公开(公告)号：EP4281904A1

公开(公告)日：2023-11-29

申请号：EP22704309.8

申请日：2022-01-21

申请人： THALES DIS FRANCE SAS

发明人： OTTOBON, Stéphane ,  DOSSETTO, Lucile ,  LELOUP, Laurent

IPC分类号： G06K19/077

公开(公告)号：EP4276689A1

公开(公告)日：2023-11-15

申请号：EP22305720.9

申请日：2022-05-13

申请人： Thales Dis France SAS

发明人： DOSSETTO, Lucile ,  OTTOBON, Stéphane ,  AUDOUARD, Laurent ,  ROBERTET, Laurence

IPC分类号： G06K19/077

摘要： A method of producing a smart card (1) such as a SIM card extending along an extension direction (E) comprises the steps of providing at least one reel tape (2) extending along a longitudinal direction (L), and providing a plurality of electronic chips (3) on the reel tape (2). The reel tape (2) comprises at least one electrically conductive layer (4) and at least one dielectric layer (5). The electronic chips (3) are in connection with the electrically conductive layer (4) of the reel tape (2). The method further comprises the step of laminating at least one card body layer (6) to the reel tape (2). The card body layer (6) extends entirely across the electronic chips (3) when seen along the longitudinal direction (L).

公开(公告)号：EP4174719A1

公开(公告)日：2023-05-03

申请号：EP21306492.6

申请日：2021-10-26

申请人： Thales Dis France SAS

发明人： BYRNE, David ,  DOSSETTO, Lucile ,  OTTOBON, Stéphane ,  SEBAN, Frédérick

IPC分类号： G06K19/077 ,  G06K19/02

摘要： A contactless electronic module (1) for a data carrier (2) comprises a substrate (3), at least one electronic chip (4), and at least one electrical connector (5). The electronic chip (4) is arranged on the substrate (3), and the electrical connector (5) is in connection with the electronic chip (4). The substrate (3) is electrically non-conductive.

公开(公告)号：EP4276687A1

公开(公告)日：2023-11-15

申请号：EP22305718.3

申请日：2022-05-13

申请人： Thales Dis France SAS

发明人： DOSSETTO, Lucile ,  OTTOBON, Stéphane ,  AUDOUARD, Laurent ,  ROBERTET, Laurence

IPC分类号： G06K19/077

摘要： A method of manufacturing a smart card (1) such as a SIM card extending along an extension direction (E) comprises the steps of providing at least one reel tape (2) extending along a longitudinal direction (L), and providing a plurality of electronic chips (3) on the reel tape (2). The reel tape (2) comprises at least one electrically conductive layer (4) and at least one dielectric layer (5). The electronic chips (3) are in connection with the electrically conductive layer (4) of the reel tape (2). The method further comprises the step of laminating at least a first card body layer in reel (7) to the reel tape (2) and laminating at least a second card body layer in reel (8) to the first card body layer (7). The first card body layer (7) at least partially embeds the electronic chips (3), and the second card body layer (8) covers the electronic chips (3) towards an outside.

公开(公告)号：EP4423667A1

公开(公告)日：2024-09-04

申请号：EP22803302.3

申请日：2022-10-21

申请人： THALES DIS FRANCE SAS

发明人： BYRNE, David ,  DOSSETTO, Lucile ,  OTTOBON, Stéphane ,  SEBAN, Frédérick

IPC分类号： G06K19/077 ,  G06K19/02

CPC分类号： G06K19/07718 ,  G06K19/07749 ,  G06K19/025 ,  G06K19/07747 ,  G06K19/0775

公开(公告)号：EP4276688A1

公开(公告)日：2023-11-15

申请号：EP22305719.1

申请日：2022-05-13

申请人： Thales Dis France SAS

发明人： DOSSETTO, Lucile ,  OTTOBON, Stéphane ,  AUDOUARD, Laurent ,  ROBERTET, Laurence

IPC分类号： G06K19/077

摘要： A method of manufacturing a smart card (1) such as a SIM card comprises the steps of providing at least one reel tape (2) extending along a longitudinal direction (L) and laminating at least a first card body layer (5) to the reel tape (2). The reel tape (2) comprises at least one electrically conductive layer (3) and at least one dielectric layer (4). The first card body layer (5) comprises a plurality of apertures (6, 6a, ...). The apertures (6, 6a, ...) are configured to at least partially receive a plurality of electronic chips (7, 7a, ...).