公开(公告)号：EP1597823A1

公开(公告)日：2005-11-23

申请号：EP04706764.0

申请日：2004-01-30

申请人： Marconi Communications GmbH

发明人： GEHARD, Gregor ,  KERN, Stefan ,  KOCH, Stefan

IPC分类号： H03F3/195 ,  H01P1/22

CPC分类号： H01P5/186 ,  H01P1/22 ,  H03F3/195

摘要： A millimetric-wave amplifier arrangement comprises a first amplifier (2) whose output is connected to one input of the second amplifier (3) via an adjustable attenuator (4, 5, 6). Both amplifiers (2, 3) are integrated on a single substrate (1).

公开(公告)号：EP1032072B1

公开(公告)日：2004-09-15

申请号：EP00103224.2

申请日：2000-02-17

申请人： Marconi Communications GmbH

发明人： Kern, Stefan

IPC分类号： H01P5/18

CPC分类号： H01P5/186

公开(公告)号：EP0897601A4

公开(公告)日：1999-08-11

申请号：EP97925593

申请日：1997-05-06

申请人： WATKINS JOHNSON CO

发明人： FRICK ERIC A

IPC分类号： H01P1/04 ,  H01P3/02 ,  H01P5/18 ,  H05K1/02 ,  H05K1/16

CPC分类号： H01P5/186 ,  H05K1/0237 ,  H05K1/16

摘要： A coplanar waveguide coupler comprising traces (28, 29) and waveguides (22-24, 26), all formed on one layer of multi-layer printed wiring board (10) with the interconnects (37-39, 41) between said traces (28, 29) and waveguides (22-24, 26) being carried on a second layer of said board (10). A third layer may have a ground plane (42).

摘要翻译： 包括迹线（28,29）和波导（22-24,26）的共面波导耦合器全部形成在一层多层印刷线路板（10）上，其中所述迹线之间具有互连（37-39,41） 28,29）和波导（22-24,26）被承载在所述板（10）的第二层上。 第三层可以具有接地平面（42）。

公开(公告)号：EP2634859B1

公开(公告)日：2016-11-16

申请号：EP12290071.5

申请日：2012-03-01

申请人： NXP B.V.

发明人： Wane, Sidina ,  Tesson, Olivier ,  Gamand, Patrice

IPC分类号： H01P5/18

CPC分类号： H01P5/186

公开(公告)号：EP1433220A1

公开(公告)日：2004-06-30

申请号：EP02750194.9

申请日：2002-07-18

申请人： Cree Microwave, Inc.

发明人： CRESCENZI, Emil, James, Jr.

IPC分类号： H01P5/18

CPC分类号： H01P5/186 ,  H05K1/0237

摘要： A coplanar coupler (14) for use with microstrip input and output ports includes a printed circuit substrate in which first and second metal input ports are formed on a top surface and cooperate with a metal layer on the bottom surface as microstrip lines, and a first and second metal output ports formed on the top surface which cooperate with the metal layer on the bottom surface as microstrip lines. The metal layer (24) on the bottom surface functions as a ground plane for the input ports and output ports, the metal layer being removed in a coupler region underlying at least portions of the metal input and output ports and extending therebetween. First and second metal lines (31, 32) are formed on the bottom surface in the coupler region and function as a coplanar coupler for the input and output ports. Electrical vias in the substrate interconnect the ports and the coplanar coupler.

公开(公告)号：EP0897601A1

公开(公告)日：1999-02-24

申请号：EP97925593.0

申请日：1997-05-06

申请人： WATKINS-JOHNSON COMPANY

发明人： FRICK, Eric, A.

IPC分类号： H01P1 ,  H01P3 ,  H01P5 ,  H05K1

CPC分类号： H01P5/186 ,  H05K1/0237 ,  H05K1/16

摘要： A coplanar waveguide coupler comprising traces (28, 29) and waveguides (22-24, 26), all formed on one layer of multi-layer printed wiring board (10) with the interconnects (37-39, 41) between said traces (28, 29) and waveguides (22-24, 26) being carried on a second layer of said board (10). A third layer may have a ground plane (42).

公开(公告)号：EP0511728A3

公开(公告)日：1992-12-23

申请号：EP92300427.9

申请日：1992-01-17

申请人： Hughes Aircraft Company

发明人： Wen, Cheng P. ,  Mendolia, Gregory S.

IPC分类号： H01P5/18

CPC分类号： H01P5/186

摘要： A coplanar waveguide directional coupler (116,134) may be formed on a surface (102a,106a) of a substrate (102) and/or a microwave monolithic integrated circuit (MMIC) chip (106), with the MMIC chip (106) being flip-chip mounted on the substrate (102). The directional coupler (116,134) includes an input port (114,136), a coupled port (126,154), a direct port (122,152) and an isolation port (1118,150) formed on the surface (102a,106a). At least two parallel first striplines (24,26) are formed on the surface (102a,106a), having first ends connected to the input port (114,136) and second ends connected to the direct port (122,152). At least two parallel second striplines (36,38) are formed on the surface (102a,106a), having first ends connected to the coupled port (126,154) and second ends connected to the isolation port (118,150). The second striplines (36,38) are interdigitated with the first striplines (24,26) to provide tight signal coupling therebetween. First and second main ground planes (52,54) are formed on the surface (102a,106a) and extend parallel to and on opposite respective sides of the interdigitated first and second striplines (24,26,36,38). The input port (114,136), coupled port (126,154), direct port (122,152) and isolation port (118,150) each include a coplanar waveguide section having a center conductor (14a,16a,18a,-20a) connected to the ends of the respective striplines (24,26,36,38), and first and second ground planes (14b,-14c),(16b,16c),(18b,18c),(20b,20c) which extend parallel to the center conductor (14a,16a,18a,20a) on opposite sides thereof and are connected in circuit to the main ground planes (52,54).

公开(公告)号：EP0291694B1

公开(公告)日：1992-07-01

申请号：EP88105996.8

申请日：1988-04-14

申请人： Siemens Aktiengesellschaft Österreich ,  SIEMENS AKTIENGESELLSCHAFT

发明人： Stockinger, Helmut

IPC分类号： H01P5/18

CPC分类号： H01P5/186

公开(公告)号：EP1433220B1

公开(公告)日：2011-12-14

申请号：EP02750194.9

申请日：2002-07-18

申请人： Cree, Inc.

发明人： CRESCENZI, Emil, James, Jr.

IPC分类号： H01P5/18 ,  H01P5/08

CPC分类号： H01P5/186 ,  H05K1/0237

摘要： A coplanar coupler (14) for use with microstrip input and output ports includes a printed circuit substrate in which first and second metal input ports are formed on a top surface and cooperate with a metal layer on the bottom surface as microstrip lines, and a first and second metal output ports formed on the top surface which cooperate with the metal layer on the bottom surface as microstrip lines. The metal layer (24) on the bottom surface functions as a ground plane for the input ports and output ports, the metal layer being removed in a coupler region underlying at least portions of the metal input and output ports and extending therebetween. First and second metal lines (31, 32) are formed on the bottom surface in the coupler region and function as a coplanar coupler for the input and output ports. Electrical vias in the substrate interconnect the ports and the coplanar coupler.

公开(公告)号：EP1427053A1

公开(公告)日：2004-06-09

申请号：EP03300244.5

申请日：2003-12-08

申请人： STMicroelectronics S.A.

发明人： Ezzeddine, Hilal ,  Dupont, François

IPC分类号： H01P5/18

CPC分类号： H01P5/186

摘要： L'invention concerne un coupleur de type distribué comprenant une première ligne conductrice (111) véhiculant un signal principal entre deux bornes d'extrémité (IN, DIR), une deuxième ligne conductrice (121) couplée à la première et entre deux bornes (CPLD, ISO) de laquelle circule un signal prélevé, proportionnel au signal principal, et deux condensateurs (Cs) reliant respectivement les deux bornes de chacune des lignes.

摘要翻译： 分布式耦合器具有将输入信号（IN，DIR）耦合到两个输出（ISO，CPLD）的第一和第二（111,121）线路导体。 在输入和输出线路之间连接有电容（Cs）。