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公开(公告)号：EP0700088A2
公开(公告)日：1996-03-06
申请号：EP95113544.1
申请日：1995-08-29
发明人： Sugiyama, Tatsuo , Hirao, Shuji , Yano, Kousaku , Nomura, Noboru
IPC分类号： H01L25/065 , H01L21/98
CPC分类号： H01L23/544 , H01L21/76898 , H01L24/05 , H01L24/12 , H01L24/16 , H01L24/80 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2223/54426 , H01L2224/0401 , H01L2224/05571 , H01L2224/08145 , H01L2224/13099 , H01L2224/8013 , H01L2224/80141 , H01L2224/80357 , H01L2224/80895 , H01L2224/80896 , H01L2224/81121 , H01L2224/81801 , H01L2224/81894 , H01L2224/83894 , H01L2224/9202 , H01L2225/06513 , H01L2225/06593 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/19043 , H01L2924/30105 , H01L2924/3511 , H01L2924/00012 , H01L2224/05552
摘要： A first electrode and a first insulating layer of electrode insulation are formed on a first semiconductor substrate. A second electrode and a second insulating layer of electrode insulation are formed on a second semiconductor substrate. The first semiconductor substrate has at its surface a pattern of recesses/projections (i.e., a pattern of sawteeth in cross section) at regular intervals in stripe arrangement. Likewise, the second semiconductor substrate has at its surface a pattern of recesses/projections (i.e., a pattern of sawteeth in cross section) at regular intervals in stripe arrangement, wherein the pattern of the second semiconductor substrate has a phase shift of 180 degrees with respect to the pattern of the first semiconductor substrate. The first and second semiconductor substrates are bonded together with their patterns in engagement.
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公开(公告)号：EP0700088B1
公开(公告)日：2001-01-24
申请号：EP95113544.1
申请日：1995-08-29
发明人： Sugiyama, Tatsuo , Hirao, Shuji , Yano, Kousaku , Nomura, Noboru
IPC分类号： H01L25/065 , H01L21/98
CPC分类号： H01L23/544 , H01L21/76898 , H01L24/05 , H01L24/12 , H01L24/16 , H01L24/80 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2223/54426 , H01L2224/0401 , H01L2224/05571 , H01L2224/08145 , H01L2224/13099 , H01L2224/8013 , H01L2224/80141 , H01L2224/80357 , H01L2224/80895 , H01L2224/80896 , H01L2224/81121 , H01L2224/81801 , H01L2224/81894 , H01L2224/83894 , H01L2224/9202 , H01L2225/06513 , H01L2225/06593 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/19043 , H01L2924/30105 , H01L2924/3511 , H01L2924/00012 , H01L2224/05552
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公开(公告)号：EP0700088A3
公开(公告)日：1996-05-01
申请号：EP95113544.1
申请日：1995-08-29
发明人： Sugiyama, Tatsuo , Hirao, Shuji , Yano, Kousaku , Nomura, Noboru
IPC分类号： H01L25/065 , H01L21/98
CPC分类号： H01L23/544 , H01L21/76898 , H01L24/05 , H01L24/12 , H01L24/16 , H01L24/80 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2223/54426 , H01L2224/0401 , H01L2224/05571 , H01L2224/08145 , H01L2224/13099 , H01L2224/8013 , H01L2224/80141 , H01L2224/80357 , H01L2224/80895 , H01L2224/80896 , H01L2224/81121 , H01L2224/81801 , H01L2224/81894 , H01L2224/83894 , H01L2224/9202 , H01L2225/06513 , H01L2225/06593 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/19043 , H01L2924/30105 , H01L2924/3511 , H01L2924/00012 , H01L2224/05552
摘要： A first electrode and a first insulating layer of electrode insulation are formed on a first semiconductor substrate. A second electrode and a second insulating layer of electrode insulation are formed on a second semiconductor substrate. The first semiconductor substrate has at its surface a pattern of recesses/projections (i.e., a pattern of sawteeth in cross section) at regular intervals in stripe arrangement. Likewise, the second semiconductor substrate has at its surface a pattern of recesses/projections (i.e., a pattern of sawteeth in cross section) at regular intervals in stripe arrangement, wherein the pattern of the second semiconductor substrate has a phase shift of 180 degrees with respect to the pattern of the first semiconductor substrate. The first and second semiconductor substrates are bonded together with their patterns in engagement.
摘要翻译： 在第一半导体衬底上形成第一电极和电极绝缘的第一绝缘层。 在第二半导体衬底上形成第二电极和电极绝缘的第二绝缘层。 第一半导体衬底在其表面上以规则的间隔条纹布置具有凹槽/凸起的图案（即，锯齿的横截面图案）。 类似地，第二半导体衬底在其表面处以条形布置的规则间隔具有凹槽/凸起的图案（即，锯齿的横截面图案），其中第二半导体衬底的图案具有180度的相移，其中 关于第一半导体衬底的图案。 第一和第二半导体衬底以其图案接合在一起结合在一起。
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4.发明公开Semiconductor device comprising two semiconductor substrates 失效Halbleiteranordnung mit zwei Halbleitersubstraten
公开(公告)号：EP0813246A3
公开(公告)日：1998-02-04
申请号：EP97115110.5
申请日：1995-08-29
发明人： Sugiyama, Tatsuo , Hirao, Shuji , Yano, Kousaku , Nomura, Noboru
IPC分类号： H01L25/065 , H01L21/98
CPC分类号： H01L23/544 , H01L21/76898 , H01L24/05 , H01L24/12 , H01L24/16 , H01L24/80 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2223/54426 , H01L2224/0401 , H01L2224/05571 , H01L2224/08145 , H01L2224/13099 , H01L2224/8013 , H01L2224/80141 , H01L2224/80357 , H01L2224/80895 , H01L2224/80896 , H01L2224/81121 , H01L2224/81801 , H01L2224/81894 , H01L2224/83894 , H01L2224/9202 , H01L2225/06513 , H01L2225/06593 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/19043 , H01L2924/30105 , H01L2924/3511 , H01L2924/00012 , H01L2224/05552
摘要： A first electrode and a first insulating layer of electrode insulation are formed on a first semiconductor substrate. A second electrode and a second insulating layer of electrode insulation are formed on a second semiconductor substrate. The first semiconductor substrate has at its surface a pattern of recesses/projections (i.e., a pattern of sawteeth in cross section) at regular intervals in stripe arrangement. Likewise, the second semiconductor substrate has at its surface a pattern of recesses/projections (i.e., a pattern of sawteeth in cross section) at regular intervals in stripe arrangement, wherein the pattern of the second semiconductor substrate has a phase shift of 180 degrees with respect to the pattern of the first semiconductor substrate. The first and second semiconductor substrates are bonded together with their patterns in engagement.
摘要翻译： 在第一半导体衬底上形成电极绝缘体的第一电极和第一绝缘层。 第二电极和第二电极绝缘层形成在第二半导体衬底上。 第一半导体衬底在其表面上以条纹布置以规则的间隔在其表面处具有凹槽/突起的图案（即，横截面的锯齿形图案）。 类似地，第二半导体衬底在其表面上以条纹布置以规则的间隔在其表面处具有凹槽/突起的图案（即，横截面的锯齿形图案），其中第二半导体衬底的图案具有180度的相移， 相对于第一半导体衬底的图案。 第一和第二半导体衬底以它们的图案接合在一起。
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5.发明公开Semiconductor device comprising two semiconductor substrates 失效Halbleiteranordnung mit zwei Halbleitersubstraten
公开(公告)号：EP0813246A2
公开(公告)日：1997-12-17
申请号：EP97115110.5
申请日：1995-08-29
发明人： Sugiyama, Tatsuo , Hirao, Shuji , Yano, Kousaku , Nomura, Noboru
IPC分类号： H01L25/065 , H01L21/98
CPC分类号： H01L23/544 , H01L21/76898 , H01L24/05 , H01L24/12 , H01L24/16 , H01L24/80 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2223/54426 , H01L2224/0401 , H01L2224/05571 , H01L2224/08145 , H01L2224/13099 , H01L2224/8013 , H01L2224/80141 , H01L2224/80357 , H01L2224/80895 , H01L2224/80896 , H01L2224/81121 , H01L2224/81801 , H01L2224/81894 , H01L2224/83894 , H01L2224/9202 , H01L2225/06513 , H01L2225/06593 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/19043 , H01L2924/30105 , H01L2924/3511 , H01L2924/00012 , H01L2224/05552
摘要： A first electrode and a first insulating layer of electrode insulation are formed on a first semiconductor substrate. A second electrode and a second insulating layer of electrode insulation are formed on a second semiconductor substrate. The first semiconductor substrate has at its surface a pattern of recesses/projections (i.e., a pattern of sawteeth in cross section) at regular intervals in stripe arrangement. Likewise, the second semiconductor substrate has at its surface a pattern of recesses/projections (i.e., a pattern of sawteeth in cross section) at regular intervals in stripe arrangement, wherein the pattern of the second semiconductor substrate has a phase shift of 180 degrees with respect to the pattern of the first semiconductor substrate. The first and second semiconductor substrates are bonded together with their patterns in engagement.
摘要翻译： 在第一半导体衬底上形成电极绝缘体的第一电极和第一绝缘层。 第二电极和第二电极绝缘层形成在第二半导体衬底上。 第一半导体衬底在其表面上以条纹布置以规则的间隔在其表面处具有凹槽/突起的图案（即，横截面的锯齿形图案）。 类似地，第二半导体衬底在其表面上以条纹布置以规则的间隔在其表面处具有凹槽/突起的图案（即，横截面的锯齿形图案），其中第二半导体衬底的图案具有180度的相移， 相对于第一半导体衬底的图案。 第一和第二半导体衬底以它们的图案接合在一起。
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