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公开(公告)号：EP4380889A1
公开(公告)日：2024-06-12
申请号：EP22761690.1
申请日：2022-07-29
申请人： InvenSense, Inc.
发明人： LEE, Daesung , CUTHBERTSON, Alan
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公开(公告)号：EP4353674A1
公开(公告)日：2024-04-17
申请号：EP22200958.1
申请日：2022-10-11
发明人： Iihola, Antti , Lindroos, Jeanette
CPC分类号： B81C1/00269 , B81C1/00301 , B81C2203/010920130101 , B81C2203/011820130101 , B81C2203/03520130101 , B81B2207/09220130101 , B81B2207/09620130101
摘要： A method for sealing and contacting a microelectromechanical device which comprises a silicon device wafer with MEMS device structures and a cap wafer with an electrical circuit. The device wafer comprises a sealing region and an interconnection region, and the cap wafer comprises a corresponding sealing region and an interconnection region. Layers of eutectic metal alloy material are deposited on the sealing and the interconnection regions of the device wafer and the cap wafer. The cap wafer is bonded to the device wafer so that the interconnection region of the device wafer is aligned with the interconnection region of the cap wafer and the sealing region of the device wafer is aligned with the sealing region of the cap wafer.
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公开(公告)号：EP3313778B1
公开(公告)日：2024-08-21
申请号：EP16720628.3
申请日：2016-04-20
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公开(公告)号：EP3927651B1
公开(公告)日：2024-05-29
申请号：EP19710845.9
申请日：2019-02-22
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公开(公告)号：EP4380888A1
公开(公告)日：2024-06-12
申请号：EP22758328.3
申请日：2022-07-29
申请人： InvenSense, Inc.
发明人： LEE, Daesung , CUTHBERTSON, Alan
IPC分类号： B81B3/00
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公开(公告)号：EP4352005A1
公开(公告)日：2024-04-17
申请号：EP22720889.9
申请日：2022-04-19
申请人： InvenSense, Inc.
IPC分类号： B81B7/00
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