个气体流，这些气流以图案被引导通过离子发射器，从而将电荷载体推向目标。 歧管可以具有多个孔，其中容纳有喷嘴插入物。 至少一些插入件可以具有至少一个孔，气体可以通过该孔流动，并且喷嘴插件可以以一种或多种预定模式将分流的气流集中地引导离开歧管并朝向目标。

公开(公告)号：EP3088116A4

公开(公告)日：2016-11-30

申请号：EP13900455

申请日：2013-12-25

申请人： SENJU METAL INDUSTRY CO

发明人： HIYAMA TSUTOMU ,  INOUE HIROYUKI ,  KIMOTO SHUNSUKE ,  KAGAYA TOMOTAKE

IPC分类号： B23K1/008 ,  B23K1/20 ,  B23K101/42 ,  F04D27/02 ,  H05K3/34

CPC分类号： B23K3/08 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/203 ,  B23K2201/42 ,  F04D19/04 ,  F04D27/0261 ,  H05K3/3494 ,  H05K2203/043 ,  H05K2203/085 ,  H05K2203/1178

摘要： In a vacuum soldering apparatus and a control method thereof according to the present invention, in order to prevent flux scattering or solder scattering when voids are defoamed and/or deaerated from molten solder by evacuating a chamber to a target degree of vacuum as well as in order to be able to perform brief evacuation, an evaluation control of a pump is performed. The evaluation control of the pump is performed in which the plural evacuation control properties (#1 through #4) with the gradients ¸ plotting the degrees of vacuum (pressure P) in relation to evacuation time (time t) when a chamber is evacuated by a predetermined pump output, are previously prepared; and the control are changed from evacuation control property of small pump output to evacuation control property of large pump output based on the initially set gradient ¸ in the evacuation control property.

公开(公告)号：EP3053637A1

公开(公告)日：2016-08-10

申请号：EP14847082.6

申请日：2014-07-11

申请人： Origin Electric Company, Limited

发明人： OZAWA, Naoto

IPC分类号： B01D53/86 ,  B01J23/42 ,  B23K31/02

CPC分类号： B01D53/8668 ,  B01D53/8696 ,  B01D2251/11 ,  B01D2255/1021 ,  B01D2255/2092 ,  B01D2257/70 ,  B01D2257/708 ,  B23K3/08

摘要： Provided are: a formic acid decomposition apparatus which can dispose of formic acid safely and quickly and determine the activity of a packed catalyst; and a formic acid decomposition method. This formic acid decomposition apparatus is to be used in decomposing formic acid contained in an exhaust gas into water and carbon dioxide, said exhaust gas being discharged from a soldering device in which the reduction treatment of surface oxide film with formic acid has been conducted. The formic acid decomposition apparatus is provided with: a formic acid decomposition unit in which a formic acid decomposition catalyst is packed; a gas introduction pipe for introducing a formic acid-containing gas into the formic acid decomposition unit; and a gas introduction mechanism for introducing oxygen or an oxygen-containing gas into the formic acid decomposition unit. In the formic acid decomposition apparatus, the activity of the catalyst is determined on the basis of catalyst temperature change due to the heat generated in the decomposition reaction of formic acid. This formic acid decomposition method comprises: mixing oxygen or an oxygen-containing gas with a formic acid-containing exhaust gas discharged from a soldering device, in which the reduction treatment of surface oxide film with formic acid has been conducted, at a molar ratio of oxygen to formic acid (oxygen/formic acid) of 1.5 or more; subjecting the mixture to reaction in the presence of a formic acid decomposition catalyst; and thus decomposing the formic acid into water and carbon dioxide.