公开(公告)号：EP4193814B1

公开(公告)日：2024-06-05

申请号：EP21791371.4

申请日：2021-10-14

IPC分类号： H05K1/02 ,  C04B37/02 ,  H05K1/14 ,  H05K1/03 ,  H05K3/46

CPC分类号： H05K1/0204 ,  H05K1/142 ,  H05K3/4694 ,  H05K1/0306 ,  H05K2201/018720130101 ,  H05K2201/0903620130101 ,  H05K2201/0906320130101 ,  H05K2201/0915420130101 ,  H05K2201/1010620130101 ,  H05K2201/1041620130101 ,  H05K2201/0916320130101 ,  H05K2201/20920130101 ,  H05K2201/04820130101 ,  H05K2201/06820130101 ,  C04B37/023 ,  C04B2237/34320130101 ,  C04B2237/3420130101 ,  C04B2237/36520130101 ,  C04B2237/36820130101 ,  C04B2237/36620130101 ,  C04B2237/40720130101 ,  C04B2237/40220130101 ,  C04B2237/40320130101 ,  C04B2237/0420130101 ,  C04B2237/12220130101

公开(公告)号：EP4408134A1

公开(公告)日：2024-07-31

申请号：EP24153706.7

申请日：2024-01-24

申请人： Simmonds Precision Products, Inc.

发明人： EWANCHUK, Jeffrey ,  FRANZ, Paul M. ,  FITZHUGH, Christopher ,  DURKEE, Scott R.

IPC分类号： H05K1/18 ,  H05K3/46 ,  H05K1/02

CPC分类号： H05K1/185 ,  H05K2201/019520130101 ,  H05K2201/018720130101 ,  H05K2203/06320130101 ,  H05K3/4697 ,  H05K3/4626 ,  H05K3/4644 ,  H05K3/4673 ,  H05K1/0204

摘要： A circuit board assembly can include a circuit component die, a first dielectric layer disposed on a first side of the circuit component die made of a first dielectric material having a high thermal conductivity, a second dielectric layer disposed on a second side of the circuit component die made of the first dielectric material, and a bulk dielectric material having a lower thermal conductivity than the first dielectric material. The bulk dielectric material can have a lower glass transition temperature than the first dielectric material and being heterogeneous to the first dielectric material. The bulk dielectric material can be in flowed contact with lateral sides of the circuit component die, the first dielectric layer, and the second dielectric layer to laterally enclose the circuit component die, the first dielectric layer, and the second dielectric layer.

公开(公告)号：EP4432789A1

公开(公告)日：2024-09-18

申请号：EP24163659.6

申请日：2024-03-14

申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Wang, Nina ,  Baftiri, Artan

IPC分类号： H05K1/03 ,  H05K1/02

CPC分类号： H05K2201/020920130101 ,  H05K1/0373 ,  H05K2201/025420130101 ,  H05K1/024 ,  H05K2201/026920130101 ,  H05K1/036 ,  H05K2201/018720130101 ,  H05K2201/019520130101 ,  H05K2201/019120130101

摘要： Sheet (100) for manufacturing a component carrier (102), wherein the sheet (100) comprises a first structure (104) comprising first filler particles (108) in a resin matrix (112), and a second structure (106) stacked with the first structure (104) and comprising second filler particles (110) in a resin matrix (112), wherein a hollow volume in a respective one of the second filler particles (110) is larger than in a respective one of the first filler particles (108).

公开(公告)号：EP4424119A1

公开(公告)日：2024-09-04

申请号：EP22802630.8

申请日：2022-10-18

申请人： Rolls-Royce Deutschland Ltd & Co KG

发明人： WALTRICH, Uwe ,  BUCHERT, Stanley

IPC分类号： H05K3/00 ,  H05K3/30

CPC分类号： H05K3/0058 ,  H05K3/30 ,  H05K2201/1025720130101 ,  H05K2201/1040920130101 ,  H05K2201/1040120130101 ,  H05K2201/1059820130101 ,  H05K2201/0990920130101 ,  H05K2201/1058320130101 ,  H05K2201/018720130101