SIMULATING AUTOMATION BEHAVIOR
    4.
    发明公开

    公开(公告)号:EP4428637A1

    公开(公告)日:2024-09-11

    申请号:EP23160824.1

    申请日:2023-03-08

    申请人: OMRON Corporation

    IPC分类号: G05B17/02

    CPC分类号: G05B17/02

    摘要: A method (10) of simulating an action performed by an automation device (14) on at least one object (22) in a simulation space (12), wherein each object is defined by an object parameter set that represents at least one physical property of the respective object, the method comprising:
    defining (S12) an automation volume (24) in the simulation space, which represents an automation interface of the automation device;
    defining (S16) an automation pattern (28), which represents an automation behavior of the automation device;
    setting (S28) a respective initial object parameter set to each of the at least one object; and
    performing (S42) a simulation covering a simulated time, including the steps:
    determining (S50), whether the at least one object is contacting the automation volume; and
    modifying (S52) the object parameter set of each object, that is determined to contact the automation volume, according to the automation pattern.

    MOUNTING BOARD, AND ELECTRIC APPARATUS EQUIPPED WITH MOUNTING BOARD

    公开(公告)号:EP4425543A1

    公开(公告)日:2024-09-04

    申请号:EP22907237.6

    申请日:2022-12-01

    申请人: OMRON Corporation

    摘要: To provide a mounting board that can prevent, when a printed circuit board on which an electronic component is mounted is screwed to a heat sink, occurrence of a short circuit between a bonding material and the electronic component or between the printed circuit board and the electronic component, and damage to the electronic component due to strain in the printed circuit board caused by contact between the printed circuit board and the electronic component, as well as an electric apparatus equipped with the mounting board. The mounting board includes an electronic component, a printed circuit board, a heat spreader, and a heat dissipation component. A first insulating member and a second insulating member each being an insulator are arranged between the electronic component and the heat spreader and between the heat spreader and the heat dissipation component, respectively, and a hardness of the first insulating member and a hardness of the second insulating member are lower than a hardness of the heat spreader.