公开(公告)号：EP4166264A1

公开(公告)日：2023-04-19

申请号：EP21717945.6

申请日：2021-02-18

申请人： Soriano Asensio, Antoni Josep ,  Anillo Lopez, Maria Josefa

发明人： Soriano Asensio, Antoni Josep ,  Anillo Lopez, Maria Josefa

IPC分类号： B23B45/00 ,  B23Q11/10 ,  B24B57/02 ,  B24B55/02

摘要： The present invention refers to a device that is coupled to motorised tools whose consumable or implement rotates, preferably tools of the portable or swivelling type, supplying fluids either to the surface on which the consumable or implement acts, or to the consumable or implement itself so that it performs its function correctly, having a reservoir in which pressure is generated for its use and the device and the tool or consumable that is used being independent and interchangeable, and having conventional means of attachment that allow it to be used in conventional tools without having to adapt the tool, the consumable or implement.

公开(公告)号：EP4166226A1

公开(公告)日：2023-04-19

申请号：EP22212575.9

申请日：2013-11-13

申请人： Versum Materials US, LLC

发明人： Byers, Gary Allen ,  Derecskei, Bela ,  Bayer, Benjamin Patrick

IPC分类号： B01F23/45 ,  B01F23/40 ,  B24B57/02 ,  B01F25/21 ,  B01F25/50 ,  B01F25/60 ,  B01F35/21 ,  B01F35/82 ,  B24B37/00 ,  G05D11/13

摘要： A slurry and/or chemical blend supply apparatus (20) comprising a blend module (200) that combines two or more flowing component streams (A, B, C) to form a blended slurry and/or chemical blend in a pipe (217), wherein said blend module (200) comprises a pipe (210, 211, 212) for each component stream (A, B, C) and at least one flow controller (260, 261, 262) in each of at least two of the component pipes (210, 211, 212) to control the flow rate of the components (A, B, C) and wherein said component pipes (210, 211, 212) are connected and combined into a single pipe (217) to form the blended slurry or blended chemical blend stream and further comprising
a distribution module (400) comprising one or more distribution tanks (491A), one or more global loops (111A), and one or more pumps (101A),
said distribution module (400) further comprising one or more back pressure controllers (84A), and pressure sensors (78A) on each of said one or more global loops (111A);
wherein said distribution tank (491A) comprises one or more eductors (761, 763) in the bottom portion of said distribution tank (491A) and
wherein the return exit pipes (86A, 86B) of the one or more global loops (111A) are connected to the one or more distribution tanks (491A) and and the one or more eductors (761, 763) are attached to the exit of the return pipes (86A, 86B) of the global loops (111A) into the distribution tank (491A).

公开(公告)号：EP3891237A1

公开(公告)日：2021-10-13

申请号：EP19894172.6

申请日：2019-11-13

申请人： CMC Materials, Inc.

发明人： HUNG LOW, Fernando ,  KRAFT, Steven ,  IVANOV, Roman A. ,  GRUMBINE, Steven ,  WOLFF, Andrew

IPC分类号： C09G1/02 ,  C09K3/14 ,  B24B37/005 ,  B24B37/04 ,  B24B57/02

公开(公告)号：EP3891236A1

公开(公告)日：2021-10-13

申请号：EP19893774.0

申请日：2019-11-13

申请人： CMC Materials, Inc.

发明人： KRAFT, Steven ,  HUNG LOW, Fernando ,  CLINGERMAN, Daniel ,  IVANOV, Roman A. ,  GRUMBINE, Steven

IPC分类号： C09G1/02 ,  C09K3/14 ,  B24B37/005 ,  B24B37/04 ,  B24B57/02

公开(公告)号：EP3807049A1

公开(公告)日：2021-04-21

申请号：EP19819006.8

申请日：2019-06-13

申请人： Mirka Ltd.

发明人： SJÖBERG, Tomas ,  HEDE, Hans ,  SUNDQVIST, Maria ,  SUNDELL, Mats

IPC分类号： B24B57/02 ,  B24B1/00 ,  B24B7/24

公开(公告)号：EP3710200A1

公开(公告)日：2020-09-23

申请号：EP18876326.2

申请日：2018-10-30

申请人： Applied Materials, Inc.

发明人： NANGOY, Roy, C. ,  POLLARD, Chad ,  D'AMBRA, Allen, L.

IPC分类号： B24B57/02 ,  B24B37/04 ,  B24B37/34 ,  B24B49/00 ,  H01L21/304 ,  H01L21/306

公开(公告)号：EP3597365A1

公开(公告)日：2020-01-22

申请号：EP19193021.3

申请日：2011-09-06

申请人： NGK Insulators, Ltd.

发明人： KITAMURA, Kazumasa ,  NAGAE, Tomoki

IPC分类号： B24B37/04 ,  B24B37/10 ,  B24B37/26 ,  B24B37/005 ,  B24B57/02 ,  B24B37/00 ,  B24B13/00

摘要： The present invention provides: a method of polishing an object to be polished for processing a surface of the object to be polished into a concave or convex state with a high degree of accuracy; and a polishing pad. The method includes polishing the object to be polished 20 by rotating the polishing pad 10 and the object to be polished 20 at number of revolutions different from each other so as to make polishing speed have a distribution on the surface of the object to be polished 20.

公开(公告)号：EP3564771A2

公开(公告)日：2019-11-06

申请号：EP19177129.4

申请日：2013-11-13

申请人： Versum Materials US, LLC

发明人： Byers, Gary Allen ,  Derecskei, Bela ,  Bayer, Benjamin Patrick

IPC分类号： G05D11/02 ,  B01F15/04 ,  B01F3/00 ,  B24B57/02

摘要： A slurry and/or chemical blend supply apparatus suitable for providing slurry and/or chemical blend to chemical mechanical planarization (CMP) tools or other tools in a semiconductor fabrication facility, related processes, methods of use and methods of manufacture. The slurry and/or chemical blend supply apparatus includes one or more of the following: feed module, blend module, analytical module and distribution module.

公开(公告)号：EP3562620A1

公开(公告)日：2019-11-06

申请号：EP17828987.2

申请日：2017-12-20

申请人： Mazzone, Libero ,  Barberis, Michel ,  Greco, Antonio

发明人： Mazzone, Libero ,  Barberis, Michel ,  Greco, Antonio

IPC分类号： B24B29/00 ,  B24B57/02 ,  A47L11/03 ,  B24B23/02

公开(公告)号：EP3323142A1

公开(公告)日：2018-05-23

申请号：EP16825032.2

申请日：2016-07-12

申请人： Cabot Microelectronics Corporation

发明人： LAM, Viet ,  CUI, Ji

IPC分类号： H01L21/304 ,  B24B57/02 ,  H01L21/306

CPC分类号： B24B37/044 ,  C09G1/02

摘要： Described are materials and methods for processing (polishing or planarizing) a substrate that contains pattern dielectric material using a polishing composition (aka “slurry”) and an abrasive pad, e.g., CMP processing.