公开(公告)号：EP2319960A1

公开(公告)日：2011-05-11

申请号：EP09800406.2

申请日：2009-07-22

申请人： The Furukawa Electric Co., Ltd. ,  Nippon Steel Chemical Co., Ltd.

发明人： FUJISAWA, Satoshi ,  SUZUKI, Yuji ,  UNO, Takeo ,  HATTORI, Koichi ,  KUWASAKI, Naoya

IPC分类号： C25D7/06 ,  B32B15/08 ,  B32B15/088 ,  H05K1/03 ,  H05K1/09

CPC分类号： H05K3/384 ,  B32B15/08 ,  B32B15/20 ,  C25D1/04 ,  C25D3/562 ,  C25D3/565 ,  C25D5/48 ,  C25D7/0614 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/389 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12549 ,  Y10T428/12569 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12944 ,  Y10T428/31663 ,  Y10T428/31681

摘要： In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni-Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni-Zn alloy is 6% or more and 15% or less of the (Ni deposition amount + Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm 2 or more to provide a flexible cupper clad laminate.

摘要翻译： 为了提供一种使用表面处理铜箔的柔性层叠电路板，其在铜箔上形成的柔性层叠电路板中，该表面处理铜箔在聚酰亚胺，耐酸性和蚀刻性方面满足铜箔的全部接合强度 铜箔是通过在未处理的铜箔的至少一个表面上沉积Ni-Zn合金形成的表面处理铜箔，并且沉积的Ni-Zn合金中的Zn沉积量为6％ （Ni沉积量+ Zn沉积量）以上且15％以下，Zn沉积量为0.08mg / dm 2以上，提供柔性的铜包覆层压体。

公开(公告)号：EP2200056A1

公开(公告)日：2010-06-23

申请号：EP08833392.7

申请日：2008-09-25

申请人： The Furukawa Electric Co., Ltd.

发明人： TOKUHARA, Naofumi ,  OHNO, Masato ,  UNO, Takeo

IPC分类号： H01H1/04 ,  C25D5/10 ,  C25D5/12 ,  C25D5/26 ,  C25D7/00 ,  H01H11/04

CPC分类号： H01H1/021 ,  C25D5/10 ,  C25D5/12 ,  C25D5/34 ,  C25D7/0614 ,  H01H1/023 ,  H01H2227/022 ,  Y10T428/12646 ,  Y10T428/12882 ,  Y10T428/12896

摘要： A silver-coated composite material for movable contact 100 includes a base material 110 composed of an alloy whose main component is iron or nickel, an under layer 120 which is formed at least on part of the surface of the base material and which is composed of any one of nickel, cobalt, nickel alloy and cobalt alloy, an intermediate layer 130 which is formed on the under layer and which is composed of copper or copper alloy and an outermost layer 140 which is formed on the intermediate layer and which is composed of silver or silver alloy, and is characterized in that a total thickness of the under layer 120 and the intermediate layer 130 falls within a range more than 0.025 µm and less than 0.20 µm.

摘要翻译： 用于可移动触点100的银涂复合材料包括由主要成分为铁或镍的合金构成的基底材料110，形成在基材表面的至少一部分上的底层120， 镍，钴，镍合金和钴合金中的任一种，形成在下层上并由铜或铜合金构成的中间层130和形成在中间层上的最外层140，其由 银或银合金，其特征在于，底层120和中间层130的总厚度在大于0.025μm且小于0.20μm的范围内。

公开(公告)号：EP2312022A1

公开(公告)日：2011-04-20

申请号：EP09800407.0

申请日：2009-07-22

申请人： The Furukawa Electric Co., Ltd.

发明人： FUJISAWA, Satoshi ,  SUZUKI, Yuji ,  UNO, Takeo

IPC分类号： C25D7/06 ,  B32B15/01 ,  B32B15/088 ,  H05K1/09

CPC分类号： H05K3/384 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  B32B27/281 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2307/20 ,  B32B2307/306 ,  B32B2307/50 ,  B32B2307/538 ,  B32B2307/714 ,  B32B2457/08 ,  C22C19/03 ,  C25D3/562 ,  C25D7/0614 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2203/0723 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12569 ,  Y10T428/12882 ,  Y10T428/1291 ,  Y10T428/12944 ,  Y10T428/12993

摘要： To provide a surface treated copper foil satisfying all of the bonding strength to polyimide film, chemical resistance, and etching property, and to provide a CCL using the surface treated copper foil, a surface treated copper foil is formed being comprising an untreated copper foil on at least one surface of which Ni-Zn alloy is deposited, wherein Zn content (wt%) = Zn deposition amount/(Ni deposition amount + Zn deposition amount) x 100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm 2 or more, or, a CCL is formed being comprising a surface treated copper foil and a polyimide film laminated on the surface treated copper foil, wherein the surface treated copper foil comprises an untreated copper foil on at least one surface of which Ni-Zn alloy is deposited, Zn content (wt%) = Zn deposition amount/(Ni deposition amount + Zn deposition amount) x 100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm 2 or more.

摘要翻译： 为了提供满足与聚酰亚胺膜的全部接合强度的表面处理铜箔，耐化学性和蚀刻性能，并且使用表面处理铜箔提供CCL，形成表面处理铜箔，其包含未处理的铜箔 其中沉积Ni-Zn合金的至少一个表面，其中Zn含量（wt％）= Zn沉积量/（Ni沉积量+ Zn沉积量）×100为6％以上且15％以下，Zn沉积 量为0.08mg / dm 2以上，或者由表面处理铜箔和层叠在表面处理铜箔上的聚酰亚胺膜形成CCL，其中表面处理铜箔包含至少一个未处理的铜箔 表面沉积有Ni-Zn合金，Zn含量（wt％）= Zn沉积量/（Ni沉积量+ Zn沉积量）×100为6％以上且15％以下，Zn沉积量为0.08mg / dm 2以上。

公开(公告)号：EP2157668A1

公开(公告)日：2010-02-24

申请号：EP08739527.3

申请日：2008-03-31

申请人： The Furukawa Electric Co., Ltd.

发明人： YOSHIDA, Kazuo ,  SUSAI, Kyota ,  UNO, Takeo ,  KITAGAWA, Shuichi

IPC分类号： H01R13/03 ,  C25D5/12 ,  C25D5/50 ,  C25D7/00

CPC分类号： H01R13/03 ,  C25D3/30 ,  C25D3/38 ,  C25D5/10 ,  C25D5/50 ,  C25D7/00 ,  H01R13/04 ,  H01R13/113 ,  H01R43/16 ,  Y10T428/12458 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722

摘要： A connector including a male terminal and a female terminal, at least the contact point part of at least one of the terminals having an outermost layer made of a metallic material which is a Cu-Sn alloy layer in which the copper concentration gradually decreases toward the surface. Also provided is a metallic material which is for use in this connector and includes an outermost layer constituted of a Cu-Sn alloy layer in which the copper concentration gradually decreases toward the surface.

摘要翻译： 一种连接器，其包括阳端子和阴端子，至少一个端子的接触点部分具有由金属材料制成的最外层，所述最外层是Cu-Sn合金层，其中铜浓度逐渐朝向 表面。 还提供了用于该连接器中的金属材料，并且包括由铜浓度朝向表面逐渐减小的Cu-Sn合金层构成的最外层。

公开(公告)号：EP2202326A1

公开(公告)日：2010-06-30

申请号：EP08836473.2

申请日：2008-10-02

申请人： The Furukawa Electric Co., Ltd.

发明人： MIHARA, Kuniteru ,  NAKANO, Junsuke ,  SUGAHARA, Chikahito ,  UNO, Takeo

IPC分类号： C22C9/06 ,  H01L23/48 ,  C22F1/00 ,  C22F1/08

CPC分类号： C22C9/06 ,  C22F1/08 ,  H01L23/13 ,  H01L23/14 ,  H01L23/49579 ,  H01L2924/0002 ,  Y10T428/12993 ,  H01L2924/00

摘要： An copper alloy strip material for electrical/electronic components according to the present invention is characterized in that such the copper alloy strip material for electrical/electronic components includes: Ni as between 1.5 mass% and 4.0 mass%; Si as between 0.3 mass% and 1.5 mass%; and the balance being Cu and unavoidable impurities, wherein a mean roughness Ra of a surface roughness is not larger than 0.3 µm regarding the strip in a direction as right angle to a direction of a rolling therefor, a maximum height Ry thereof is not higher than 3.0 µm regarding the same therein, and there is positioned a peak position regarding a frequency curve, that represents a concave component of the surface roughness and/or a convex component thereof, at the plus side (the side for the convex component) comparing to an average value of the curve for meaning the surface roughness.

摘要翻译： 根据本发明的用于电气/电子部件的铜合金带材的特征在于，这种用于电气/电子部件的铜合金带材包括：Ni在1.5质量％至4.0质量％之间; Si在0.3质量％至1.5质量％之间; 余量为Cu和不可避免的杂质，其中表面粗糙度的平均粗糙度Ra相对于与其滚动方向成直角的方向关于条带不大于0.3μm，其最大高度Ry不高于 相对于3.0μm，并且在正侧（凸组件侧）相对于频率曲线定位峰值位置，该频率曲线表示表面粗糙度的凹部分和/或其凸部分，与 用于表示表面粗糙度的曲线的平均值。

公开(公告)号：EP2169093A1

公开(公告)日：2010-03-31

申请号：EP08776990.7

申请日：2008-05-29

申请人： The Furukawa Electric Co., Ltd.

发明人： YOSHIDA, Kazuo ,  SUSAI, Kyota ,  UNO, Takeo ,  KITAGAWA, Shuichi ,  MITOSE, Kengo

IPC分类号： C25D7/00 ,  C25D5/12 ,  C25D5/50 ,  H01R13/03

CPC分类号： H01R13/03 ,  C25D5/12 ,  C25D5/50 ,  C25D5/505 ,  C25D7/00 ,  Y10T428/12458

摘要： The invention provides a metallic material for electric /electronic component in which a CU-Sun alloy layer (2) is provided on a conductive base (1), wherein Cu concentration of the Cu-Sn alloy layer gradually decreases from the base side to the surface (3) side.

摘要翻译： 本发明提供一种用于电气/电子部件的金属材料，其中在导电性基体（1）上设置有Cu-Sun合金层（2），其中Cu-Sn合金层的Cu浓度从基底侧逐渐减小到 表面（3）侧。