WIRELESS DEVICES INCLUDING PRINTED INTEGRATED CIRCUITRY AND METHODS FOR MANUFACTURING AND USING THE SAME
    3.
    发明公开
    WIRELESS DEVICES INCLUDING PRINTED INTEGRATED CIRCUITRY AND METHODS FOR MANUFACTURING AND USING THE SAME 审中-公开
    具有集成印刷电路和无线设备用于生产

    公开(公告)号:EP2201546A4

    公开(公告)日:2016-06-22

    申请号:EP08838217

    申请日:2008-10-10

    IPC分类号: G08B13/14 G06K19/077

    摘要: Printed integrated circuitry and attached antenna and/or inductor for sensors, electronic article surveillance (EAS), radio frequency (RF) and/or RF identification (RFID) tags and devices, and methods for its manufacture. The tag generally includes printed integrated circuitry on one carrier and an antenna and/or inductor on another carrier, the integrated circuitry being electrically coupled to the antenna and/or inductor. The method of manufacture generally includes of printing an integrated circuit having a plurality of first pads on a carrier, forming an antenna and/or inductor having a plurality of second pads on a substrate, and attaching at least two of the first pads of the printed integrated circuit to corresponding second pads of the antenna and/or inductor. The present invention advantageously provides a low cost RFID tag capable of operating at MHz frequencies that can be manufactured in a shorter time period than conventional RFID tags that manufacture all active electrical devices on a conventional wafer.

    摘要翻译: 印刷集成电路和连接天线和/或电感器用于传感器,电子物品监视(EAS),射频(RF)和/或射频识别(RFID)标签和设备,以及用于其制造的方法。 标记基因集会包括印在一个载波上的集成电路和天线和/或电感器的另一载波上,集成电路被电耦合到所述天线和/或电感器。 制造基因集会的方法包括在具有第一焊垫的载体上的多个集成电路的印刷,天线和/或电感器的形成具有在基片的第二焊盘的多个,并且将至少两个印刷的所述第一焊盘 集成电路对应的天线和/或电感器的第二焊盘。 本发明有利地提供一种低成本的RFID标签能够以兆赫频率下工作的的并可以在更短的时间段来制造比传统的RFID标签那样制造的常规晶片上的所有有源电子设备。