公开(公告)号：EP1859917A3

公开(公告)日：2008-05-28

申请号：EP07108403.2

申请日：2007-05-17

申请人： TOKYO SEIMITSU CO., LTD.

发明人： Kawashima, Isamu ,  Sato, Hideshi ,  Kino, Hideo ,  Ametani, Minoru

IPC分类号： B29C63/02

CPC分类号： B29C63/02 ,  B29C63/0004 ,  B29L2031/3425 ,  B65H37/002 ,  Y10T156/10 ,  Y10T156/1705 ,  Y10T156/1712 ,  Y10T156/1734

摘要： A tape adhering device (10) comprises: a drawing roller (42) for drawing out a tape (3) ; a tape fixing means (47) for fixing one portion of the tape drawn out from the drawing roller; a tape drawing means (62) for drawing out a predetermined amount of tape, which is fixed by the tape fixing means, from the drawing roller between the tape fixing means and the drawing roller; and a tape adhering means (49, 31, 37) for adhering the tape, which is located in the downstream of the tape fixing means, onto an object to be adhered (20, 36) under the condition that fixing operation of the tape by the tape fixing means is released. It is preferable that the length of the tape drawn out by the tape drawing means is not less than the diameter of the object to be adhered. Due to the foregoing, it is possible to prevent wrinkles from being form on the tape at the time of adhering the tape.

公开(公告)号：EP1858060A1

公开(公告)日：2007-11-21

申请号：EP07108402.4

申请日：2007-05-17

申请人： TOKYO SEIMITSU CO., LTD.

发明人： Kawashima, Isamu ,  Sato, Hideshi ,  Kino, Hideo ,  Ametani, Minoru

IPC分类号： H01L21/00 ,  B29C63/00

CPC分类号： H01L21/67132 ,  B29C63/0013 ,  Y10T156/1168 ,  Y10T156/1978

摘要： A film peeling device for peeling a film (11) adhered to a front surface of a wafer (20), on the back surface of which a dicing tape (3) is adhered, the wafer is integrated with a mount frame (36) into one body, comprises: a movable table (31), which can be moved horizontally to support the wafer and the mount frame while the surface protection film is being directed upward; a covering means (80) for covering an adhesive face (3a) of the dicing tape, which is exposed between the mount frame and the wafer at one end (28) of the wafer; and a adhering means (46) for adhering a peeling tape (4) to the film at the end of the wafer. The film is peeled from the front surface of the wafer by moving the movable table from the other end (29) of the wafer to one end after the peeling tape has adhered. Due to the foregoing, while the peeling tape is being prevented from adhering to the dicing tape, the film can be peeled from the front surface of the wafer in a shorter period of time.

摘要翻译： 用于剥离附着于哪个的背表面上的晶片（20）的前表面上的膜（11）一种薄膜剥离装置的切割带（3）附着，将晶片用的安装架（36）集成到 一个主体，包括：一可移动台（31），它可以水平地移动到支撑晶片和所述安装框架而表面保护膜被朝向上方; 一个被安装框架，在晶片中的一个（28）在晶片之间露出覆盖装置（80）用于覆盖所述切割带的粘合面（3a）的端部，所有; 以及用于在晶片的端部粘附剥离带（4）膜中的粘合装置（46）。 将膜从晶片的前表面通过从晶片的另一端（29）移动所述可动台到一个端部的剥离胶带附着后剥离。 由于上述原因，而将剥离用带被粘附到切割胶带阻止，该膜可以从在一个较短的时间周期在晶片的前表面剥离。

公开(公告)号：EP1855314A1

公开(公告)日：2007-11-14

申请号：EP07107488.4

申请日：2007-05-04

申请人： TOKYO SEIMITSU CO., LTD.

发明人： Kawashima, Isamu ,  Sato, Hideshi ,  Kino, Hideo ,  Ametani, Minoru

IPC分类号： H01L21/677 ,  B65G49/07

CPC分类号： H01L21/67769

摘要： A cassette conveyance apparatus (10) includes: a first conveyance means (20) for conveying a first cassette (40) in a horizontal and vertical direction; and a second conveyance means (30) for conveying a second cassette (50) in a horizontal and vertical direction . In the cassette conveyance apparatus (10), the first and second cassettes are circulated between a predetermined wafer accommodation position (P1), at which a wafer (2) is accommodated in the cassette, and a predetermined cassette replacement position (P0) at which a cassette accommodating a plurality of wafers is replaced with an empty cassette. Due to the foregoing, the wafers are continuously accommodated in the cassette without stopping an operation of a pretreatment step.

摘要翻译： 盒输送装置（10）包括：用于在水平和垂直方向上输送第一盒（40）的第一输送装置（20） 以及用于在水平和垂直方向上输送第二盒（50）的第二传送装置（30）。 在盒输送装置（10）中，第一和第二盒在预定的晶片容纳位置（P1）和晶片（2）容纳在盒中的预定的晶片容纳位置（P1）和预定的盒更换位置（P0）之间循环， 容纳多个晶片的盒被空盒替换。 由于上述原因，晶片被连续地容纳在盒中，而不停止预处理步骤的操作。

公开(公告)号：EP1859917A2

公开(公告)日：2007-11-28

申请号：EP07108403.2

申请日：2007-05-17

申请人： TOKYO SEIMITSU CO., LTD.

发明人： Kawashima, Isamu ,  Sato, Hideshi ,  Kino, Hideo ,  Ametani, Minoru

IPC分类号： B29C63/02

CPC分类号： B29C63/02 ,  B29C63/0004 ,  B29L2031/3425 ,  B65H37/002 ,  Y10T156/10 ,  Y10T156/1705 ,  Y10T156/1712 ,  Y10T156/1734

摘要： A tape adhering device (10) comprises: a drawing roller (42) for drawing out a tape (3) ; a tape fixing means (47) for fixing one portion of the tape drawn out from the drawing roller; a tape drawing means (62) for drawing out a predetermined amount of tape, which is fixed by the tape fixing means, from the drawing roller between the tape fixing means and the drawing roller; and a tape adhering means (49, 31, 37) for adhering the tape, which is located in the downstream of the tape fixing means, onto an object to be adhered (20, 36) under the condition that fixing operation of the tape by the tape fixing means is released. It is preferable that the length of the tape drawn out by the tape drawing means is not less than the diameter of the object to be adhered. Due to the foregoing, it is possible to prevent wrinkles from being form on the tape at the time of adhering the tape.

摘要翻译： 胶带粘接装置（10）包括：用于拉出带（3）的拉丝辊（42）; 用于固定从拉丝辊拉出的一部分带的胶带固定装置（47）; 用于从带固定装置和牵引辊之间的拉丝辊中抽出预定量的由胶带固定装置固定的胶带的胶带拉伸装置; 以及用于将位于带固定装置的下游的胶带粘附到待粘合物体（20,36）上的条带粘合装置（49,31,37），在条带的固定操作 磁带固定装置被释放。 由带拉伸装置引出的带的长度最好不小于被粘物的直径。 由于上述原因，可以防止在胶带粘附时在带上形成褶皱。