公开(公告)号：EP2662151A1

公开(公告)日：2013-11-13

申请号：EP13159886.4

申请日：2013-03-19

Applicant: IMEC ,  St. Petersburg Electrotechnical University

Inventor： Luchinin, Victor ,  Goloudina, Svetlana ,  Pasyuta, Vyacheslav ,  Ivanov, Alexey ,  Baklanov, Mikhail ,  Krishtab, Mikhail

IPC: B05D1/20 ,  C08G73/00 ,  H05K3/28

CPC classification number: B32B37/15 ,  B05D1/20 ,  B05D1/208 ,  B32B18/00 ,  B32B27/04 ,  B32B27/281 ,  B32B2260/046 ,  B32B2305/026 ,  B32B2305/07 ,  B32B2307/00 ,  B32B2307/204 ,  B32B2379/08 ,  B32B2457/00 ,  C08G73/1067 ,  C09D179/08 ,  H01L21/02285 ,  H01L21/02318 ,  H05K1/03 ,  H05K3/143 ,  H05K2201/01 ,  H05K2201/0104 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0162 ,  Y10T428/249979 ,  Y10T428/249991 ,  C08K5/175

Abstract: Method for pore sealing a porous substrate, comprising: forming a continuous monolayer of a polyimide precursor on a liquid surface, transferring said polyimide precursor monolayer onto the porous substrate with the Langmuir-Blodgett technique, and imidization of the transferred polyimide precursor monolayers, thereby forming a polyimide sealing layer on the porous substrate. Porous substrate having at least one surface on which a sealing layer is provided to seal pores of the substrate, wherein the sealing layer is a polyimide having a thickness of a few monolayers and wherein there is no penetration of the polyimide into the pores.

Abstract translation: 对于封孔的多孔质基材的方法，包括：在液体表面上形成聚酰亚胺前体的连续的单层，传递环所述聚酰亚胺前体的单层到具有朗缪尔 - 布洛杰特法，多孔基底，和酰亚胺化被转让聚酰亚胺前体的单层，从而形成 在多孔基底的聚酰亚胺密封层。 具有其上设置有密封层以密封基板的孔的至少一个表面的多孔基材，worin密封层是具有一定厚度的几个单层的聚酰亚胺和worin不存在聚酰亚胺到孔中的渗透。

公开(公告)号：EP2662151B1

公开(公告)日：2018-08-29

申请号：EP13159886.4

申请日：2013-03-19

Applicant: IMEC VZW ,  St. Petersburg Electrotechnical University

Inventor： Luchinin, Victor ,  Goloudina, Svetlana ,  Pasyuta, Vyacheslav ,  Ivanov, Alexey ,  Baklanov, Mikhail ,  Krishtab, Mikhail

IPC: B05D1/20 ,  C08G73/00 ,  H05K3/28

CPC classification number: B32B37/15 ,  B05D1/20 ,  B05D1/208 ,  B32B18/00 ,  B32B27/04 ,  B32B27/281 ,  B32B2260/046 ,  B32B2305/026 ,  B32B2305/07 ,  B32B2307/00 ,  B32B2307/204 ,  B32B2379/08 ,  B32B2457/00 ,  C08G73/1067 ,  C09D179/08 ,  H01L21/02285 ,  H01L21/02318 ,  H05K1/03 ,  H05K3/143 ,  H05K2201/01 ,  H05K2201/0104 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0162 ,  Y10T428/249979 ,  Y10T428/249991 ,  C08K5/175

Abstract: Method for pore sealing a porous substrate, comprising: forming a continuous monolayer of a polyimide precursor on a liquid surface, transferring said polyimide precursor monolayer onto the porous substrate with the Langmuir-Blodgett technique, and imidization of the transferred polyimide precursor monolayers, thereby forming a polyimide sealing layer on the porous substrate. Porous substrate having at least one surface on which a sealing layer is provided to seal pores of the substrate, wherein the sealing layer is a polyimide having a thickness of a few monolayers and wherein there is no penetration of the polyimide into the pores.

公开(公告)号：EP3259963A1

公开(公告)日：2017-12-27

申请号：EP16752876.9

申请日：2016-02-16

Applicant: Interplex Industries, Inc. ,  Schneider, Richard ,  Lynch, Joseph J.

Inventor： SCHNEIDER, Richard ,  LYNCH, Joseph, J.

IPC: H05K1/18

CPC classification number: H05K1/0209 ,  H01R12/526 ,  H02G5/005 ,  H05K1/18 ,  H05K3/429 ,  H05K3/4679 ,  H05K2201/01 ,  H05K2201/0323 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/2018

Abstract: A multilayer bus board comprising a multilayer stacked assembly including a plurality of electrically conductive first layers, and at least one second dielectric layer disposed between adjacent first layers; and a frame formed of a dielectric material, the frame encapsulating at least a portion of the multilayer stacked assembly and mechanically maintaining the first and second layers in secure aligned abutting relation.