摘要:
The invention relates to an artificial satellite which includes: a mounting structure supporting equipment-bearing walls; a launcher-adapter rigidly connected to the mounting structure; a first radiator (26); and at least one first system (42) for transporting heat by a fluid, including at least one duct (44) having a first heat-exchange section (50) and a second heat-exchange section (52), said second heat-exchange section (52) being capable of being in thermal contact with said first radiator (26), characterised in that said first heat-exchange section (50) is in thermal contact with at least one portion of the launcher-adapter (16). The invention also relates to a method for filling a tank of propellent gas of said artificial satellite.
摘要:
Ein modularer Satellit mit einer Mehrzahl von elektrische und/oder elektronische Baugruppen aufnehmenden Elektronikkästen (3; 122, 123, 124, 125, 126, 127, 128, 129 130, 131), wobei die Elektronikkästen untereinander elektrisch verbunden oder verbindbar sind, ist versehen mit einer Basis-Strukturtafel (108; 208), einer auf der Basis-Strukturtafel (108; 208) angeordneten Dockingstruktur (2; 220), einer Mehrzahl von mit der Dockingstruktur (2; 220) verbundenen oder verbindbaren Geräteträgertafeln (111, 112, 113, 114, 115, 116, 117, 118), wobei die Dockingstruktur (2; 220) erste elektrische Verbindungsmittel (5) zur elektrischen Verbindung mit den Elektronikkästen (3; 122, 123, 124, 125, 126, 127, 128, 129 130, 131) aufweist, wobei die Geräteträgertafeln (111, 112, 113, 114, 115, 116, 117, 118) mechanische Verbindungsmittel (4) zur Halterung der Elektronikkästen (3; 122, 123, 124, 125, 126, 127, 128, 129 130, 131) aufweisen und wobei die jeweilige Geräteträgertafel (111, 112, 113, 114, 115, 116, 117, 118) zumindest bereichsweise mittels integrierter Wärmequellen und/oder Wärmesenken temperierbar ausgebildet ist.
摘要:
An instrument mounting system for a geosynchronous host satellite provides independent heat rejection capability for a hosted instrument. The system may include an instrument mounting structure that is thermally coupled to a radiator component via heat pipes that may include one or both of rigid and flexible elements. In some embodiments, the system is mounted on the hosting satellite so as to provide satellite components and the hosted instrument with a clear field of view while rejecting heat in one or both of the north and south directions. The system may also provide structural support for components of one or both of the hosted instrument or the hosting satellite.
摘要:
Panneau structural (PS) pour satellite, comprenant une peau externe (PE) destinée à être à l'extérieur du satellite, une âme (AM) comprenant au moins un caloduc intégré (CAL) monté fixement en contact avec ladite peau externe (PE), et une peau interne (PI) destinée à être à l'intérieur du satellite, ledit panneau structural (PS) muni d'échangeurs de chaleur génériques adaptés pour être associés à un circuit de régulation thermique par circulation de fluide caloporteur, extérieur au panneau.
摘要:
Spacecraft (30, 32), radiator panels (35) for spacecraft, kits for radiator panels, inserts (48) associated with radiator panels, heat pipes (40) associated with radiator panels, external structural reinforcement members (200) associated with radiator panels, and methods of assembling radiator panels are disclosed herein. Some radiator panels (35) include at least one insert (48) that is positioned adjacent to a heat pipe (40) between two spaced-apart face-sheets (42, 44), with the insert being configured to secure a package (52) to the inside face-sheet (42) opposite of the heat pipe (40). Some radiator panels include at least one external structural reinforcement (200) member that extends across an external side of the radiator panel.
摘要:
Heat transfer devices (322) are described. In one example, a heat transfer device for installation in a system having a heat generating element within the system away from which heat is to be transferred is described. The heat transfer device (322) includes a heat pipe (330) having a first portion, a second portion, and a working fluid contained within the heat pipe for transferring heat from the first portion to the second portion. The first portion is disposed in proximity with the heat generating element. The second portion is coupled to the first portion. At least part of the second portion is disposed outside the system to dissipate heat from the heat generating element and the second portion may be variably extended outside the system. ( Fig. 3 )
摘要:
Thermal module (1) for use on a spacecraft to control thermal loads coming from a heat source (3) comprising a two-phase loop system (5) and a heat rejection system (13), the two-phase loop system (5) comprising a thermal collector (7), a heat flow regulator (10), a by-pass line (6) and a condenser (11), the condenser (11) and the heat rejection system (13) being thermally coupled, such that the heat flow regulator (10) of the two-phase loop system (5) redirects part of the thermal loads from the heat source (3) to the condenser (11), from which the heat rejection system (13) directs said thermal loads to a heat sink (14), the temperature of the heat source (3) being regulated by bypassing another part of the thermal loads back to the thermal collector (7) through the by-pass line (6) in a proportional manner, to avoid the heat source (3) overcooling, being the heat rejection system (13) designed based on the hottest possible conditions for the spacecraft mission.