ELECTRICALLY CONDUCTIVE ADHESIVE HYDROGELS WITH SOLUBILIZER
    2.
    发明授权
    ELECTRICALLY CONDUCTIVE ADHESIVE HYDROGELS WITH SOLUBILIZER 有权
    导电粘合剂水凝胶与增溶剂

    公开(公告)号:EP1694375B1

    公开(公告)日:2011-03-02

    申请号:EP04816849.6

    申请日:2004-09-08

    IPC分类号: A61L31/14

    摘要: A composition providing electrically conductive adhesive hydrogels suitable for use as skin contact adhesives and, particularly, suitable for use as an electrical interface for disposable medical devices. The present hydrogels provide for reduced skin irritation and/or malodor properties, hydrate a subject's skin, readily wet around a subject's skin surface hair, and protect against burning of a subject upon or due to electrical stimulation through the hydrogel. These hydrogels generally include a monomer, a first initiator, a solubilizer, and a cross-linking agent. The present hydrogels also desirably include a buffer system to help prevent discoloration of the hydrogels and/or hydrolysis of the hydrogels as well as to improve shelf-life. Other additives such as conductivity enhancers, pharmaceuticals, humectants, plasticizers, skin health agents, etc. may be added to the present hydrogels either before or after curing.

    ELECTRICALLY CONDUCTIVE ADHESIVE HYDROGELS WITH SOLUBILIZER
    3.
    发明公开
    ELECTRICALLY CONDUCTIVE ADHESIVE HYDROGELS WITH SOLUBILIZER 有权
    导电粘合剂水凝胶与增溶剂

    公开(公告)号:EP1694375A2

    公开(公告)日:2006-08-30

    申请号:EP04816849.6

    申请日:2004-09-08

    IPC分类号: A61L31/14

    摘要: A composition providing electrically conductive adhesive hydrogels suitable for use as skin contact adhesives and, particularly, suitable for use as an electrical interface for disposable medical devices. The present hydrogels provide for reduced skin irritation and/or malodor properties, hydrate a subject's skin, readily wet around a subject's skin surface hair, and protect against burning of a subject upon or due to electrical stimulation through the hydrogel. These hydrogels generally include a monomer, a first initiator, a solubilizer, and a cross-linking agent. The present hydrogels also desirably include a buffer system to help prevent discoloration of the hydrogels and/or hydrolysis of the hydrogels as well as to improve shelf-life. Other additives such as conductivity enhancers, pharmaceuticals, humectants, plasticizers, skin health agents, etc. may be added to the present hydrogels either before or after curing.

    Microencapsulated curing agent for thermosetting resin compositions
    5.
    发明公开
    Microencapsulated curing agent for thermosetting resin compositions 失效
    包封的固化剂的热固性树脂组合物。

    公开(公告)号:EP0672707A3

    公开(公告)日:1996-07-03

    申请号:EP95301708.4

    申请日:1995-03-15

    IPC分类号: C08J3/24 C08K9/10

    摘要: A microcapsule-type curing agent comprises (A) a curing agent for a thermosetting resin and (B) a thermoplastic resin dissolvable in the thermosetting resin by heating. The microcapsule-type curing agent is formed as a particle-like material in which the component (A) is coated with a layer whose main constituent is the component (B) and the mean particle diameter of which is in the range of 0.1 to 20 µ m. By using the microcapsule-type curing agent, a thermosetting resin composition and a prepreg which are good in storage stability at a room temperature and excellent in thermal resistance of a cured product made therefrom can be obtained. Further, a fiber reinforced composite material obtained using this thermosetting resin composition is excellent in curing uniformity and thermal resistance.

    Packaging film containing an additive
    6.
    发明公开
    Packaging film containing an additive 失效
    Verpackungsfilm mit einem Zusatz。

    公开(公告)号:EP0444917A2

    公开(公告)日:1991-09-04

    申请号:EP91301624.2

    申请日:1991-02-28

    摘要: A multilayer non-irradiated film comprising a core layer, a respective further layer laminated to each side of the core layer, and an additive capable of migrating within the film, is prepared by:

    (i) blending an additive, such as a fungicide, encapsulated in a first thermoplastic resin, with a second thermoplastic resin which has a lower melting point than the first resin so that during extrusion of the blend the second resin melts and surrounds the encapsulated additive before the first resin melts; and
    (ii) coextruding the resulting blend to provide a layer, preferably the core layer, of the film and respective thermoplastics resins to provide the other layers of the film.

    Preferably a five layer film is formed in which a respective intermediate layer is provided between the core layer and each outer layer. A heat-shrinkable film may be formed by subsequently orienting the film. The film can be used to package articles such as fruit and vegetables to protect them from fungal infection.

    摘要翻译: 通过以下方法制备多层非辐射膜:(i)将添加剂如杀真菌剂,混合物,混合物, 封装在第一热塑性树脂中,具有比第一树脂具有更低熔点的第二热塑性树脂,使得在共混物的挤出期间,第二树脂在第一树脂熔化之前熔化并包围包封的添加剂; 和(ii)共混挤出所得共混物以提供膜的层,优选芯层,以及相应的热塑性树脂,以提供膜的其它层。 优选地,形成五层膜,其中在芯层和每个外层之间设置相应的中间层。 可以通过随后定向膜来形成热收缩膜。 该片可用于包装水果和蔬菜等物品,以防止真菌感染。

    Thermal energy storage compositions
    7.
    发明公开
    Thermal energy storage compositions 失效
    组合物储热。

    公开(公告)号:EP0087859A1

    公开(公告)日:1983-09-07

    申请号:EP83300584.6

    申请日:1983-02-04

    摘要: Thermal energy storage compositions comprise a thermal energy storage material, for instance an inorganic hydrate that can undergo a change of hydration with accompanying release or storage of latent heat of hydration at a temperature of 10 to 100°C, heid in a matrix of polymeric material, generally acrylic polymer. In one aspect of the invention the composition is in particulate form and so can, for instance, be poured into the heat exchanger in which it is to be used. In another aspect of the invention the storage material includes polyvalent metal ions and the polymeric material is a cationic polymer. In another aspect of the invention the composition is made by forming a solution, generally in water, of all the polymerisable material and most or all of the storage material and then polymerising the polymerisable material in this solution. The solution is generally a low viscosity fluid and polymerisation may be conducted in the heat exchanger vessel in which the composition is to be used.