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公开(公告)号：EP3006888A1
公开(公告)日：2016-04-13
申请号：EP14808377.7
申请日：2014-06-02
申请人： UACJ Corporation
摘要： There is provided a heat exchanger and a fin member for the heat exchanger that can suppress occurrence of hollow corrosion in a fin and hold cooling performance for a long period of time under a high corrosion environment. The heat exchanger includes an aluminum tube through which a working fluid circulates and an aluminum fin which is bonded to the tube. The fin has a region B around a grain boundary, and a region A around the region B. In the region B, 5.0×10 4 pieces/mm 2 less of Al-Fe-Mn-Si based intermetallic compound, each of which has equivalent circle diameters of 0.1 to 2.5 µm, and in the region A, 5.0×10 4 pieces/mm 2 to 1.0×10 7 pieces/mm 2 of Al-Fe-Mn-Si based intermetallic compound, each of which has equivalent circle diameters of 0.1 to 2.5 µm.
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公开(公告)号：EP2786831B1
公开(公告)日：2018-06-13
申请号：EP12853569.7
申请日：2012-11-28
申请人： UACJ Corporation
发明人： KITAWAKI, Kotaro , MURASE, Takashi
IPC分类号： B23K20/00 , B23K20/16 , B23K20/233 , B23K35/362 , B32B15/01 , C22C21/02 , C22C21/12 , C22C9/04 , B23K35/38 , B23K35/28 , B23K35/00 , B23K103/18 , B23K101/00 , B23K103/10 , B23K103/12 , B23K31/02 , C22C21/18 , C22C21/16 , C22C9/00 , C22C21/04 , C22C21/14
CPC分类号： B23K31/02 , B23K20/2333 , B23K35/002 , B23K35/007 , B23K35/286 , B23K35/38 , B23K2101/00 , B23K2103/10 , B23K2103/12 , B23K2103/18 , B32B15/017 , C22C9/00 , C22C9/04 , C22C21/02 , C22C21/14 , C22C21/16 , C22C21/18 , Y10T428/1275
摘要： [Object] To provide a bonded body of an aluminum alloy and a copper alloy and a bonding method for the bonded body, the bonded body being bonded by a novel bonding method which ensures excellent bonding properties, small material deformation during bonding, and high reliability. [Solving Means] A bonded body made of an aluminum alloy and a copper alloy and obtained by employing the aluminum alloy as one member to be bonded and the copper alloy as the other member to be bonded, the one bonded member and the other bonded member being bonded to each other through metallic connection, wherein the one bonded member is made of comprising an aluminum alloy containing Cu: 3.0 mass % to 8.0 mass % and Si: 0.1 mass % to 10 mass % with balance being Al and unavoidable inevitable impurities, and satisfying the chemical formula: C + 2.4 · S · 7.8 where C (mass %) is a Cu concentration and S (mass %) is a Si composition concentration is satisfied, and the other bonded member is made of comprising a copper alloy having a higher solidus temperature than the one bonded member. A bonding method for the bonded body is also provided.
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