公开(公告)号：EP1863046A1

公开(公告)日：2007-12-05

申请号：EP06729485.0

申请日：2006-03-20

申请人： TOKYO ELECTRON LIMITED ,  OCTEC INC.

发明人： HAYASHI, Masato ,  YAKABE, Masami ,  HASEBE, Tetsuya ,  HARADA, Muneo ,  OKUMURA, Katsuya

IPC分类号： H01H1/26 ,  B81B3/00 ,  B81B7/04

CPC分类号： H01H1/0036 ,  B81B3/0054 ,  B81B2201/014 ,  B81B2203/053 ,  H01H1/24 ,  H01H37/46 ,  H01H67/22 ,  H01H2001/0042 ,  H01H2037/008

摘要： A first wiring layer 16 is disposed on an insulating film 14 on the lower surface of an upper substrate 15, while a second wiring layer 13 three-dimensionally crossing the first wiring layer 16 is provided on the insulating film 12 on a lower substrate 11. A cantilever 17 has one end connected to the first wiring layer 16 and the other end opposed to the second wiring layer 13 with a space therebetween. A thermoplastic sheet 19 is arranged on the upper substrate 15 so as to cover the through-hole 18. The thermoplastic sheet 19 is pressed by a heated pin 20 against the cantilever 17 and deformed so as to maintain the connection between the cantilever 17 and the second wiring layer 13, and therefore close the switch 10.

摘要翻译： 第一布线层16设置在上基板15的下表面上的绝缘膜14上，而在第一布线层16上三维交叉的第二布线层13设置在下基板11上的绝缘膜12上。 悬臂17的一端与第一配线层16连接，另一端与第二配线层13相对置，其间具有间隔。 热塑性片19布置在上基板15上以覆盖通孔18.热塑片19被加热销20压靠在悬臂17上并变形，从而保持悬臂17和 第二布线层13，因此关闭开关10。