公开(公告)号：EP2780935A2

公开(公告)日：2014-09-24

申请号：EP14700800.7

申请日：2014-01-07

申请人： hZo, Inc.

发明人： ASTLE, David James ,  CHILD, Tyler Christensen ,  KASAGANI, Vimal Kumar ,  LOOSE, Cameron LaMar ,  STEVENS, Blake LeRoy ,  SORENSON, Max Ernest

IPC分类号： H01L21/64 ,  H05K7/02 ,  H01L21/67

CPC分类号： B23K26/362 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/361 ,  B23K26/402 ,  B23K2203/50 ,  C23C14/042 ,  C23C16/042 ,  H01L21/561 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K3/285 ,  H05K3/288 ,  H05K2203/025 ,  H05K2203/092 ,  H05K2203/095 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/163 ,  H01L2924/00

摘要： A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed.

摘要翻译： 用于从诸如电子设备的基板选择性地去除保护涂层的部分的方法包括从基板去除保护涂层的部分。 去除过程可以包括在特定位置切割保护涂层，然后从衬底去除保护涂层的期望部分，或者其可以包括烧蚀待除去的保护涂层的部分。 还公开了涂层和除去系统。