摘要:
A transfer film for firing which has a multilayer structure including a functional pattern and a pressure-sensitive adhesive layer. The multilayer structure is free from a shape failure of the functional pattern and a decrease in adhesive force of the adhesive layer, and has the excellent transferability to a substrate. The transfer film gives a fired functional pattern free from defects such as a shape or function failure. The transfer film for firing is one for use in forming a fired functional pattern by transferring a multilayer structure including a functional pattern to a surface of a substrate and firing it. The transfer film comprises a release film and a multilayer structure formed so as to be in contact with one of the surfaces of the release film. The multilayer structure includes a functional pattern and a contact layer which has been formed so as to be in direct contact with the surface of the functional pattern and is constituted of one layer or a larger number of layers. The functional pattern comprises inorganic particles and an organic substance removable by firing. The contact layer comprises an organic substance and a solvent both removable by firing. The organic substance contained in the functional pattern is incompatible with the solvent contained in the contact layer.
摘要:
Transfer films for firing which have the excellent property of transferring a functional pattern and enable a pyrolysis gas generated by the firing of organic substances to be released smoothly, and which can form on a substrate a functional pattern free from defects such as a shape or function failure. One of the transfer films for firing comprises a release film and a multilayered structure formed so as to be in contact with one of the surfaces of the release film. The multilayered structure includes both a pressure-sensitive adhesive layer for bonding the transfer film for firing to a surface of a substrate and a functional pattern formed between the release film and the pressure-sensitive adhesive layer. The functional pattern comprises inorganic particles and a first organic substance removable by firing, and the pressure-sensitive adhesive layer comprises a second organic substance removable by firing and different from the first organic substance. The heat decomposition temperature of the first organic substance (Tdb), the heat decomposition temperature of the second organic substance (Tda), and the fusion bonding temperature of the inorganic particles (Tw) each measured under the firing conditions to be used for firing the multilayered structure transferred to a surface of a substrate satisfy the relationship Tdb.