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299 条记录 (耗时 0.025 秒)

    LASER PROCESSING APPARATUS, METHOD INVOLVING SAME, AND OBJECT PROCESSED THEREBY
    1.
    发明公开
    LASER PROCESSING APPARATUS, METHOD INVOLVING SAME, AND OBJECT PROCESSED THEREBY 审中-实审

    公开(公告)号：EP4406686A1

    公开(公告)日：2024-07-31

    申请号：EP22876849.5

    申请日：2022-09-28

    申请人： Laserwall Technology Co., Ltd

    发明人： KIM, Jin Ha ,  CHOI, Byoung Chan ,  KANG, Ki Seok

    IPC分类号： B23K26/03 ,  B23K26/042 ,  B23K26/062 ,  B23K26/046 ,  B23K26/06

    CPC分类号： B23K26/03 ,  B23K26/042 ,  B23K26/062 ,  B23K26/046 ,  B23K26/06

    摘要： The present invention relates to a laser processing apparatus comprising an intelligent optical head, and provides a laser processing apparatus comprising: a laser generation unit; a beam conversion apparatus for adjusting the size or shape of a laser beam generated by the laser generation unit; a beam adjustment unit for adjusting the focal position of the laser beam comprising passed through the beam conversion apparatus; a heat distribution measurement unit for measuring at least one of the surface temperature and the melting temperature of a processing target; a control unit for adjusting or controlling the intensity of the laser beam at the measured temperature of the processing target; and a beam focusing unit for focusing and transmitting the laser beam comprising passed through the beam conversion apparatus to the processing target, and a method including same.

    SYSTEM ZUR ASYMMETRISCHEN OPTISCHEN STRAHLFORMUNG
    5.
    发明公开
    SYSTEM ZUR ASYMMETRISCHEN OPTISCHEN STRAHLFORMUNG 审中-公开

    公开(公告)号：EP3221727A1

    公开(公告)日：2017-09-27

    申请号：EP15813274.6

    申请日：2015-11-19

    申请人： Trumpf Laser- und Systemtechnik GmbH

    发明人： KUMKAR, Malte ,  KLEINER, Jonas ,  GROSSMANN, Daniel ,  FLAMM, Daniel ,  KAISER, Myriam

    IPC分类号： G02B5/00 ,  B23K26/00 ,  B23K26/06 ,  G02B27/09

    CPC分类号： B23K26/0057 ,  B23K26/042 ,  B23K26/046 ,  B23K26/06 ,  B23K26/064 ,  B23K26/073 ,  B23K26/53 ,  G02B5/001 ,  G02B27/095

    摘要： For the purposes of material processing of a material (9) which, in particular, is largely transparent to a laser beam, modifications within asymmetric embodiment are generated transversely with respect to the propagation direction (5) of the laser beam. Here, the laser beam (3) is formed for embodying an elongate focal zone (7) in the material (9), with the focal zone (7) being embodied in such a way that it has at least one intensity maximum flattened transversely in a flattening direction or a transversal and/or axial arrangement of asymmetric intensity maxima which are flattened in an arrangement direction. After positioning the focal zone (7) in the material (9), a modification and the material (9) and the focal zone (7) are moved in the flattening direction, or transversely thereto, or relative to one another in the flattening direction, or transversely thereto, for the purposes of forming a crack along an induced preferential direction.

    摘要翻译： 对于尤其是激光束在很大程度上透明的材料的材料处理，横截激光束的传播方向形成不对称的形状修改。 由此，激光束被成形为在材料中形成细长的聚焦区域，其中聚焦区域包括至少一个在展平方向上横向展平的强度最大值，或者横向和/或轴向的 不对称强度最大值，它们在顺序方向上变平。 在将焦点区域定位在材料中之后，创建修改并且材料和焦点区域在平坦化方向上或者跨过平坦化方向或者沿着顺序方向相对于彼此移动以沿着诱导形成裂缝 首选方向。

    LASER CUTTING METHOD
    7.
    发明公开
    LASER CUTTING METHOD 有权
    LASERSCHNEIDEVERFAHREN

    公开(公告)号：EP2631030A4

    公开(公告)日：2017-08-16

    申请号：EP11834292

    申请日：2011-10-14

    申请人： NISSAN MOTOR

    发明人： HAMAGUCHI YUJI

    IPC分类号： B23K26/38 ,  B23K26/00 ,  B23K26/04 ,  B23K26/14 ,  B23K103/16 ,  H01M2/30

    CPC分类号： B23K26/06 ,  B23K26/046 ,  B23K26/064 ,  B23K26/14 ,  B23K26/1476 ,  B23K26/38 ,  B23K26/382 ,  B23K26/40 ,  B23K2203/16 ,  H01M2/30 ,  H01M10/04 ,  H01M10/058

    摘要： The laser cutting method for cutting a pair of plate materials, each of which has a different thickness and melting point, by irradiating them with a laser is provided with a plate material placement process for placing the pair of plate materials side by side so that, out of the pair of plate materials, an opposite surface of a laser irradiated surface of a plate material with a lower melting point protrudes more than an opposite surface of a laser irradiated surface of a plate material with a higher melting point, a focus adjustment process for aligning a focus position of the laser with an undersurface opposite the laser irradiated surface of the plate material with a higher melting point out of the pair of plate materials, and a plate material cutting process for cutting the pair of plate materials through irradiation with the laser according to a series of operations while sustaining a focus position of the laser to the pair of plate materials.

    摘要翻译： 激光切割方法是通过激光照射来切割具有不同厚度和熔点的一对板材的激光切割方法，其具有用于将一对板材并排放置的板材放置过程， 在一对板材中，熔点低的板材的激光照射面的相反面比熔点高的板材的激光照射面的相反面突出得多，焦点调整工序 用于使激光的焦点位置与该一对板材中具有较高熔点的板材的激光照射表面的相对下表面对准;以及板材切割工艺，用于通过照射用于切割该一对板材的板材 激光根据一系列操作同时维持激光焦点位置到一对板材上。

    LASER MACHINING METHOD AND CHIP
    9.
    发明公开
    LASER MACHINING METHOD AND CHIP 审中-公开
    LASERBEARBEITUNGSVERFAHREN UND CHIPDAFÜR

    公开(公告)号：EP2468448A4

    公开(公告)日：2017-07-05

    申请号：EP10809968

    申请日：2010-08-17

    申请人： HAMAMATSU PHOTONICS KK

    发明人： NAKAGAWA AIKO ,  SAKAMOTO TAKESHI

    IPC分类号： B23K26/40 ,  B23K26/00 ,  B23K26/046 ,  B23K26/38 ,  B23K101/40 ,  B23K103/00 ,  H01L21/67 ,  H01L23/00

    CPC分类号： H01L23/562 ,  B23K26/0057 ,  B23K26/046 ,  B23K26/38 ,  B23K26/40 ,  B23K2201/40 ,  B23K2203/50 ,  H01L21/67092 ,  H01L2924/0002 ,  H01L2924/00

    摘要： While reliably cutting an object to be processed, the strength of the resulting chips is improved. An object to be processed 1 is irradiated with laser light L, so as to form modified regions 17, 27, 37, 47 extending along lines to cut 5 and aligning in the thickness direction in the object 1. Here, modified regions 17 are formed such that modified region formed parts 17a and modified region unformed parts 17b alternate along the lines, and modified regions 47 are formed such that modified region formed parts 47a and modified region unformed parts 47b alternate along the lines. This can inhibit formed modified regions 7 from lowering the strengths on the rear face 21 side and front face 3 side of chips obtained by cutting. On the other hand, modified regions 27, 37 located between the modified regions 17, 47 are formed continuously from one end side of the lines 5 to the other end side thereof, whereby the cuttability of the object 1 can be secured reliably.

    摘要翻译： 在可靠地切割待加工物体的同时，所得到的切屑的强度得到改善。 对被加工物1照射激光L，形成沿着被加工物1的厚度方向沿着切断预定线5延伸的修正区域17,27,37,47。这里，形成改质区域17 使得改质区域形成部分17a和改质区域未形成部分17b沿着这些线交替，并且形成改质区域47使得改质区域形成部分47a和改质区域未形成部分47b沿着这些线交替。 由此，能够抑制形成的改质区域7降低切削后的切屑的背面21侧和正面3侧的强度。 另一方面，位于改质区域17,47之间的改质区域27,37从线条5的一端侧连续地形成到另一端侧，由此可以可靠地确保被加工物1的切割性。