Abstract:
A packaging material for a power storage device having a structure including at least a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer laminated in this order. In the packaging material, the substrate layer is formed of a polyester film having a 50% elongation stress in the range of 100 to 180 MPa and a thermal shrinkage in the range of 1 to 15%, after heat treatment from 160°C to 200°C, or a polyester film having a difference ΔA in break elongation of 12% or more after heat treatment at 200°C and 160°C and having a 50% elongation stress of 75 MPa or more after heat treatment at 200°C.
Abstract:
A packaging material for a power storage device according to an aspect of the present disclosure has a laminate structure in the following order including a substrate layer, a first adhesive layer, a metal foil layer, a second adhesive layer, and an inner layer containing a polyester-based resin. The inner layer has a melting peak temperature during melting in a range of 160 to 280°C which is measured by a differential scanning calorimeter. The substrate layer has a melting peak temperature that is higher than the melting peak temperature of the inner layer.
Abstract:
The present disclosure relates to a power storage device packaging material. The power storage device packaging material has a structure including at least a substrate layer, an adhesive layer, a metal foil layer, a sealant adhesive layer, and a sealant layer laminated in this order. The substrate layer is formed of a polyester film exhibiting ΔA, as expressed by the following Formula (1), of 10% or more and a 50% elongation stress of 75 MPa or more after heat treatment at 160°C. Δ A = break elongation after 160 ° C heat treatment − break elongation before 160 ° C heat treatment
Abstract:
An outer packaging material for electric storage device comprises at least a substrate layer, an adhesion layer, a metal foil layer, a sealant adhesion layer, and a sealant layer laminated in this order, wherein the substrate layer is one made of either a polyamide film having a hot water shrinkage rate at 95°C of less than 5% and a hot shrinkage rate at 180°C of 4 to 16%, or a polyester film having a hot water shrinkage rate at 95°C of less than 5% and a hot shrinkage rate at 180°C of 10 to 25%.