公开(公告)号：EP4426808A1

公开(公告)日：2024-09-11

申请号：EP22813478.9

申请日：2022-11-02

Applicant: Unilever IP Holdings B.V. ,  Unilever Global IP Limited

Inventor： MAHAPATRA, Samiran ,  MOHAPATRA, Namisha ,  SAMPATH KUMAR, Ramya

IPC: C11D3/04 ,  C11D3/22 ,  C11D7/10 ,  C11D7/26

CPC classification number: C11D3/222 ,  C11D7/268 ,  C11D3/046 ,  C11D7/10

公开(公告)号：EP3529344B1

公开(公告)日：2023-07-05

申请号：EP17788078.8

申请日：2017-10-13

Inventor： LYNCH, Matthew, Lawrence ,  ILLIE, Brandon, Philip ,  SAWIN, Philip Andrew ,  YEARY, Amber, Joy

IPC: C11D3/37 ,  C11D3/12 ,  C11D3/00 ,  C11D3/04 ,  C11D7/02 ,  C11D7/10

公开(公告)号：EP4047110A1

公开(公告)日：2022-08-24

申请号：EP22167100.1

申请日：2015-06-19

Applicant: Ecolab USA Inc.

Inventor： CABANAS, Jesus ,  SCHACHT, Paul, Frazer ,  WILLIAMS, Brian ,  COURT, Colin ,  POWER, Caleb

IPC: C23G1/19 ,  C23F11/18 ,  C23F11/10 ,  C23G5/032 ,  C11D3/04 ,  C11D3/20 ,  C11D7/06 ,  C11D7/10 ,  C11D7/26 ,  C11D3/39

Abstract: A method of inhibiting liquid and vapor phase corrosion and staining while cleaning soils from industrial equipment using a CIP process under highly alkaline and oxidizing conditions, whereby gluconic acid or salts thereof serve as corrosion and stain inhibitor.

公开(公告)号：EP4038173A1

公开(公告)日：2022-08-10

申请号：EP20872611.7

申请日：2020-09-28

Applicant: Versum Materials US, LLC

Inventor： CAO, Yuanmei ,  PHENIS, Michael ,  WANG, Lili ,  SUN, Laisheng ,  WU, Aiping

IPC: C11D7/32 ,  C11D7/50 ,  C11D7/10 ,  C11D7/26 ,  C11D3/30 ,  C11D3/00 ,  C11D3/43 ,  C11D11/00 ,  G03F7/42

公开(公告)号：EP2655741B1

公开(公告)日：2021-01-06

申请号：EP11850588.2

申请日：2011-11-16

Inventor： ZWICK, Kenneth John ,  ZHANG, Jun ,  JOHNSON, Kroy Donald ,  VOGEL, Nathan John ,  GUSKY, Robert Irving ,  POWLING, David James Sealy

IPC: D21H27/30 ,  D21H27/00 ,  B31D1/04 ,  C11D3/04 ,  A47K10/16 ,  D04H1/49 ,  D04H1/587 ,  D21H21/20 ,  C11D7/10 ,  C11D17/04

公开(公告)号：EP3740071A1

公开(公告)日：2020-11-25

申请号：EP19741233.1

申请日：2019-01-18

Applicant: LegioGuard Pty Ltd

Inventor： COLLINS, Andrew, Scott ,  GOULTER, Scott, Kennedy

IPC: A01N37/02 ,  A01N25/02 ,  A01N59/08 ,  A01N43/08 ,  A61L2/18 ,  C02F1/50 ,  C02F5/08 ,  C11D7/10

公开(公告)号：EP3599291B1

公开(公告)日：2020-11-18

申请号：EP18184977.9

申请日：2018-07-23

Applicant: Technochim SA

Inventor： Groulard, Frederic ,  Tosar, François ,  Louche, Juliette

IPC: C23G1/19 ,  C23G1/08 ,  C23C22/50 ,  C11D7/10 ,  C11D7/26 ,  C11D7/34 ,  C11D11/00 ,  C11D3/00

公开(公告)号：EP3726565A1

公开(公告)日：2020-10-21

申请号：EP19741609.2

申请日：2019-01-15

Applicant: Tokuyama Corporation

Inventor： SHIMODA, Takafumi ,  NEGISHI, Takayuki ,  KIKKAWA, Yuki ,  TONO, Seiji

IPC: H01L21/304 ,  C11D7/10 ,  C11D7/32 ,  C11D17/08 ,  H01L21/308 ,  C11D7/54

Abstract: [Problem] To provide: a treatment liquid for removing ruthenium and tungsten adhering to an edge part or a back surface part of a semiconductor wafer; and a cleaning method. [Solution] A treatment liquid for cleaning a semiconductor wafer, which contains (A) hypochlorite ions and (C) a solvent, and which has a pH of more than 7 but less than 12.0 at 25°C. A method for cleaning a semiconductor wafer, wherein the above-described treatment liquid is brought into contact with a semiconductor wafer that has ruthenium or tungsten, thereby removing the ruthenium or the tungsten from the semiconductor wafer.

公开(公告)号：EP2144986B1

公开(公告)日：2020-07-29

申请号：EP08747588.5

申请日：2008-05-02

Applicant: Ecolab USA Inc.

Inventor： MONSRUD, Lee, J. ,  OLSON, Keith, E. ,  SMITH, Kim, R. ,  MILLS, Kristen, A.

IPC: C23C20/06 ,  C23C20/00 ,  C23C22/00 ,  C02F5/02 ,  C11D7/10 ,  C11D3/04 ,  C11D11/00 ,  C23G1/22 ,  C23G1/20 ,  C23F11/18 ,  C23F11/12 ,  C23F11/08 ,  C11D3/10 ,  C02F5/06

公开(公告)号：EP3529344A1

公开(公告)日：2019-08-28

申请号：EP17788078.8

申请日：2017-10-13

Applicant: The Procter & Gamble Company

Inventor： LYNCH, Matthew, Lawrence ,  ILLIE, Brandon, Philip ,  SAWIN, Philip Andrew ,  YEARY, Amber, Joy

IPC: C11D3/37 ,  C11D3/12 ,  C11D3/00 ,  C11D3/04 ,  C11D7/02 ,  C11D7/10