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    ELECTRONIC-CIRCUIT-COMPONENT-MOUNTING HEAD
    4.
    发明公开
    ELECTRONIC-CIRCUIT-COMPONENT-MOUNTING HEAD 审中-公开
    安装头用于电子元件电路

    公开(公告)号：EP2925109A1

    公开(公告)日：2015-09-30

    申请号：EP12888636.3

    申请日：2012-11-21

    申请人： Fuji Machine Mfg. Co., Ltd.

    发明人： KAWAGUCHI, Koji

    IPC分类号： H05K13/04

    CPC分类号： H05K13/0413 ,  H05K13/0408 ,  H05K13/0409 ,  H05K13/041 ,  Y10T29/53178

    摘要： While maintaining high efficiency mounting electronic circuit components to a circuit substrate, makes it possible to avoid damage due to contact impact with a suction nozzle or circuit substrate. As well as rotating/raising/lowering axis 14 being held on head main body 12 as to be capable of rotation and of being raised/lowered, suction nozzle 22 is held on that that rotating/raising/lowering axis 14 as to be capable of being raised/lowered and not capable of being rotated relatively, and those rotating/raising/lowering axis 14 and suction nozzle 22 can be rotated as necessary by electric motor 82. Also, raising/lowering driving member 62 is held on head main body 12 as to be capable of being raised/lowered, and is raised/lowered by first linear motor 18. As well as first engaging section 64 of that raising/lowering driving member 62 being engaged with rotating/raising/lowering axis 14, second engaging section 66 of second linear motor 60 held on raising/lowering driving member 62 is engaged with suction nozzle 22, suction nozzle 22 is lowered at the same time as rotating/raising/lowering axis 14 is lowered, and suction nozzle 22 is lowered with respect to rotating/raising/lowering axis 14; and in that state component 100 is mounted on a circuit substrate.