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    Verfahren und Vorrichtung zur Herstellung von Silicium-Dünnstäben
    3.
    发明公开
    Verfahren und Vorrichtung zur Herstellung von Silicium-Dünnstäben 有权

    公开(公告)号：EP2465625A1

    公开(公告)日：2012-06-20

    申请号：EP11192279.5

    申请日：2011-12-07

    申请人： Wacker Chemie AG

    发明人： Schantz, Matthaeus ,  Lichtenegger, Bruno

    IPC分类号： B23B27/10 ,  B23D59/02 ,  B23Q11/10 ,  B24B27/06 ,  C01B33/035 ,  C30B13/00 ,  C30B15/04 ,  C30B25/18 ,  C30B29/06 ,  B28D5/02

    CPC分类号： B28D5/0076 ,  B23K26/0604 ,  B23K26/146 ,  B23K26/38 ,  B23K26/40 ,  B23K2203/50 ,  B28D5/029 ,  B28D5/045 ,  C01B33/035

    摘要： Gegenstand der Erfindung ist ein Verfahren zur Herstellung von Silicium-Dünnstäben, umfassend folgende Schritte: a) Bereitstellen eines Stabes aus Silicium; b) Sequentielles Abschneiden von Brettern einer bestimmten Dicke vom Stab mittels einer Sägevorrichtung, wobei der Stab zwischen zwei aufeinanderfolgenden Schnitten jeweils derart um 90° oder um 180° axial gedreht wird, so dass von vier aufeinanderfolgenden Schnitten paarweise jeweils zwei der vier Schnitte auf radial gegenüberliegenden Seiten des Stabes erfolgen oder wobei das Abschneiden der Bretter simultan gleichzeitig an radial gegenüberliegenden Seiten des Stabes erfolgt; c) Zersägen der abgeschnittenen Bretter zu Dünnstäben mit rechteckigem Querschnitt.
    Vorrichtung zur Erzeugung von Dünnstäben aus einem Siliciumstab durch Sägen, beinhaltend eine erste Einheit umfassend eine Vielzahl von Schneidwerkzeugen sowie eine Kühlflüssigkeit zur Kühlung der Schneidwerkzeuge, eine zweite Einheit umfassend Düsen zum Einbringen von zusätzlicher Kühlflüssigkeit in Schneidspalten des zu bearbeitenden Werkstücks sowie eine dritte Einheit umfassend eine Bandsäge oder eine Drahtsäge oder eine oder mehrere Wellen enthaltend Schneidwerkzeuge.

    摘要翻译： 生产薄的硅棒包括（a）提供硅的棒（1），（b）通过锯切装置从棒上顺序地切割具有特定厚度的板坯，其中杆分别轴向旋转90度或180度 在两个相继的切口之间的[deg]，使得形成四个连续的切口，并且四个切口中的两个分别在棒的径向相对侧成对地发生，或者板的切割同时在杆的径向相对侧同时发生， （c）将切割的板坯切成具有矩形横截面的细棒。 生产薄的硅棒包括（a）提供硅的棒（1），（b）通过锯切装置从棒上顺序地切割具有特定厚度的板坯，其中杆分别轴向旋转90度或180度 在两个相继的切口之间的[deg]，使得形成四个连续的切口，并且四个切口中的两个分别在棒的径向相对侧成对地发生，或者板的切割同时在杆的径向相对侧同时发生， （c）将切割的板坯切成具有矩形横截面的细棒; 或（a1）提供硅棒，（b1）通过第一锯切装置在所述杆的总长度上产生许多垂直切口，其中所述切口相互分离，并且所述切口和切割深度的间隔根据 到具有待制造的矩形横截面的细棒的期望边缘长度，以及（c1）通过第二锯切装置在杆的纵向方向上产生水平切割，以将具有矩形横截面的细杆与杆分离 ，其中步骤（b1）和（c1）依次顺序地进行几次，并且根据步骤（c1），杆在两个连续的切割之间分别轴向旋转90度或180度，以形成四个 连续切割和四个切口中的两个分别在棒的径向相对侧成对地发生。 还包括用于通过锯切从硅棒生产细棒的设备的独立权利要求，其包括第一单元，其包括许多切割工具和用于冷却切割工具的冷却液体（6），第二单元包括用于引入附加冷却液 切割待加工的工件的切割部分，以及包括带锯，线锯或包含至少一个轴（3）的切削工具的第三单元。

    Apparatus for cutting semiconductor devices
    4.
    发明公开
    Apparatus for cutting semiconductor devices 审中-公开
    装置用于切割半导体器件

    公开(公告)号：EP1844913A3

    公开(公告)日：2010-06-30

    申请号：EP07014806.9

    申请日：2005-02-22

    申请人： Towa-Intercon Technology, Inc. ,  Koninklijke Philips Electronics N.V.

    发明人： Mihai, Chris ,  Khor, Teang K. ,  Donker, Marcus Franciscus ,  Van Gemert, Leo

    IPC分类号： B28D5/00 ,  B28D5/02 ,  B23D59/02

    CPC分类号： B28D5/0076 ,  B28D5/029

    摘要： An apparatus for cutting semiconductor devices comprises cutting blades (132) for cutting a semiconductor device, generally annular rigid spacers, a fluid reservoir (174), an elongated member and an adjustment mechanism. The rigid spacers separate adjacent ones of the cutting blades, the spacers each having an inner surface at its inner radius and an outer surface at its outer radius, and each contacting the adjacent ones of the cutting blades on first and second substantially planar surfaces each extending substantially from the inner surface to the outer surface. The elongated member is in movable proximity to the cutting blades and in fluid communication with the fluid reservoir and has channels configured to at least partially surround the cutting blades so as to simultaneously direct flow of a fluid from the fluid reservoir onto the cutting edges of the cutting blades and onto the sides of the cutting blades. The adjustment mechanism is configured to move the elongated member so as to adjustably align the channels with the cutting blades.

    Apparatus for cutting semiconductor devices
    5.
    发明公开
    Apparatus for cutting semiconductor devices 审中-公开
    Vorrichtung zum Schneiden von Halbleitervorrichtungen

    公开(公告)号：EP1844913A2

    公开(公告)日：2007-10-17

    申请号：EP07014806.9

    申请日：2005-02-22

    申请人： Towa-Intercon Technology, Inc. ,  Koninklijke Philips Electronics N.V.

    发明人： Mihai, Chris ,  Khor, Teang K. ,  Donker, Marcus Franciscus ,  Van Gemert, Leo

    IPC分类号： B28D5/00 ,  B28D5/02 ,  B23D59/02

    CPC分类号： B28D5/0076 ,  B28D5/029

    摘要： An apparatus for cutting semiconductor devices comprises cutting blades (132) for cutting a semiconductor device, generally annular rigid spacers, a fluid reservoir (174), an elongated member and an adjustment mechanism. The rigid spacers separate adjacent ones of the cutting blades, the spacers each having an inner surface at its inner radius and an outer surface at its outer radius, and each contacting the adjacent ones of the cutting blades on first and second substantially planar surfaces each extending substantially from the inner surface to the outer surface. The elongated member is in movable proximity to the cutting blades and in fluid communication with the fluid reservoir and has channels configured to at least partially surround the cutting blades so as to simultaneously direct flow of a fluid from the fluid reservoir onto the cutting edges of the cutting blades and onto the sides of the cutting blades. The adjustment mechanism is configured to move the elongated member so as to adjustably align the channels with the cutting blades.

    摘要翻译： 一种用于切割半导体器件的设备包括用于切割半导体器件的切割刀片（132），大致环形的刚性间隔件，流体储存器（174），细长构件和调节机构。 刚性间隔件分隔相邻的切割刀片，间隔件各自具有在其内半径处的内表面和在其外半径处的外表面，并且每个与相邻的切割刀片接触在第一和第二基本上平坦的表面上，每个延伸 基本上从内表面到外表面。 细长构件可移动靠近切割刀片并且与流体储存器流体连通，并且具有构造成至少部分地围绕切割刀片的通道，以便同时将流体从流体储存器流动到流体储存器的切割边缘上 切割刀片和切割刀片的侧面。 调节机构构造成移动细长构件以便可调节地将通道与切割刀片对准。

    Semiconductor wafer dicing machine
    7.
    发明公开
    Semiconductor wafer dicing machine 失效
    装置，用于分离半导体晶片。

    公开(公告)号：EP0186201A2

    公开(公告)日：1986-07-02

    申请号：EP85116581.1

    申请日：1985-12-27

    申请人： DISCO ABRASIVE SYSTEMS, LTD.

    发明人： Ono, Takatoshi

    IPC分类号： H05K13/00 ,  H01L21/00

    CPC分类号： B27B31/06 ,  B28D5/0058 ,  B28D5/024 ,  B28D5/029

    摘要： @ A dicing machine for cutting a semiconductor wafer (W) along cutting lines arranged in a lattice pattern. The dicing machine comprises a cutting station (2), at least one alignment station (4A, 4B), a cutting means (8) disposed in the cutting station, a detecting means (10A, 108) disposed in the alignment station for detecting the cutting lines of the water (W), and a wafer transferring means (6). The wafer transferring means includes two wafer supporting means (50A, 5;B) and the dicing machine is capable of positioning one of the two wafer supporting means in the alignment station and performing alignment of a semiconductor wafer (W) supported with said one of the wafer supporting means while positioning the other of the wafer supporting means in the cutting station and cutting a semiconductor wafer supported with said the other of the supporting means by the cutting means. The cutting means includes two cutting blades (158A, 158B) and a cutting blade interval setting-up means (122) for setting up the interval of these cutting blades.

    SCHNEIDANLAGE UND VERFAHREN FÜR EINE SCHNEIDANLAGE
    8.
    发明公开
    SCHNEIDANLAGE UND VERFAHREN FÜR EINE SCHNEIDANLAGE 审中-公开
    切割系统的切割单元和方法

    公开(公告)号：EP3277471A1

    公开(公告)日：2018-02-07

    申请号：EP16714245.4

    申请日：2016-03-13

    申请人： D. Swarovski KG

    发明人： SCHWEIGL, Johannes ,  SCHWABEGGER, Hubert ,  KARGER, Joachim ,  LINDENTHALER, Gerhard ,  MIMM, Andreas

    IPC分类号： B28D5/00 ,  B28D5/02

    CPC分类号： B28D5/024 ,  B28D5/0082 ,  B28D5/029

    摘要： The invention relates to a cutting system. The cutting system (1) is designed to extend in the direction of a first system axis (7) which extends horizontally along a width (B) of the cutting system (1), in the direction of a second system axis (8) which extends vertically relative to the first system axis (7), and in the direction of a third system axis (9) which extends along the depth (T) of the cutting system orthogonally to the first system axis (7) and the second system axis (8). The cutting system has a support (2), a tool (3; 4) which is received on the support (2) in the form of a saw with a spindle shaft (13; 14), the operating direction of the tool following the direction of the first system axis (7), and an additional tool (5) which is received on the support (2) in the form of a chop saw with a third spindle shaft (15), the operating direction of the additional tool following the direction of the first system axis (7). The tools (3; 4; 5) are used to machine a blank, and the tools (3; 4; 5) are arranged in series in the direction of the first system axis (7). The cutting system (1) has a support element (10) which is received on the support (2) in a movable manner along the first system axis (7) and the second system axis (8), and the support element (10) is provided for supporting the blank. The support element (10) can be rotated about the second system axis (8), and according to the invention, the spindle shaft (13; 14) is orthogonal to the third spindle shaft (15).