公开(公告)号：EP3247180A1

公开(公告)日：2017-11-22

申请号：EP16737191.3

申请日：2016-01-08

Applicant: NGK Spark Plug Co., Ltd.

Inventor： KATOH, Tatsuya ,  ITO, Masanori ,  KUTSUNA, Masaki

IPC: H05K1/03 ,  H05K1/09 ,  H05K3/46

CPC classification number: H05K3/40 ,  B32B9/005 ,  B32B2307/202 ,  C03C4/14 ,  C03C10/0054 ,  C03C2204/00 ,  C04B35/6303 ,  C04B2237/40 ,  C04B2237/704 ,  H01L23/15 ,  H05K1/0296 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/092 ,  H05K3/12 ,  H05K3/1291 ,  H05K3/28 ,  H05K3/285 ,  H05K3/321 ,  H05K3/4061 ,  H05K3/46 ,  H05K3/4629 ,  H05K3/4664 ,  H05K2201/017 ,  H05K2201/0769 ,  H05K2203/1126

Abstract: A ceramic substrate includes a ceramic layer mainly formed of a glass ceramic and a conductor trace mainly formed of silver (Ag). In an adjacent region located adjacent to the conductor trace, the concentration of boron atoms (B) contained in the ceramic layer increases toward the conductor trace.

Abstract translation: 陶瓷基板包括主要由玻璃陶瓷形成的陶瓷层和主要由银（Ag）形成的导体迹线。 在与导体迹线相邻的相邻区域中，陶瓷层中包含的硼原子（B）的浓度朝着导体迹线增加。

公开(公告)号：EP2327284B1

公开(公告)日：2016-12-28

申请号：EP09781640.9

申请日：2009-08-07

Applicant: Epcos AG

Inventor： KLOIBER, Gerald ,  STRALLHOFER, Heinz ,  FREIBERGER, Norbert

IPC: H05K3/32 ,  G01K1/14 ,  G01K7/22

CPC classification number: H05K3/321 ,  G01K1/026 ,  G01K1/14 ,  G01K7/22 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/1291 ,  H05K2201/10636 ,  H05K2203/1126 ,  H05K2203/1131 ,  H05K2203/1453 ,  Y02P70/611 ,  Y10T29/49103 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T428/24926

公开(公告)号：EP2919286A4

公开(公告)日：2016-05-11

申请号：EP12887975

申请日：2012-11-06

Applicant: NGK INSULATORS LTD

Inventor： YANO SHINSUKE ,  TANI MAKOTO ,  NAKANISHI HIROKAZU

IPC: H01L33/64 ,  H01L33/62

CPC classification number: H05K1/0203 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2933/0066 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/0298 ,  H05K1/053 ,  H05K2201/062 ,  H05K2201/068 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2203/1126 ,  H01L2924/00

公开(公告)号：EP2919286A1

公开(公告)日：2015-09-16

申请号：EP12887975.6

申请日：2012-11-06

Applicant: NGK Insulators, Ltd.

Inventor： YANO Shinsuke ,  TANI Makoto ,  NAKANISHI Hirokazu

IPC: H01L33/64

CPC classification number: H05K1/0203 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2933/0066 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/0298 ,  H05K1/053 ,  H05K2201/062 ,  H05K2201/068 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2203/1126 ,  H01L2924/00

Abstract: A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing an insulation reliability and high-humidity reliability of the substrate is provided.

Abstract translation: 包括具有预定值或更大的厚度的金属基底的用于发光二极管的基板被构造为使得用于与预定范围内的发光二极管（LED）电连接的顶部导体的厚度落入 预定的范围和使金属基底和顶部导体电绝缘的绝缘层的厚度以及顶部导体的厚度满足预定关系。 从而，提供了一种用于发光二极管的基板，其通过实现低热阻来显示高散热能力，作为整个基板的总热阻，而不降低基板的绝缘可靠性和高湿可靠性。

公开(公告)号：EP2824089A1

公开(公告)日：2015-01-14

申请号：EP14772650.9

申请日：2014-02-27

Applicant: NGK Insulators, Ltd.

Inventor： YANO, Shinsuke ,  TANAKA, Yoshihiro ,  YAMAGUCHI, Hirofumi

IPC: C04B35/443 ,  C03C14/00 ,  C04B35/10 ,  C04B35/44 ,  H05K1/03

CPC classification number: C03C3/093 ,  C03C3/085 ,  C03C3/091 ,  C03C14/004 ,  C03C2214/04 ,  H01L23/15 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2203/1126 ,  H01L2924/00

Abstract: In a glass-ceramics composite comprising a glass phase and a crystalline phase which contains an oxide system ceramics dispersed in the glass phase, by making the composition of material which forms the glass phase meet specific conditions, the thermal conductivity of the glass-ceramics composite which is obtained by firing the glass phase and the crystalline phase is raised. Thereby, a glass-ceramics composite which is suitable for a low-temperature firing use and has a high thermal conductivity is provided.

Abstract translation: 在包含分散在玻璃相中的含有氧化物系陶瓷的玻璃相和结晶相的玻璃陶瓷复合体中，通过使形成玻璃相的材料的组成符合特定条件，玻璃 - 陶瓷复合材料的导热率 通过烧制玻璃相和结晶相而获得。 因此，提供了适用于低温烧制并具有高导热性的玻璃 - 陶瓷复合材料。

公开(公告)号：EP2612331A4

公开(公告)日：2014-12-17

申请号：EP11822638

申请日：2011-09-01

Applicant: FERRO CORP

Inventor： GRADDY GEORGE E JR ,  MCKINLEY CAROLINE M ,  SHAIKH AZIZ S

IPC: H01B1/12 ,  C03C8/04 ,  C03C8/08 ,  C03C8/10 ,  C03C8/18

CPC classification number: H01L31/022425 ,  C03C3/07 ,  C03C3/16 ,  C03C8/10 ,  C03C8/18 ,  C03C8/20 ,  H01B1/22 ,  H01L23/481 ,  H01L31/02245 ,  H01L2924/0002 ,  H05K3/42 ,  H05K2203/1126 ,  Y02E10/50 ,  Y10T29/49165 ,  H01L2924/00

Abstract: The present invention is directed toward a via fill material for use in solar applications that exhibits low series resistance and high shunt resistance. The via fill material according to the invention includes silver powder, a glass frit and a vehicle.

公开(公告)号：EP2773169A1

公开(公告)日：2014-09-03

申请号：EP12842736.6

申请日：2012-09-28

Applicant: Kyocera Corporation

Inventor： NAKAMURA,Kiyotaka ,  OHASHI,Yoshio ,  SHIKATA,Kunihide

IPC: H05K1/09 ,  H05K3/24

CPC classification number: H05K1/09 ,  C04B41/009 ,  C04B41/52 ,  C04B41/90 ,  C04B2111/00405 ,  C04B2111/00844 ,  H01L23/15 ,  H01L23/3731 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/245 ,  H05K3/38 ,  H05K2201/0269 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2203/1126 ,  C04B35/00 ,  C04B35/10 ,  C04B35/185 ,  C04B35/48 ,  C04B35/581 ,  C04B35/584 ,  C04B41/4539 ,  C04B41/4572 ,  C04B41/5022 ,  C04B41/5127 ,  C04B41/5116 ,  C04B41/522 ,  C04B41/5155 ,  H01L2924/00

Abstract: [Object] To provide a circuit board having good heat dissipation characteristics capable of promptly dissipating the heat generated by a metal wiring layer on the basis of operations of an electronic component and exhibiting high reliability enabling a long term of use by improving the adhesion strength between a ceramic sintered body and a metal wiring layer and, thereby, reducing peeling of the metal wiring layer due to cooling/heating cycles when operation and non-operation of the electronic component are repeated, and an electronic apparatus in which an electronic component is mounted on the circuit board.
[Solution] A circuit board is provided with a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, wherein the above-described metal wiring layer includes a first region 12a which is in contact with the principal surface and which contains a glass component and a second region 12b which is located on the first region 12a and which does not contain a glass component, the thickness of the first region 12a is 35% or more and 70% or less of the thickness of the metal wiring layer 12, and the average grain size in the first region 12b is smaller than the average grain size in the second region 12b.

Abstract translation: 本发明提供一种具有良好的散热特性的电路板，其能够基于电子部件的操作迅速地消散由金属布线层产生的热量，并且具有高的可靠性，能够长期使用，从而提高第 陶瓷烧结体和金属布线层，并且由此在电子部件的操作和不操作被重复时由于冷却/加热循环而减少金属布线层的剥离;以及电子装置，其中安装电子部件 在电路板上。 电路板在陶瓷烧结体11的至少一个主面上设置有金属布线层12，其中上述金属布线层包括与主面接触的第一区域12a， 包含位于第一区域12a上并且不含有玻璃成分的玻璃成分和第二区域12b，第一区域12a的厚度为金属布线的厚度的35％以上且70％以下 层12，第一区域12b的平均粒径小于第二区域12b的平均粒径。

公开(公告)号：EP2520139A1

公开(公告)日：2012-11-07

申请号：EP10800869.9

申请日：2010-12-29

Applicant: E.I. Du Pont De Nemours And Company

Inventor： NAIR, Kumaran, Manikantan ,  GORDON, Scott, E. ,  MCCOMBS, Mark, Frederick

IPC: H05K1/09 ,  H01B1/22

CPC classification number: H05K3/0094 ,  H01B1/22 ,  H05K1/09 ,  H05K1/092 ,  H05K1/095 ,  H05K1/115 ,  H05K3/4061 ,  H05K2201/032 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1126

Abstract: A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt% gold and 80-55 wt% silver and (ii) 100 wt% silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt%, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors.

公开(公告)号：EP2053030B1

公开(公告)日：2011-10-12

申请号：EP07791260.8

申请日：2007-07-25

Applicant: Murata Manufacturing Co. Ltd.

Inventor： MURATA, Takaki

IPC: C04B35/64 ,  B32B18/00 ,  H05K3/46

CPC classification number: H05K3/4611 ,  B32B18/00 ,  C04B2235/5436 ,  C04B2235/6025 ,  C04B2235/6562 ,  C04B2235/6567 ,  C04B2235/658 ,  C04B2235/6584 ,  C04B2235/663 ,  C04B2237/343 ,  C04B2237/568 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H05K1/0306 ,  H05K3/1291 ,  H05K3/4629 ,  H05K2201/0323 ,  H05K2203/016 ,  H05K2203/1126 ,  H05K2203/1476 ,  H05K2203/308

Abstract: A process for the production of formed ceramic bodies which can dispense with the step of removing a restraining layer after the completion of firing to simplify the production process and to inhibit a fired ceramic body from being damaged in the restraining layer removing step and which makes it possible to produce formed ceramic bodies (such as ceramic substrates) having high dimensional accuracy in a high yield. The process comprises using as the restraining layer (31) a restraining layer mainly made of a fire-destroyable material which can be burnt down under a high oxygen partial pressure though it is not burnt down in a low-oxygen atmosphere, setting the restraining layer (31) on at least one principal surface of a base material layer (A') to be fired into a ceramic substrate (formed ceramic body), subjecting the base material layer (A') with the restraining layer (31) to the first firing step (firing under restraint) in a low-oxygen atmosphere to sinter the base material layer (A'), and then subjecting the resulting system to the second firing step under the condition of an oxygen partial pressure higher than that of the first firing step to burn down the restraining layer (31), and thus can dispense with the step of removing the restraining layer (31).

公开(公告)号：EP2034808A3

公开(公告)日：2011-04-06

申请号：EP08159937.5

申请日：2008-07-08

Applicant: Delphi Technologies, Inc.

Inventor： Djordjevic, Aleksandra ,  Berlin, Carl W.

IPC: H05K1/16

CPC classification number: H05K1/162 ,  H05K1/092 ,  H05K1/167 ,  H05K3/1291 ,  H05K2201/0355 ,  H05K2203/1126 ,  H05K2203/171

Abstract: An embedded resistor and capacitor circuit and fabrication method is provided. The circuit includes a substrate, a conductive foil laminated to the substrate, and a thick film dielectric material disposed on the conductive foil. One or more thick film electrodes are formed on the dielectric material and a thick film resistor is formed at least partially contacting the thick film electrodes. A capacitor is formed by an electrode and the conductive foil. The electrodes serve as terminations for the resistor and capacitor.