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    Leadless chip placement machine for printed circuit boards
    2.
    发明公开
    Leadless chip placement machine for printed circuit boards 失效
    Vorrichtung zurBestückungvon Leiterplatten mit drahtlosen Mikrobauelementen。

    公开(公告)号：EP0065604A2

    公开(公告)日：1982-12-01

    申请号：EP81305172.9

    申请日：1981-10-30

    申请人： UNIVERSAL INSTRUMENTS CORPORATION (Delaware Corp.)

    发明人： Dean, Weibley J. ,  Ragard, Philipp A. ,  Johnson, Charles E.

    IPC分类号： H05K13/04 ,  H05K13/08

    CPC分类号： H05K13/0452 ,  H05K13/08 ,  Y10T29/5142 ,  Y10T29/53022 ,  Y10T29/53178 ,  Y10T29/53261 ,  Y10T156/1759

    摘要： A machine for pre-gluing raw circuit surfaces of printed circuit boards (P.C. boards) at an adhesive station and properly positioning the P.C. boards at a placement station for placement of leadless electronic components (chips) onto the adhesive. A carousel provides program preselected vertical supply of taped components to a feeder assembly which feeds individual chips onto a nozzle of a turret-type vacuum head at a pick-up station. The turret-type head has four nozzles spaced 90° apart about the central axis of the head. As the turret is rotated, a chip is transported by a nozzle, sequentially, from the pick-up station to a centering and testing station, a centering and orienting station, and a placement station. Located between the testing and orienting stations is a chip removal station for ejecting defective or inverted chips. Sensors are located at the adhesive and placement stations to detect defective P.C. boards so that they may be bypassed. A controller, such as a digital computer, provides additional monitoring and controls the operation of the machine.

    摘要翻译： 一种用于在粘合剂站预粘合印刷电路板（P.C.板）的原始电路表面并正确定位P.C.的机器。 用于将无铅电子部件（芯片）放置在粘合剂上的放置站的板。 转盘提供程序预选的垂直供应的胶带组件到馈送器组件，其将单个芯片馈送到在拾取站处的转台式真空头的喷嘴。 转塔式头部具有围绕头部中心轴线间隔90°的四个喷嘴。 当转塔旋转时，芯片依次从接收站运送到定中心和测试站，定心定位站和放置站。 位于测试和定向站之间的是用于排出有缺陷的或倒置的芯片的芯片去除站。 传感器位于粘合剂和放置位置，以检测有缺陷的P.C. 板可以绕过它们。 诸如数字计算机之类的控制器提供额外的监视和控制机器的操作。