RSIM STAND ALONE MANUFACTURING WITH LAMINATION AND WITHOUT INDEXATION

    公开(公告)号:EP4276689A1

    公开(公告)日:2023-11-15

    申请号:EP22305720.9

    申请日:2022-05-13

    IPC分类号: G06K19/077

    摘要: A method of producing a smart card (1) such as a SIM card extending along an extension direction (E) comprises the steps of providing at least one reel tape (2) extending along a longitudinal direction (L), and providing a plurality of electronic chips (3) on the reel tape (2). The reel tape (2) comprises at least one electrically conductive layer (4) and at least one dielectric layer (5). The electronic chips (3) are in connection with the electrically conductive layer (4) of the reel tape (2). The method further comprises the step of laminating at least one card body layer (6) to the reel tape (2). The card body layer (6) extends entirely across the electronic chips (3) when seen along the longitudinal direction (L).

    RSIM STAND ALONE MANUFACTURING AT MICROELECTRONIC STEP

    公开(公告)号:EP4276687A1

    公开(公告)日:2023-11-15

    申请号:EP22305718.3

    申请日:2022-05-13

    IPC分类号: G06K19/077

    摘要: A method of manufacturing a smart card (1) such as a SIM card extending along an extension direction (E) comprises the steps of providing at least one reel tape (2) extending along a longitudinal direction (L), and providing a plurality of electronic chips (3) on the reel tape (2). The reel tape (2) comprises at least one electrically conductive layer (4) and at least one dielectric layer (5). The electronic chips (3) are in connection with the electrically conductive layer (4) of the reel tape (2). The method further comprises the step of laminating at least a first card body layer in reel (7) to the reel tape (2) and laminating at least a second card body layer in reel (8) to the first card body layer (7). The first card body layer (7) at least partially embeds the electronic chips (3), and the second card body layer (8) covers the electronic chips (3) towards an outside.

    SIM ON MODULE REEL MANUFACTURING PROCESS
    3.
    发明公开

    公开(公告)号:EP4276688A1

    公开(公告)日:2023-11-15

    申请号:EP22305719.1

    申请日:2022-05-13

    IPC分类号: G06K19/077

    摘要: A method of manufacturing a smart card (1) such as a SIM card comprises the steps of providing at least one reel tape (2) extending along a longitudinal direction (L) and laminating at least a first card body layer (5) to the reel tape (2). The reel tape (2) comprises at least one electrically conductive layer (3) and at least one dielectric layer (4). The first card body layer (5) comprises a plurality of apertures (6, 6a, ...). The apertures (6, 6a, ...) are configured to at least partially receive a plurality of electronic chips (7, 7a, ...).