公开(公告)号：EP2572207B1

公开(公告)日：2020-07-15

申请号：EP11818499.3

申请日：2011-05-20

申请人： University of Virginia Patent Foundation

发明人： WEIKLE, II, Robert M. ,  LICHTENBERGER, Arthur Weston ,  BARKER, Nicolas Scott ,  RECK, Theodore James ,  XU, Haiyong ,  CHEN, Lihan

IPC分类号： G01R31/26 ,  H01L21/66 ,  G01R1/067 ,  G01R3/00 ,  G01R1/04

公开(公告)号：EP2572207A2

公开(公告)日：2013-03-27

申请号：EP11818499.3

申请日：2011-05-20

申请人： University of Virginia Patent Foundation

发明人： WEIKLE, II, Robert M. ,  LICHTENBERGER, Arthur Weston ,  BARKER, Nicolas Scott ,  RECK, Theodore James ,  XU, Haiyong ,  CHEN, Lihan

IPC分类号： G01R31/26 ,  H01L21/66

CPC分类号： G01R1/0416 ,  G01R1/067 ,  G01R1/06744 ,  G01R3/00

摘要： A micromaching process to fabricate a single chip that simply drops into a supporting structure. The micromaching process provides the ability to create a probe that will interface with integrated circuits, for example, operating at frequencies in the range of about 100GHz to about 3,000 GHz (3 THz). This approach creates a silicon structure (or other applicable choice of material) that provides mechanical force for probing while supporting the transfer of the high frequency energy between a measurement system and the integrated circuit, individual device or material.

摘要翻译： 一种微加工工艺，用于制造简单落入支撑结构的单芯片。 微加工工艺提供了创建与集成电路接口的探针的能力，例如在约100GHz至约3,000GHz（3THz）范围内的频率下工作。 这种方法产生了提供用于探测的机械力的硅结构（或其他适用的材料选择），同时支持测量系统与集成电路，单独设备或材料之间的高频能量的传递。

公开(公告)号：EP2160589A1

公开(公告)日：2010-03-10

申请号：EP08731474.6

申请日：2008-03-05

申请人： University Of Virginia Patent Foundation ,  Gelmont, Boris ,  Globus, Titiana ,  Swami, Nathan ,  Weikle, Robert M. ,  Lichtenberger, Arthur Weston ,  Parthasarathy, Ramakrishnan ,  Bykhovski, Alexei

发明人： GELMONT, Boris ,  GLOBUS, Titiana ,  SWAMI, Nathan ,  WEIKLE, Robert M. ,  LICHTENBERGER, Arthur Weston ,  PARTHASARATHY, Ramakrishnan ,  BYKHOVSKI, Alexei

IPC分类号： G01N21/17 ,  G01N21/49

CPC分类号： G01J3/024 ,  G01N21/3563 ,  G01N21/3581 ,  G01N21/4788

摘要： A method and apparatus for enhanced THz radiation coupling to molecules, includes the steps of depositing a test material near the discontinuity edges of a slotted member, and enhancing the THz radiation by transmitting THz radiation through the slots. The molecules of the test material are illuminated by the enhanced THz radiation that has been transmitted through the slots, thereby producing an increased coupling of EM radiation in the THz spectral range to said material. The molecules can be bio- molecules, explosive materials, or species of organisms. The slotted member can be a semiconductor film, a metallic film, in particular InSb, or layers thereof. THz detectors sense near field THz radiation that has been transmitted through said slots and the test material.