摘要:
Certain example embodiments relate to coated articles with sequentially activated low-E coatings, and/or methods of making the same. In certain example embodiments, one or more infrared reflecting layers is/are activated via a non-equilibrium preconditioning activation that uses photons with specific frequencies/frequency ranges, followed by a more equilibrium thermal activation. The preconditioning activation aids in rearranging the silver atoms to energetically favorable positions, while helping to avoid their unwanted agglomeration. The more equilibrium thermal stage of activation aids in aligning the chemical potentials of the layers of the stack and in further densification of the preconditioned silver layer. Doing so, in turn, helps to reduce the likelihood of stresses building-up in the coating, the formation of point and dimensional defects, other unwanted efficiency-reducing phenomena, and/or the like. Advantageously, emissivity can be lowered to a value lower than that achievable using conventional thermal, flash, and laser scanning, approaches alone.
摘要:
The invention, which relates to a method for producing a low-emissivity layer system on at least one side of the substrate, the method comprising the steps of providing the substrate, forming at least one low-emissivity layer on at least one side of the substrate by a deposition process and briefly tempering at least one deposited layer, addresses the problem of reducing the sheet resistance, and thus the emissivity, of the low-emissivity coating and reducing the use of expensive IR-reflective coating material. According to the invention, said problem is solved by adjusting the electromagnetic radiation used for briefly tempering a low-emissivity layer in such a manner that the tempered layer has layer properties comparable to those of a conventionally heat-treated low-emissivity layer of a safety glass.
摘要:
The invention relates to a method for producing a mark in a transparent body under the surface thereof. According to said invention, the mark is located at least at 500µm below the surface because a layer system, whose destruction threshold is greater than that of a substrate, is applied to a substrate surface. When the layer system is embodied in the form of a readout wavelength antireflection layer system, a contrast is increased during reading. The embodiment of the layer system in the form of a writing wavelength mirror makes it possible to write with reduced intensity reflection.
摘要:
A mask (102) is applied to a glass sheet (106) which is doped with Au or Ag. Light (108) in the 300-600 nm wavelength range is applied through the mask to form irradiated regions (112) wich can be used to absorb radiation to effect fusing of the sheet to a substrate in a manner wich results in a glass envelope.
摘要:
Verfahren zur Laserbeschriftung von mindestens einen strahlungsempfindlichen Zusatzstoff enthaltenden keramischen Materialien, Glasuren, keramischen Gläsern und Gläsern, die mindestens einen strahlungsempfindlichen Zusatzstoff enthalten, wobei als Energiestrahlen ein Laser verwendet wird, und die Energiestrahlung entsprechend der Form des aufzubringenden Schriftzeichens auf die Oberfläche des zu markierenden Materials gerichtet, gegebenenfalls fokussiert wird, wodurch an den bestrahlten Stellen eine Verfärbung entsteht, dadurch gekennzeichnet, dass man als Energiestrahlung Laserlicht, dessen Wellenlänge im nahen UV- und/oder sichtbaren und/oder IR-Bereich liegt, und als strahlungsempfindlichen Zusatzstoff ein anorganisches Pigment verwendet.
摘要:
The invention, which relates to a method for producing a low-emitting layer system, comprising the steps of forming at least one low-emitting layer on at least one side of the substrate by means of deposition and subsequent brief tempering of a deposited low-emitting layer by means of electromagnetic radiation, avoiding an immediate heating up of the substrate, and to a device for performing the method, addresses the problem of improving the optical and thermal properties of a low-emitting layer system without cost-intensive tempering of the entire substrate while maintaining the processability of the low-e coated substrate.