NON-CONTACT COMMUNICATION MEDIUM
    1.
    发明公开
    NON-CONTACT COMMUNICATION MEDIUM 审中-公开
    非接触通信媒体

    公开(公告)号:EP2472438A1

    公开(公告)日:2012-07-04

    申请号:EP10811893.6

    申请日:2010-08-25

    Abstract: Even when a mold part of an IC module is exposed from an opening provided in a substrate of an inlay, occurrence of malfunction, communication disorders or the like of the IC module due to the influence of an external impact or the like is prevented. By combining a sealing member including an insulating layer and an adhesive layer in a stacked manner to a shape covering a mold part of the IC module, occurrence of malfunction, communication disorders or the like of the IC module is prevented even if there is an influence of an external impact or the like. Meanwhile, by providing a sealing member, concentration of stress on the mold part in a line pressure test is alleviated by limiting the size of the sealing member, and also occurrence of cracks in the mold part can be prevented.

    Abstract translation: 即使当IC模块的模​​具部分从设置在嵌体的衬底中的开口露出时,也防止了由于外部冲击等的影响而导致IC模块发生故障,通信障碍等。 通过将包括绝缘层和粘合剂层的密封构件堆叠地叠加到覆盖IC模块的模​​具部分的形状上,即使存在影响也可防止发生IC模块的故障,通信故障等 的外部影响等。 另一方面,通过设置密封部件,通过限制密封部件的大小,能够缓和管线压力试验中的模具部分上的应力集中,并且能够防止模具部分产生裂纹。

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