公开(公告)号：EP1710613B1

公开(公告)日：2013-08-07

申请号：EP05709415.3

申请日：2005-01-27

Applicant: Olympus Corporation

Inventor： HIROSE, Kazuya ,  HAGA, Kenji ,  TSUBOUCHI, Isao ,  TAKAHASHI, Toru ,  YAKATA, Katsuaki ,  ORII, Fumito

IPC: G02B5/09 ,  B29C45/00 ,  B29C45/27 ,  B29C45/26

CPC classification number: G02B5/09 ,  B29C45/0046 ,  B29C45/26 ,  B29C45/2701 ,  B29L2011/0058

公开(公告)号：EP2555909A1

公开(公告)日：2013-02-13

申请号：EP11766387.2

申请日：2011-03-23

Applicant: Husky Injection Molding Systems S.A.

Inventor： JENKO, Edward Joseph ,  MIER, Angelo

IPC: B29C33/38

CPC classification number: B29C45/2701 ,  B29C2791/004

Abstract: The present invention relates to a molding system (100) including (but not limited to): (i) an electrically chargeable conduit (102), and (ii) an electrical-charge source (104) configured to provide an electrical charge to the electrically-chargeable conduit (102), the electrical charge hastening flow of a resin (106) along the electrically-chargeable conduit (102).

公开(公告)号：EP2214882B1

公开(公告)日：2012-02-22

申请号：EP08771620.5

申请日：2008-06-20

Applicant: Husky Injection Molding Systems Ltd.

Inventor： JENKO, Edward Joseph

IPC: B29C45/03

CPC classification number: B29C45/02 ,  B29C45/2701 ,  B29C45/2806 ,  B29C2045/2893 ,  B29C2945/76083 ,  B29C2945/76086 ,  B29C2945/7609 ,  B29C2945/76274 ,  B29C2945/76284 ,  B29C2945/76381 ,  B29C2945/76615 ,  B29C2945/76769

Abstract: A hot runner system includes a having a cavity (18). Melt is fed from a source of melt into the cavity (18), and a valve (24) isolates melt in the cavity (18) from melt in the source. A plunger (34) within the cavity (18) is driven forward to inject melt in the cavity (18) into a mold cavity (26) at high pressure without significantly increasing the pressure of melt in the source. The plunger (34) optionally functions as both the plunger (34) and the valve (24) by opening and closing communication between the cavity (18) and the manifold (16) as it is rotated.

Abstract translation: 热流道系统包括具有空腔（18）的热流道系统。 将熔体从熔体源供给到空腔（18）中，并且阀（24）将空腔（18）中的熔体与源中的熔体隔离。 在腔体（18）内的柱塞（34）被向前驱动以在高压下将空腔（18）中的熔体注入模腔（26）中，而不显着增加源中熔体的压力。 当柱塞（34）旋转时，通过打开和关闭空腔（18）和歧管（16）之间的连通，柱塞（34）可选地用作柱塞（34）和阀（24）。

公开(公告)号：EP2293915A4

公开(公告)日：2012-01-25

申请号：EP09755590

申请日：2009-04-29

Applicant: HUSKY INJECTION MOLDING

Inventor： JENKO EDWARD JOSEPH

IPC: B29C45/27

CPC classification number: B29C45/2701 ,  B29C2045/277

公开(公告)号：EP1259981B1

公开(公告)日：2011-08-10

申请号：EP00946518.8

申请日：2000-06-30

Applicant: FICO B.V.

Inventor： PETERS, Hendrikus, Johannes, Bernardus ,  VERMEULEN, Richard, Theodorus

IPC: H01L21/56

CPC classification number: H01L21/565 ,  B29C45/02 ,  B29C45/14655 ,  B29C45/2701 ,  B29C45/2708 ,  B29C2045/0027 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention relates to a device for encapsulating an electronic component, in particular a semiconductor, mounted on a carrier, comprising: an upper and a lower mould part, which mould parts are displaceable relative to each other between an encapsulating position in which the mould parts take a position enclosing at least one carrier between the mould parts and, connecting onto the enclosed carrier, defining at least one mould cavity, and an opened position in which the mould parts are situated at a greater mutual distance than in the encapsulating position, a holder member displaceable between the mould parts for urging at least an edge part of the carrier against one of the mould parts in the encapsulating position, and supply means for feeding liquid moulding material to the mould cavity. The invention also relates to a method for encapsulating an electronic component mounted on a carrier.

公开(公告)号：EP2293915A1

公开(公告)日：2011-03-16

申请号：EP09755590.8

申请日：2009-04-29

Applicant: Husky Injection Molding Systems S.A.

Inventor： JENKO, Edward, Joseph

IPC: B29C45/00

CPC classification number: B29C45/2701 ,  B29C2045/277

Abstract: Disclosed is a hot runner (100), including: a first plate (102) having a first-plate alloy; a second plate (104) having a second-plate alloy, the second plate (104) being coupled with the first plate (102), and the second plate (104) and the first plate (102) defining a manifold pocket (213); a manifold (224) being supportively received in the manifold pocket (213), and the manifold (224) having a drop (225); a nozzle assembly (400) being supportively received by the second plate (104), the nozzle assembly (400) connecting with the drop (225) of the manifold (224); and a nozzle-support structure (101), including: a first load-bearing insert (207) contacting the second plate (104), the first load-bearing insert (207) contacting the nozzle assembly (400), the first load-bearing insert (207) having a first insert material being stronger than the second-plate alloy of the second plate (104), the first insert material being strong enough to withstand a first high-point load (150) to be transmitted from the nozzle assembly (400) to the second plate (104) via the first load-bearing insert (207), and the second-plate alloy of the second plate (104) withstands transmission of the first high-point load (150) once the first load-bearing insert (207) distributes the first high-point load (150) to the second plate (104).

公开(公告)号：EP2197654A1

公开(公告)日：2010-06-23

申请号：EP09717630.9

申请日：2009-01-07

Applicant: R & D Tool & Engineering Co.

Inventor： CHEN, Jincheng

IPC: B29C49/00

CPC classification number: B29C45/2701 ,  B29C45/2711 ,  B29K2105/253

Abstract: Injection molding apparatus has upper and lower mold halves that split along the center line of the parison cavity and the gate passage leading thereto. Each hot melt injection nozzle is received within a tubular insert cup having a reduced diameter tip that is seated within the gate passage. The cup is supported on the lower mold half so as to remain thereon as the upper mold half opens and closes the mold. The base end of each nozzle has a swivel ball and socket relationship with the manifold block which supplies it with hot melt, while the tip end of each injection nozzle is configured to permit swivelling within the insert cup as need be to accommodate dimensional changes that arise during non-uniform thermal expansion and contraction of different parts of the tooling.

公开(公告)号：EP2125182A1

公开(公告)日：2009-12-02

申请号：EP08706160.2

申请日：2008-02-13

Applicant: International Brain System S.A.

Inventor： SOULIER, Joël

IPC: B01F13/00 ,  B01J19/08 ,  B29C47/90 ,  B29C45/27 ,  B29B13/00

CPC classification number: B01F13/0001 ,  B01J19/087 ,  B01J2219/0803 ,  B01J2219/0854 ,  B01J2219/0862 ,  B01J2219/0879 ,  B29B13/00 ,  B29C45/2701

Abstract: The invention relates to a method for preparing a polymer or copolymer composition, from at least two different mixed molten polymers and/or copolymers, wherein the molten mixture is brought into contact with a structure which is at least partly dielectric and/or magnetic (2, 5), said molten mixture being simultaneously subjected on contact with said dielectric and/or magnetic structure (2, 5) to a static electric or magnetic field and a pulsed electric or magnetic field. During said method the molten mixture flows in at least one channel (7) of a piece (6), said piece (6) and said dielectric and/or magnetic structure (2, 5), being a least partly mobile one with relation to the other to generate at least one movement relative to the channel (7) with relation to the at least partly dielectric and/or magnetic structure (2, 5).

公开(公告)号：EP1810812A2

公开(公告)日：2007-07-25

申请号：EP07108020.4

申请日：2000-09-21

Applicant: Synventive Molding Solutions, Inc.

Inventor： KAZMER, David ,  MOSS, Mark, D. ,  DOYLE, Mark ,  VAN GEEL, Huip

IPC: B29C45/27 ,  B29C45/28 ,  B29C45/30 ,  B29C45/77

CPC classification number: B29C45/77 ,  B29C45/02 ,  B29C45/2701 ,  B29C45/2725 ,  B29C45/2806 ,  B29C45/30 ,  B29C45/76 ,  B29C45/766 ,  B29C45/768 ,  B29C45/7686 ,  B29C45/82 ,  B29C2045/2687 ,  B29C2045/2722 ,  B29C2045/2772 ,  B29C2045/2872 ,  B29C2045/2882 ,  B29C2045/2886 ,  B29C2045/304 ,  B29C2045/306 ,  B29C2945/76006 ,  B29C2945/76013 ,  B29C2945/76083 ,  B29C2945/7621 ,  B29C2945/76277 ,  B29C2945/76307 ,  B29C2945/76498 ,  B29C2945/76545 ,  B29C2945/76581 ,  B29C2945/76591 ,  B29C2945/76595 ,  B29C2945/76735 ,  B29C2945/76765 ,  B29C2945/76785 ,  B29C2945/76849 ,  B29C2945/76943

Abstract: An injection molding apparatus comprising a manifold (15) to direct material into a mold cavity (162,164); a valve pin (41) adapted to reciprocate through the manifold toward and away from the mold cavity, wherein valve pin contacts material injected into the mold cavity; and a controller (151,210) to control a flow rate of material injected into the first cavity during an injection cycle based on a force exerted on the valve pin by the material.

Abstract translation: 一种注射成型设备，包括用于将材料引导到模腔（162,164）中的歧管（15）。 阀芯（41），其适于通过所述歧管朝向和远离所述模具腔往复运动，其中阀针接触注入到所述模腔中的材料; 以及控制器（151,210），其基于由所述材料施加在所述阀销上的力来控制在注射循环期间喷射到所述第一腔体中的材料的流速。

公开(公告)号：EP1759826A1

公开(公告)日：2007-03-07

申请号：EP04745771.8

申请日：2004-06-10

Applicant: Toyota Jidosha Kabushiki Kaisha

Inventor： AMANO, Masahiro, Toyota Jidosha Kabushiki Kaisha ,  ISOSHIMA, Yoshiharu, Toyota Jidosha Kabushiki

IPC: B29C45/26 ,  B29C45/46

CPC classification number: B29C45/2701 ,  B29C45/1761 ,  B29C45/1773 ,  B29C45/20 ,  B29C2045/1768 ,  B29C2045/202 ,  B29C2045/2716

Abstract: The present invention enables one hot runner device to be shared between a plurality of molds whose resin inlets are disposed at different positions.
This hot runner device discharges supplied molten material to a resin inlet 18b of a mold 18. A hot runner body 42 comprises an inlet opening into which the molten material is supplied, an outlet opening from which the molten material is discharged, and a flow passage. The inlet opening is formed at one end, and the outlet opening is formed at the other end. The flow passage connects the inlet opening and the outlet opening. The hot runner body 42 is driven and moved by a drive mechanism 56 so that the outlet opening 52 can make contact with the resin inlet 18b of each of a plurality of molds whose resin inlets 18b are disposed at different positions. Accordingly, the hot runner device can be commonly used for the plurality of molds whose resin inlets are disposed at different positions.

Abstract translation: 本发明使得一个热流道装置能够在树脂入口设置在不同位置的多个模具之间共享。 该热流道装置将供给的熔融材料排出到模具18的树脂入口18b。热流道主体42包括供给熔融材料的入口，熔融材料从其排出的出口，流路 。 入口开口形成在一端，出口开口形成在另一端。 流动通道连接入口和出口。 热流道主体42由驱动机构56驱动和移动，使得出口开口52可以与其树脂入口18b设置在不同位置的多个模具中的每一个的树脂入口18b接触。 因此，热流道装置可以通常用于其树脂入口设置在不同位置的多个模具。