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公开(公告)号：EP3152917B1
公开(公告)日：2018-09-12
申请号：EP14727860.0
申请日：2014-06-05
申请人： TDK Corporation
CPC分类号： H04R3/00 , H04R1/04 , H04R19/005 , H04R19/04
摘要： An electronic circuit for a microphone comprises a first terminal and a second terminal, wherein the electronic circuit is selectively operable in a first mode and a second mode. In the first mode, the first terminal is configured for microphone output and in the second mode, the second terminal is configured for microphone output. Furthermore, a method of operating a microphone is provided.
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公开(公告)号：EP3356286A1
公开(公告)日：2018-08-08
申请号：EP15777648.5
申请日：2015-09-30
申请人： TDK Corporation
发明人： ROMBACH, Pirmin Hermann Otto , RASMUSSEN, Kurt , LEIDL, Anton , PAHL, Wolfgang , MORTENSEN, Dennis
CPC分类号： B81B7/0048 , B81B3/0018 , H01L24/34 , H01L2924/00014 , H01L2224/37099
摘要： A MEMS device comprises a sensor system that is resiliently mounted on a carrier by means of spring elements. The air gap between sensor system and carrier is reduced by a damping structure present on one of facing surfaces of sensor system and carrier. The spring elements are at least partially accommodated within recesses of the damping structure. The height of the air gap is small enough to allow squeeze film damping.
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公开(公告)号：EP3247674A1
公开(公告)日：2017-11-29
申请号：EP15797033.6
申请日：2015-11-06
申请人： TDK Corporation
IPC分类号： B81B7/00
CPC分类号： B81B7/0048 , B81B2201/0257 , B81B2207/07 , H04R1/021 , H04R19/005 , H04R19/04 , H04R2201/003
摘要： Disclosed is a module in which a MEMS component is connected to a support via mechanical joints in such a way that the MEMS component remains stress-free across a large temperature range. For this purpose, a mechanical joint comprises a compensation structure which bridges a horizontal gap between fastening points by means of a horizontal section, and the coefficient of thermal expansion of the compensation structure is selected in a suitable manner.
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公开(公告)号：EP3247674B1
公开(公告)日：2019-01-02
申请号：EP15797033.6
申请日：2015-11-06
申请人： TDK Corporation
IPC分类号： B81B7/00
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公开(公告)号：EP3360340A1
公开(公告)日：2018-08-15
申请号：EP15777685.7
申请日：2015-10-07
申请人： TDK Corporation
发明人： GINNERUP, Morten , ROMBACH, Pirmin Hermann Otto , RAVNKILDE, Jan Tue , MORTENSEN, Dennis , RASMUSSEN, Kurt
IPC分类号： H04R19/04
CPC分类号： H04R19/04 , H04R1/04 , H04R1/083 , H04R1/28 , H04R19/005 , H04R2201/003
摘要： A package for a top port microphone with an enlarged back volume comprises on a substrate a lid enclosing thereunder a total volume and accommodating a MEMS chip and an ASIC. A stopper seals the ASIC against the lid thereby separating and dividing the total volume under the lid in a volume extension and a remaining volume. The volume extension can be used to arbitrarily enlarge the back volume or the front volume dependent on a placement of a sound port to the volume extension or the remaining volume. A sound path connects the volume extension and a partial volume enclosed between MEMS chip and substrate.
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公开(公告)号：EP3347985A1
公开(公告)日：2018-07-18
申请号：EP15759808.7
申请日：2015-09-07
申请人： TDK Corporation
CPC分类号： H03G3/3026 , H03F3/183 , H03F2200/03 , H03G3/301 , H03G5/16 , H04R1/04 , H04R3/00 , H04R2410/00
摘要： The present invention relates to an integrated circuit comprising at least one supply voltage terminal (262) configured to receive a supply voltage for operation of the integrated circuit, at least one input terminal (122, 124) configured to receive an analog input signal corresponding to an audio signal, and at least one output terminal (132, 134) configured to provide an analog output signal. The integrated circuit further comprises a signal strength detector configured to detect the signal strength of the analog input signal. The integrated circuit is configured to amplify the audio signal based on the detected signal strength and to output a corresponding amplified signal at the at least one output terminal (132, 134), and a signaling circuit configured to indicate an amplification setting of the integrated circuit at the at least one output terminal (132, 134) . The invention further relates to a circuit assembly (100, 300) comprising a signal source (110), a signal processing device (190, 390) and an amplification circuit and a method for operating such a circuit assembly (100, 300).
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