摘要:
A surface acoustic wave filter device having an increased sharpness in filter characteristics and an expanded passband width is provided. A surface acoustic wave filter device (1) includes a first surface acoustic wave filter unit (10) and a second surface acoustic wave filter unit (20), of longitudinally coupled resonator type. The filter units (10 and 20) are cascade-connected to each other. A phase of a signal flowing through a first signal line (6) electrically connecting second IDTs (12 and 22) of the first and second surface acoustic wave filter units (10 and 20) is different by 180° from a phase of a signal flowing through a signal line (7) electrically connecting third IDTs (13 and 23) of the first and second surface acoustic wave filter units (10 and 20). A surface acoustic wave resonator (31) is connected between the first and second signal lines (6 and 7). A resonance point of the surface acoustic wave resonator (31) is placed in an attenuation region in the vicinity of the edge of a low frequency side of a filter passband or an anti-resonance point of the surface acoustic wave resonator (31) is placed in an attenuation region in the vicinity of the edge of a high frequency side of the filter passband.
摘要:
The invention relates to an oscillator or a sensor comprising a unit consisting of two frequency determining elements each of which comprises at least one interdigital converter (24, 34) for acoustic surface waves and a back-coupling circuit comprising an amplifier, wherein the frequency determining elements (2, 3) are distinguished by a temperature dependence of a synchronous frequency. Said invention is characterised in that a) the frequency determining elements are embodied in the form of acoustic surface wave resonators, b) the temperature coefficients of n-th order of the synchronous frequency of the two acoustic surface wave resonators have different sings if they are not equal to zero and the temperature coefficients of (n+1st) order of the synchronous frequency of the two acoustic surface wave resonators have the same sign and the temperature coefficients from the first order to (n-1st) order of the synchronous frequency of the two acoustic surface wave resonators are equal to zero if n is greater than 1, wherein n being equal to or greater than 1, c) the ratio between the converter openings and the ratio between the lengths in the direction perpendicular to the edge teeth of the converter and to strips of the object reflectors having different frequency determining elements which are assembled in one unit are selected in such a way that the oscillator frequency variation is minimum within the range of given temperatures.
摘要:
A filter comprising two cascaded primary-tertiary longitudinal coupling dual-mode SAW filters provided so as to flatten the passband of the filter and three IDT electrodes arranged with electrode finger pitches L1 so as to decrease the VSWR below 2, wherein the pitch L2 of the central IDT electrodes of one of the dual-mode SAW filters is larger than the pitch L1, electrode fingers are symmetrically removed from both sides of the IDT electrode, and the removed electrode fingers are connected to the opposed IDT electrode so as to use them as dummy electrodes with pitches L2.
摘要:
A surface-acoustic-wave device includes at least first and second surface-acoustic-wave elements (11, 21) formed on a common piezoelectric substrate (1) and cascaded with each other, each of the first and second surface-acoustic-wave elements including a plurality of interdigital electrodes (11A - 11C; 21A - 21C) having a plurality of electrode fingers overlapping with each other in correspondence to a path of a surface acoustic wave on the piezoelectric substrate, wherein the width (W 1 , W 2 ) of overlapping of the electrode fingers is changed between the first surface-acoustic-wave element and the second surface-acoustic-wave element.
摘要:
A surface acoustic wave device in the present invention comprises; a plurality of surface acoustic wave elements provided on a piezoelectric substrate to be electrically isolated with each other, a substrate provided with a first conductor electrically connecting the plurality of surface acoustic wave elements, a second conductor electrically isolated to the first conductor and an external terminal, and a sealing member for protecting the substrate and the piezoelectric substrate. For the substrate, a package having a recess or an insulating substrate is used. The first conductor is electrically isolated to the external terminal, while the second conductor is electrically connected with the external terminal. The above-described structure in accordance with the present invention provides a small-sized surface acoustic wave device with excellent attenuation characteristics.
摘要:
A surface acoustic wave device includes a package (2) having a coefficient of linear expansion; and a piezoelectric element (1) forming a surface acoustic wave element, and mounted on the package (2) by flip chip bonding. The piezoelectric element (1) has different coefficients of linear expansion in a direction of propagation of surface acoustic waves generated by an interdigital electrode of the surface acoustic wave-element and in a direction perpendicular thereto, and further has a long side (L z ) existing in a direction having a coefficient of linear expansion close to the coefficient of linear expansion of the package (2). The piezoelectric element (1) is cut out from a single crystal having X, Y, and Z crystal axes, and the X crystal axis agrees with a direction of propagation of the surface acoustic wave.
摘要:
A SAW device includes a piezoelectric substrate and a package body holding the piezoelectric substrate, wherein the package body includes a bottom part carrying the piezoelectric substrate in a face-down state and a side wall part laterally surrounding the piezoelectric substrate, the bottom part carrying a wiring pattern for electrical connection with an electrode pattern on the piezoelectric substrate, the wiring pattern including a first ground pattern and a second ground pattern in a mutually separated relationship, the first ground pattern and the second ground pattern being connected electrically with each other.