公开(公告)号：EP0068167A3

公开(公告)日：1983-02-16

申请号：EP82104857

申请日：1982-06-03

申请人： E.I. DU PONT DE NEMOURS AND COMPANY

发明人： Mc Cormick, Cornelius Joseph ,  Moneta, Robert John

IPC分类号： H01B01/02 ,  H05B41/34

CPC分类号： H05K1/092 ,  H01B1/16 ,  H01B1/20

摘要： A thick film copper conductor composition which sinters in the temperature range of 550-700°C consisting essentially of an admixture of 73 to 78 parts copper powder, 4 to 5 parts cupric oxide, 4 to 7 parts low melting temperature cadmium oxide glass dispersed in an organic vehicle.

公开(公告)号：EP0180443A3

公开(公告)日：1987-09-02

申请号：EP85307773

申请日：1985-10-28

申请人： NGK INSULATORS, LTD.

发明人： Ikushima, Kazuo ,  Iwadachi, Takaharu ,  Ishikawa, Syuhei

IPC分类号： H01B01/02 ,  H01H01/02 ,  H01R13/03 ,  C22C09/06

CPC分类号： H01H1/025 ,  C22C9/06 ,  H01B1/02

摘要： A low cost electroconductive spring material for use in electrical devices having excellent electroconductivity and spring performance consists of from 1.8 to 3.0% by weight of Ni, from 0.15 to 0.35% by weight of εe, from 0.2 to 1.2% by weight of Si and the balance Cu. This low cost electroconductive spring material can be applied as electric devices. The material may further contain from 0.05 to 3.0% by weight in total of at least one component selected from Sn, Al and Zn provided that each such component is in the range of 0.05 to 1.5% by weight, or may contain from 0.01 to 2.0% by weight in total of at least one component selected from Co, Fe, Zr, Ti and Mg provided that each such component is in the range of .0.01 to 1.0% by weight.

公开(公告)号：EP0150049A3

公开(公告)日：1987-10-28

申请号：EP85100452

申请日：1985-01-17

申请人： Research Development Corporation of Japan ,  Karamon, Hideaki

发明人： Karamon, Hideaki ,  Ogawa, Keiichi

IPC分类号： C22C01/00 ,  H01F01/00 ,  H01B01/02 ,  C23C14/14

CPC分类号： C22C45/10 ,  C22C45/02 ,  H01F10/131 ,  H01L39/12

摘要： Nitrogen-containing amorphous alloys having a combination of superior properties which are highly valuable and desirable for ferromagnetic materials or superconducting materials are produced by sputtering metallic materials and nitrogen compounds containing semi-metal or semiconducting metal, such as boron or silicon, without requiring the use of nitrogen gas. The produced alloy has a novel structure, represented by the formula: (wherein M is at least one metal or alloy; L is at least one semimetal or semiconducting element; and x, y and z are fractional atomic percentages totaling 100 (i.e., x+y+z = 100) and the value of y+z being 10 or more and the respective values of x, y, z being not zero).

公开(公告)号：EP0249740A3

公开(公告)日：1988-04-20

申请号：EP87106904

申请日：1987-05-12

申请人： Kabel- und Metallwerke Gutehoffnungshütte Aktiengesellschaft

发明人： Gravemann, Horst, Dipl.-Ing.

IPC分类号： B22D11/04 ,  C22C09/06 ,  H01B01/02 ,  C22F01/057

CPC分类号： B22D11/059 ,  C22C9/06 ,  C22F1/08

公开(公告)号：EP0190888A3

公开(公告)日：1986-11-20

申请号：EP86300654

申请日：1986-01-30

申请人： RAYCHEM LIMITED

发明人： O'Brien, James Martin ,  Penneck, Richard John ,  Smith, Nicholas John G.

IPC分类号： H01B01/02

CPC分类号： H01B1/08 ,  H01B1/02

摘要： An electrical component comprises a metallic conductor and an inorganic conductive layer thereon. The conductive layer has preferably been formed by a vacuum deposition method, and is bonded to the electrical conductor by an intermediate layer. The inorganic conductive layer may, for example, be a non-linear material, a ferromagnetic, or ferro-magnetic material, or a material exhibiting PTC or NTC behaviour.

公开(公告)号：EP0071928A3

公开(公告)日：1983-03-16

申请号：EP82106945

申请日：1982-07-31

申请人： E.I. DU PONT DE NEMOURS AND COMPANY

发明人： Nair, Kumaran Manikantan

IPC分类号： H01B01/02 ,  H01G01/01 ,  H01L27/01 ,  H05K01/09

CPC分类号： H05K1/092 ,  C03C3/072 ,  C03C3/142 ,  C03C3/253 ,  C03C8/10 ,  C03C8/14 ,  C03C8/18 ,  C03C10/0054 ,  C22C32/0089 ,  H01B1/16 ,  H01G4/0085

摘要： Metallization suitable for making printed thick film terminations comprising an admixture of finely divided particles of palladium/silver as the conductive phase and bismuth-free low-melting, low viscosity devitrifiable glass as the binder phase. The composition optionally contains a spinel-forming metal oxide to raise substrate adhesion.