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公开(公告)号：EP4174719A1
公开(公告)日：2023-05-03
申请号：EP21306492.6
申请日：2021-10-26
IPC分类号： G06K19/077 , G06K19/02
摘要： A contactless electronic module (1) for a data carrier (2) comprises a substrate (3), at least one electronic chip (4), and at least one electrical connector (5). The electronic chip (4) is arranged on the substrate (3), and the electrical connector (5) is in connection with the electronic chip (4). The substrate (3) is electrically non-conductive.
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公开(公告)号：EP4342681A1
公开(公告)日：2024-03-27
申请号：EP22306409.8
申请日：2022-09-23
发明人： GASPARI, Sebastien , WADELL, Daniel , ODDOU, Laurent , SEBAN, Frédérick , SUBRA, Sébastien , ANDREO, Benjamin
IPC分类号： B42D25/00 , B42D25/351 , B42D15/02 , G06K19/077 , G06K19/07
摘要： A data carrier (1) for a secure article comprises a carrier body (2) defining an extension direction (E), and at least one light emitting element (4) being arranged in the carrier body (2). The carrier body (2) comprises at least one light guiding element (3). The light emitting element (4) is at least partially and preferably entirely arranged in the light guiding element (3). The light guiding element (3) is configured to guide light being emitted from the light emitting element (4) within the light guiding element (3) and along a transverse direction (T) extending perpendicularly to the extension direction (E).
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公开(公告)号：EP4260233A1
公开(公告)日：2023-10-18
申请号：EP21836108.7
申请日：2021-12-10
发明人： SUBRA, Sébastien , SEBAN, Frédérick
IPC分类号： G06K19/02 , G06K19/077
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公开(公告)号：EP4167131A1
公开(公告)日：2023-04-19
申请号：EP21306450.4
申请日：2021-10-15
IPC分类号： G06K19/077 , G06K19/02
摘要： A data carrier (1) comprises at least one carrier body (2), at least one electronic module (3), at least one antenna (4), and at least one metallic layer (5). The electronic module (3) is at least partially arranged in the carrier body (2). The antenna (4) is in connection with the electronic module (3). The metallic layer (5) comprises at least one recess (6), and the antenna (4) comprises an electrically conducting wire (7) that is at least partially arranged in the recess (6). At least part of the metallic layer (5) is part of the antenna (4).
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公开(公告)号：EP4028945A1
公开(公告)日：2022-07-20
申请号：EP20765312.2
申请日：2020-09-08
发明人： MENDEZ, Lucile , SEBAN, Frédérick , COLOMBARD, Claude , BUYUKKALENDER, Arek , MERIDIANO, Jean-Luc
IPC分类号： G06K19/077
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公开(公告)号：EP4423667A1
公开(公告)日：2024-09-04
申请号：EP22803302.3
申请日：2022-10-21
IPC分类号： G06K19/077 , G06K19/02
CPC分类号： G06K19/07718 , G06K19/07749 , G06K19/025 , G06K19/07747 , G06K19/0775
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7.发明公开
公开(公告)号：EP4070241A1
公开(公告)日：2022-10-12
申请号：EP20808484.8
申请日：2020-11-25
发明人： SUBRA, Sébastien , SEBAN, Frédérick , CHOO, Yeow Chun Ricky , BAJOLLE, Antoine , TIBILETTI, Lucie , COLOMBARD, Claude
IPC分类号： G06K19/077
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公开(公告)号：EP4380066A1
公开(公告)日：2024-06-05
申请号：EP22306753.9
申请日：2022-11-29
CPC分类号： G06K19/0726 , H04B5/24 , H04B5/43
摘要： A media card (200 or 300) with an tunable inductive antenna pattern (203) includes an area (204) configured for receiving a wireless chip (306a, 306b, or 306d) operating at one of several given frequencies and an antenna with an antenna pattern printed on a core layer (202) and printed on the area configured for receiving the wireless chip, where the antenna pattern includes one or more selectable conductive extension segments (206a-206g). In some embodiments, the one or more selectable conductive extension segments are selectively removed to tune the antenna for a frequency for the wireless chip operating at one of several given or predetermined frequencies.
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公开(公告)号：EP4379601A1
公开(公告)日：2024-06-05
申请号：EP22306752.1
申请日：2022-11-29
IPC分类号： G06K19/077
CPC分类号： G06K19/07749
摘要： A card (200) having processed areas includes a core layer (104), an antenna pattern (102) on the core layer, and one or more bump-out areas (110) of the antenna pattern having a threshold distance towards a process boundary, where the card passes a continuity test if a cutting or a punching or a milling process fails to create an open circuit at the bump-out areas. The card fails a continuity test if the cutting or the punching or the milling processes creates the open circuit at the bump-out areas.
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