Abstract:
Even when a mold part of an IC module is exposed from an opening provided in a substrate of an inlay, occurrence of malfunction, communication disorders or the like of the IC module due to the influence of an external impact or the like is prevented. By combining a sealing member including an insulating layer and an adhesive layer in a stacked manner to a shape covering a mold part of the IC module, occurrence of malfunction, communication disorders or the like of the IC module is prevented even if there is an influence of an external impact or the like. Meanwhile, by providing a sealing member, concentration of stress on the mold part in a line pressure test is alleviated by limiting the size of the sealing member, and also occurrence of cracks in the mold part can be prevented.
Abstract:
A booklet is provided including at least a sheet-like first substrate, and a sheet-like second substrate that is attached to the first substrate. The first saddle-stitch substrate includes a light-transmitting region, and an optical functional unit having a polarization or phase modulation function is provided to the light-transmitting region. In the second saddle-stitch substrate, a latent image, which is manifested by allowing the optical functional unit to operate, is provided to a surface that is opposite to the first saddle-stitch substrate at a position corresponding to the optical functional unit.