公开(公告)号：EP4164982A1

公开(公告)日：2023-04-19

申请号：EP21735338.2

申请日：2021-06-16

申请人： Teknologian Tutkimuskeskus VTT OY

发明人： KEMPPINEN, Antti ,  NISSILÄ, Jaani ,  VIHERIÄLÄ, Jukka ,  GOVENIUS, Joonas

IPC分类号： B82Y20/00 ,  G02B6/122 ,  G02F1/31 ,  G06F1/00 ,  G02B27/28 ,  G02F2/02 ,  G01R31/3185 ,  G02F1/09 ,  G02F1/00 ,  G02F1/37 ,  H01S3/00 ,  G06N10/00 ,  G02B5/30 ,  G01N21/19

公开(公告)号：EP4298669A1

公开(公告)日：2024-01-03

申请号：EP22712011.0

申请日：2022-02-17

申请人： Teknologian Tutkimuskeskus VTT OY

发明人： LEHTINEN, Janne ,  KEMPPINEN, Antti ,  MYKKÄNEN, Emma ,  PRUNNILA, Mika ,  RONZANI, Alberto

IPC分类号： H01L23/552 ,  B82Y10/00 ,  G06N10/00 ,  H01L35/32 ,  H01L23/38 ,  H01L29/66

公开(公告)号：EP4373233A2

公开(公告)日：2024-05-22

申请号：EP24168258.2

申请日：2022-02-18

申请人： Teknologian Tutkimuskeskus VTT OY

发明人： PRUNNILA, Mika ,  RONZANI, Alberto ,  MYKKÄNEN, Emma ,  KEMPPINEN, Antti ,  LEHTINEN, Janne

IPC分类号： H05K7/20

CPC分类号： F28F2013/00620130101 ,  H05K7/20481 ,  H05K7/20372 ,  H01L23/3738

摘要： An inventive embodiment comprises a thermalization arrangement at cryogenic temperatures. The arrangement comprises a dielectric substrate (2) layer on which substrate a device/s or component/s (1) are positionable. A heat sink component (4) is attached on another side of the substrate. The arrangement further comprises a conductive layer (5) between the substrate layer (2) and the heat sink component (4). A joint between the substrate layer (2) and the conductive layer (5) has minimal thermal boundary resistance. Another joint between the conductive layer (5) and the cooling heat sink layer (4) is electrically conductive.

公开(公告)号：EP4298874A1

公开(公告)日：2024-01-03

申请号：EP22706338.5

申请日：2022-02-18

申请人： Teknologian Tutkimuskeskus VTT OY

发明人： PRUNNILA, Mika ,  RONZANI, Alberto ,  MYKKÄNEN, Emma ,  KEMPPINEN, Antti ,  LEHTINEN, Janne

IPC分类号： H05K7/20

公开(公告)号：EP4373233A3

公开(公告)日：2024-08-14

申请号：EP24168258.2

申请日：2022-02-18

申请人： Teknologian Tutkimuskeskus VTT OY

发明人： PRUNNILA, Mika ,  RONZANI, Alberto ,  MYKKÄNEN, Emma ,  KEMPPINEN, Antti ,  LEHTINEN, Janne

IPC分类号： H05K7/20

CPC分类号： F28F2013/00620130101 ,  H05K7/20481 ,  H05K7/20372 ,  H01L23/3738

摘要： An inventive embodiment comprises a thermalization arrangement at cryogenic temperatures. The arrangement comprises a dielectric substrate (2) layer on which substrate a device/s or component/s (1) are positionable. A heat sink component (4) is attached on another side of the substrate. The arrangement further comprises a conductive layer (5) between the substrate layer (2) and the heat sink component (4). A joint between the substrate layer (2) and the conductive layer (5) has minimal thermal boundary resistance. Another joint between the conductive layer (5) and the cooling heat sink layer (4) is electrically conductive.

公开(公告)号：EP4165779A1

公开(公告)日：2023-04-19

申请号：EP21735337.4

申请日：2021-06-16

申请人： Teknologian Tutkimuskeskus VTT OY

发明人： NISSILÄ, Jaani ,  KEMPPINEN, Antti

IPC分类号： H03K3/38 ,  H03K3/42