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    WIRE SAW AND PROCESS FOR SLICING MULTIPLE SEMICONDUCTOR INGOTS
    5.
    发明授权
    WIRE SAW AND PROCESS FOR SLICING MULTIPLE SEMICONDUCTOR INGOTS 有权
    线锯和方法是同时切割半导体晶锭

    公开(公告)号：EP1284847B1

    公开(公告)日：2007-02-21

    申请号：EP00935487.9

    申请日：2000-05-31

    申请人： MEMC ELECTRONIC MATERIALS S.p.A.

    发明人： ZAVATTARI, Carlo ,  SEVERICO, Ferdinando ,  DE MARIA, Paolo

    IPC分类号： B28D5/04 ,  B23D57/00

    CPC分类号： B23D57/0061 ,  B28D1/025 ,  B28D5/0082

    摘要： A wire saw (10) for simultaneously slicing multiple, generally cylindrical monocrystalline ingots (14) into wafers. The wire saw includes a cutting head (16), an ingot support (12), and multiple generally parallel lengths of cutting wire (18) defining a cutting web (30). The ingot support (12) is adapted for mounting at least two ingots (14) thereon in registration with the cutting web. A slurry delivery system includes nozzles (34, 36, and 38) in an amount of at least one more than the number of ingots, the nozzles being positioned for dispensing slurry along the wire web generally at lateral sides of each ingot. A process for simultaneously slicing at least two generally cylindrical semiconductor ingots into wafers includes mounting at least two ingots to a common ingot support, moving the ingot support relative to the cutting web so that the two ingots simultaneously press against the cutting web at cutting regions, and dispensing a liquid slurry to at least three locations on the wire web including two outermost sides of the cutting regions and a location between each pair of ingots.

    SEMICONDUCTOR WAFER, POLISHING APPARATUS AND METHOD
    6.
    发明公开
    SEMICONDUCTOR WAFER, POLISHING APPARATUS AND METHOD 审中-公开
    研磨装置在半导体晶片和方法

    公开(公告)号：EP1335814A1

    公开(公告)日：2003-08-20

    申请号：EP00981636.4

    申请日：2000-11-21

    申请人： MEMC ELECTRONIC MATERIALS S.P.A.

    发明人： BOVIO, Ezio ,  CORBELLINI, Paride ,  MORGANTI, Marco ,  NEGRI, Giovani

    IPC分类号： B24B37/04 ,  B24B41/06

    CPC分类号： B24B41/04 ,  B24B37/30 ,  B24B49/006

    摘要： A wafer polishing apparatus for polishing a semiconductor wafer. The polisher comprises a base (23), a turntable (27), a polishing pad (29) and a drive mechanism (45) for driven rotation of a polishing head (63). The polishing head is adapted to hold at least one wafer (35) for engaging a front surface of the wafer with a work surface of the polishing pad. A spherical bearing assembly (75) mounts the polishing head (63) on the drive mechanism for pivoting of the polishing head about a gimbal point (p) lying no higher than the work surface when the polishing head holds the wafer in engagement with the polishing pad. This pivoting allowing the plane of the front surface of the wafer to continuously align itself to equalize polishing pressure over the front surface of the wafer, while rotation of the polishing head is driven by the driving mechanism. This maintains the front surface and work surface in a continuously parallel relationship for more uniform polishing of a semiconductor wafer, particularly near the lateral edge of the wafer. A cassette of wafers and method of polishing are also disclosed.

    Behälter zur Aufbewahrung und Beförderung von Siliciumscheiben
    7.
    发明公开
    Behälter zur Aufbewahrung und Beförderung von Siliciumscheiben 失效
    容器用于储存和硅晶片的运输。

    公开(公告)号：EP0194481A2

    公开(公告)日：1986-09-17

    申请号：EP86102203.6

    申请日：1986-02-20

    申请人： MEMC ELECTRONIC MATERIALS S.p.A.

    发明人： Rissotti, Luigi ,  Morici, Moreno ,  Leoni, Fabrizio ,  Girardi, Adriano

    IPC分类号： H05K13/00 ,  H01L21/00

    CPC分类号： H01L21/6732 ,  H01L21/67326 ,  H01L21/67369 ,  Y10S206/832

    摘要： Gegenstand der Erfindung ist ein Behälter zur Aufbewahrung und Beförderung von Siliciumscheiben, bestehend aus drei Teilen, und zwar

    1. einer unteren Halbschachtel,
    2. einer oberen Halbschachtel oder einem Deckel, welche zusammengesetzt eine äußere Schutzschachtel des Behälters bilden, und aus
    3. einer im Schachtelinneren angeordneten Kassette zur Aufnahme der Siliciumscheiben

    sowie aus einigen zwischen der unteren und oberen Halbschachtel verteilten Mitteln, welche so miteinander zusammenwirken und sich ergänzen, daß die beiden Halbschachteln formschlüssig lösbar verschlossen werden und miteinander durch Einspannung mit der Kassette festgeklemmt werden können. An der oberen Halbschachtel sind zusätzliche Hilfsmittel angebracht, welche ebenfalls das Festklemmen der Kassette bewirken und die Siliciumscheiben in einer Mehrzahl von Sitzen festhalten. An der Kassette sind weiterhin Einspannmittel angeordnet, welche in die an der unteren Halbschachtel vorgesehenen Klemmittel eingreifen.

    摘要翻译： 本发明涉及一种用于存储和硅盘的运输容器，其由三个部分组成，和形式，尽管1.一个下半盒，2.一个上箱半或盖，其放在一起的容器的保护性外箱，和从3中 箱内部布置带盒用于保持硅晶片，以及从所述下部和上部箱之间的一些半分布装置，其与彼此协作并彼此互补的两个半盒是一个形状配合的可释放封闭，并且可以通过与盒夹持被夹持在一起。 附加装置（22-23）被安装在上箱半这也影响盒的夹紧和保持硅晶片在多个座椅。 夹紧装置被进一步安排其接合在设置在所述下半盒夹持的空间是指在盒上。

    A method for separating and regenerating polyethylene glycol and silicon carbide abrasive material to enable re-use thereof
    10.
    发明公开
    A method for separating and regenerating polyethylene glycol and silicon carbide abrasive material to enable re-use thereof 有权
    用于分离和聚乙二醇和碳化硅的回收磨料再利用的目的方法

    公开(公告)号：EP0968801A1

    公开(公告)日：2000-01-05

    申请号：EP99830266.5

    申请日：1999-05-04

    申请人： MEMC ELECTRONIC MATERIALS S.P.A. ,  Garbo Servizi s.r.l.

    发明人： Zavattari, Carlo ,  Fragiacomo, Guido

    IPC分类号： B28D1/02 ,  B01D21/26 ,  B01D37/04 ,  B03B9/06

    CPC分类号： B24B57/02 ,  B01D21/0012 ,  B01D21/0018 ,  B01D21/26 ,  B01D21/267 ,  B01D2221/14 ,  B24B55/12 ,  B28D5/007 ,  Y02P70/179

    摘要： A method for treating an exhausted fluid used in a process for slicing monocrystalline silicon containing a particulate abrasive material and a suspending agent, and including their separation and their regeneration for re-use, as well as silicon powder residuals comprising the steps of : a) lowering the viscosity of the exhausted fluid by addition of water; b) separating a water suspension of the available abrasive particles and a water suspension containing the silicon powder; c) drying the suspension of said abrasive particles in a furnace for recovery and re-use thereof; and d) filtering said water suspension of silicon powder in order to recover the silicon powder for subsequently drying and possibly re-using it,
       characterized in that said abrasive material is silicon carbide and said suspending agent is polyethylene glycol (PEG) and in that it further comprises the following steps:

    i) before said water dilution step a), warming said exhausted abrasive fluid so as to lower its viscosity,
    ii) filtering said exhausted warmed lower viscosity fluid, in order to obtain, on one hand, a wet powder agglomerate consisting of silicon carbide particles and silicon powder, said agglomerate being then subjected to said a), b), c) and d) steps, and, on the other hand, said suspending agent (PEG) which contain silicon powder,
    iii) separating said suspending agent (PEG) so as to extract pure suspending agent (PEG) intended for re-use and separating said silicon powder traces, that can be subsequently disposed or possibly reused.

    摘要翻译： 一种用于在过程中使用的用于切割的单晶硅含有颗粒状研磨材料耗尽流体的治疗和助悬剂，以及包括它们的分离和它们的再利用的再生，以及硅粉末残差包括以下步骤的方法：1） 降低通过加入水排出的流体的粘度; b）分离的可用磨料颗粒的水悬浮液，水悬浮液含有硅粉末; c）干燥中进行回收和再利用它们的炉所述磨料颗粒的悬浮液; 及d）过滤硅粉末的所述水悬浮液，以回收的硅粉供随后干燥和可能的重新使用它，其特征在于，所述磨料材料是碳化硅和所述悬浮剂是聚乙二醇（PEG）和DASS它 还包括以下步骤：i）之前，所述水稀释步骤a）中，加温所述耗尽磨料流体以降低其粘度，ⅱ）过滤所述排出温热较低粘度的流体，以便获得，一方面，湿粉末 附聚物自由碳化硅颗粒和硅粉末，称附聚物被再受到所述A），b），c）和d）的步骤，并且，在另一方面，所述悬浮剂（PEG）而含有硅粉末，ⅲ） 所述分离悬浮剂（PEG），以提取旨在用于再利用和分离所述硅粉末痕迹纯悬浮剂（PEG），也可以是随后处置或可能再利用。