LIGHT EMITTING DEVICE
    2.
    发明公开
    LIGHT EMITTING DEVICE 审中-公开
    发光装置

    公开(公告)号:EP3032594A1

    公开(公告)日:2016-06-15

    申请号:EP14834996.2

    申请日:2014-08-08

    IPC分类号: H01L33/50 H01L33/64

    摘要: Provided is a light emitting device which is suitable for a lighting apparatus, such as a projector, requiring high brightness and high light intensity exhibits little change in light emission colour and a low reduction in light emission intensity during usage, and uses a remote phosphor. According to one embodiment of the present invention, the light emitting device (10) has: an LED element (12); a side wall (13) which surrounds the LED element (12); a phosphor layer (15) which is fixed to the side wall (13) with an adhesive layer (14) therebetween, and is positioned above the LED element (12); and a metal pad (11) as a heat dissipating member. The side wall (13) has: an insulating base (13b) which surrounds the LED element (12); and a metal layer (13a) which is formed on a side surface at the LED element (12) side of the base (13b), and is in contact with the metal pad (11) and the adhesive layer (14). The adhesive layer (14) is: a resin layer that comprises a resin containing particles which have higher thermal conductivity than the resin; or a layer that comprises solder.

    摘要翻译: 本发明提供一种发光装置,其适用于投影机等需要高亮度且高光量的照明装置,发光颜色的变化少,使用时的发光强度的降低少,并且使用远程荧光体。 根据本发明的一个实施例,发光器件(10)具有:LED元件(12); 围绕LED元件(12)的侧壁(13); 荧光体层(15),其通过粘合层(14)固定在侧壁(13)上,并位于LED元件(12)的上方; 和作为散热构件的金属垫(11)。 侧壁(13)具有:围绕LED元件(12)的绝缘基座(13b); 以及形成在基体(13b)的LED元件(12)侧的侧面上并与金属焊盘(11)和粘合剂层(14)接触的金属层(13a)。 粘合剂层(14)是包含树脂的树脂层,所述树脂含有比树脂具有更高导热率的颗粒; 或包含焊料的层。