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公开(公告)号：EP3815189A1
公开(公告)日：2021-05-05
申请号：EP19739493.5
申请日：2019-06-26
发明人： SCHNEIDER, Richard
IPC分类号： H01R4/2425 , H01R9/22
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公开(公告)号：EP4367755A1
公开(公告)日：2024-05-15
申请号：EP22838289.1
申请日：2022-07-02
发明人： SCHNEIDER, Richard
IPC分类号： H01R13/187
CPC分类号： H01R13/187 , H01R12/57 , H01R12/7082 , H05K2201/103120130101 , H05K2201/100320130101 , H05K3/325
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公开(公告)号：EP4278417A1
公开(公告)日：2023-11-22
申请号：EP22739972.2
申请日：2022-01-12
发明人： HENNEMUTH, Robert , BURGESS, Lee
IPC分类号： H01R13/639 , H01R24/86 , H01R13/193
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公开(公告)号：EP3688844A1
公开(公告)日：2020-08-05
申请号：EP18786137.2
申请日：2018-09-24
发明人： PARRISH, Jeffrey, D.
IPC分类号： H01R12/58
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公开(公告)号：EP1147573B1
公开(公告)日：2005-11-16
申请号：EP99966192.9
申请日：1999-12-10
发明人： SEIDLER, Jack
摘要： An electrical lead includes a substrate-receiving section which has a collapsible rear plate (22) and a plurality of outwardly projecting prongs or arms (24, 26). The prongs are spaced apart to define a gap (30) having an opening slightly larger than the width of the substrate to be engaged. A substrate is inserted into the gap between the prongs so that the prongs are spaced on either side of the substrate. The rear plate of the lead is then compressed so that the prongs engage and tightly grip the substrate from opposite sides. Alternatively, the prongs may pivot upon the application of force to engage the substrate.
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公开(公告)号：EP4229699A1
公开(公告)日：2023-08-23
申请号：EP21883634.4
申请日：2021-10-18
发明人： LIN, Jeng-De , PARRISH, Jeffrey
IPC分类号： H01M8/04537 , H01M8/0202 , H01R13/24 , H01R13/115
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公开(公告)号：EP3714515A1
公开(公告)日：2020-09-30
申请号：EP18816377.8
申请日：2018-11-16
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公开(公告)号：EP2737527A2
公开(公告)日：2014-06-04
申请号：EP12817024.8
申请日：2012-07-24
发明人： SCHNEIDER, Richard , EYMARD, Eric
CPC分类号： H01L23/481 , H01L21/50 , H01L23/047 , H01L23/10 , H01L23/13 , H01L23/4985 , H01L24/48 , H01L24/73 , H01L24/97 , H01L2224/04042 , H01L2224/06135 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85447 , H01L2224/97 , H01L2924/00014 , H01L2924/12042 , H01L2924/15151 , H01L2924/15153 , H01L2924/1517 , H01L2924/1531 , H01L2924/16152 , H01L2924/16172 , H01L2924/16251 , H01L2924/1659 , H01L2924/167 , H01L2924/1679 , H01L2224/45099 , H01L2924/00012 , H01L2224/85 , H01L2224/83 , H01L2924/00
摘要： A open cavity semiconductor chip package that is leadless and does not have a metal lead frame as in conventional packages. The absence of a lead frame minimizes leakage paths and allows the novel package to be more readily fabricated as a hermetic package. A dual sided insulative or dielectric film is employed as the base interconnect between a semiconductor chip and outside contacts. Electrical connection from the top side of the film to the bottom side of the film is made through conductive micro-vias. The semiconductor chip is mounted on a paddle in a central opening in the film and wire bonded to pads on the film. After mounting of the chip, a cover or lid is attached to the film to encapsulate the assembly and maintain hermeticity of the package.
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公开(公告)号：EP1147573A1
公开(公告)日：2001-10-24
申请号：EP99966192.9
申请日：1999-12-10
发明人： SEIDLER, Jack
IPC分类号： H01R4/02
摘要： An electrical lead includes a substrate-receiving section which has a collapsible rear plate (22) and a plurality of outwardly projecting prongs or arms (24, 26). The prongs are spaced apart to define a gap (30) having an opening slightly larger than the width of the substrate to be engaged. A substrate is inserted into the gap between the prongs so that the prongs are spaced on either side of the substrate. The rear plate of the lead is then compressed so that the prongs engage and tightly grip the substrate from opposite sides. Alternatively, the prongs may pivot upon the application of force to engage the substrate.
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公开(公告)号：EP3867964A2
公开(公告)日：2021-08-25
申请号：EP19874649.7
申请日：2019-10-15
发明人： KENNEDY, Craig , PHAN, Vu
IPC分类号： H01M2/20
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