公开(公告)号：EP4422362A3

公开(公告)日：2024-10-09

申请号：EP24157949.9

申请日：2024-02-15

申请人： Nokia Solutions and Networks Oy

发明人： FAZARI, Daniel ,  CHAN, Alex

IPC分类号： H05K1/11 ,  H05K3/32 ,  H01R12/51

CPC分类号： H05K2201/1040120130101 ,  H05K2201/105920130101 ,  H05K3/325 ,  H05K1/116 ,  H05K2203/04320130101

摘要： A printed circuit board (PCB) 202 including: a first through hole 206; a first conductive pad 204 on a surface of the PCB, wherein the first conductive pad has a first surface treatment; a reflowed solder layer on the first surface treatment; and a first clinch nut 100 pressed into the first through hole 206, wherein the first clinch nut is pressed into contact with the solder layer to create electrical connectivity between the first clinch nut 100 and the first conductive pad 204.

公开(公告)号：EP4424119A1

公开(公告)日：2024-09-04

申请号：EP22802630.8

申请日：2022-10-18

申请人： Rolls-Royce Deutschland Ltd & Co KG

发明人： WALTRICH, Uwe ,  BUCHERT, Stanley

IPC分类号： H05K3/00 ,  H05K3/30

CPC分类号： H05K3/0058 ,  H05K3/30 ,  H05K2201/1025720130101 ,  H05K2201/1040920130101 ,  H05K2201/1040120130101 ,  H05K2201/1059820130101 ,  H05K2201/0990920130101 ,  H05K2201/1058320130101 ,  H05K2201/018720130101

公开(公告)号：EP4406067A1

公开(公告)日：2024-07-31

申请号：EP22758183.2

申请日：2022-07-27

申请人： VALEO SYSTEMES D'ESSUYAGE

发明人： STEFANI, Siegfried ,  KAPITZA, Harald ,  RUKWID, Timo

IPC分类号： H01R12/58 ,  H01R12/70 ,  H05K1/00

CPC分类号： H01R12/58 ,  H01R12/7029 ,  H05K3/4046 ,  H05K2201/1040120130101

公开(公告)号：EP4422362A2

公开(公告)日：2024-08-28

申请号：EP24157949.9

申请日：2024-02-15

申请人： Nokia Solutions and Networks Oy

发明人： FAZARI, Daniel ,  CHAN, Alex

IPC分类号： H05K1/11 ,  H05K3/32

CPC分类号： H05K2201/1040120130101 ,  H05K2201/105920130101 ,  H05K3/325 ,  H05K1/116

摘要： A printed circuit board (PCB) 202 including: a first through hole 206; a first conductive pad 204 on a surface of the PCB, wherein the first conductive pad has a first surface treatment; a reflowed solder layer on the first surface treatment; and a first clinch nut 100 pressed into the first through hole 206, wherein the first clinch nut is pressed into contact with the solder layer to create electrical connectivity between the first clinch nut 100 and the first conductive pad 204.