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    PROCESS FOR THE ELECTROLYTIC COPPER PLATING OF ZINC DIECASTING HAVING A REDUCED TENDENCY TO BLISTER FORMATION
    2.
    发明公开
    PROCESS FOR THE ELECTROLYTIC COPPER PLATING OF ZINC DIECASTING HAVING A REDUCED TENDENCY TO BLISTER FORMATION 审中-公开
    锌电解镀铜方法DIE WITH MINIMUM起泡倾向CASTING

    公开(公告)号：EP2475808A1

    公开(公告)日：2012-07-18

    申请号：EP10751798.9

    申请日：2010-08-12

    申请人： Umicore Galvanotechnik GmbH

    发明人： GASSNER, Franz ,  STRAUBINGER, Frank ,  REI MÜLLER, Klaus ,  WIRTH, Guenter ,  NEUHAUS, Silvia

    IPC分类号： C25D3/38 ,  C25D5/10 ,  C25D5/50 ,  C25D7/00

    CPC分类号： C25D5/10 ,  C25D3/38 ,  C25D5/50

    摘要： In the electroplating of zinc diecastings with a copper layer, the electrolyte penetrates into the pores of the zinc diecasting. When the temperature is increased later, this leads to vaporization of the electrolyte liquid in the pores and to blistering or flaking of the copper layer. It is proposed that plating be carried out in two steps. In the first step, only a thin copper layer of less than 1 μm is applied and the plated parts are then treated at a temperature which leads to vaporization of the electrolyte liquid. The thin copper layer is still sufficiently porous for the vapour to be able to escape. Only the solid constituents of the electrolyte remain. The copper layer is then thickened to a final thickness of from about 20 to 30 μm. In this plating step, electrolyte liquid no longer penetrates into the pores of the zinc diecasting. The parts which are coated in this way display no blistering or flaking of the copper layer after storage at a temperature of 150°C.