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1.
公开(公告)号:EP3780193B1
公开(公告)日:2025-02-26
申请号:EP19777686.7
申请日:2019-03-29
Inventor: TANIWAKI, Kazuma , MATSUURA, Takahiro
IPC: H01M4/86 , B01J23/42 , H01M8/10 , H01M4/90 , H01M8/1004 , H01M8/1032 , H01M8/1018
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公开(公告)号:EP4293758B1
公开(公告)日:2025-01-29
申请号:EP22752771.0
申请日:2022-02-09
Inventor: NAGAMORI, Kiyotaka , MIZUSAKI, Tomoteru , AOKI, Satoshi , NAKAMURA, Yoko , SEKI, Yasuhiro
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3.
公开(公告)号:EP4454881A1
公开(公告)日:2024-10-30
申请号:EP22910606.7
申请日:2022-10-31
Applicant: Daicel Corporation
Inventor: NISHIMURA, Kanae , CHIASHI, Masanori , TANAKA, Ryotaro
IPC: B32B27/00 , B32B15/085 , B32B27/32 , B32B27/36 , H01M8/10 , H01M8/1004 , H01M8/1039 , H01M8/1067
Abstract: There are provided a mold release film having excellent handleability and mold releasability even when used in a high-temperature environment, a laminate thereof, and an application thereof. A mold release film is prepared to include at least a substrate layer and a mold release layer directly or indirectly layered on at least one surface of the substrate layer. The mold release layer contains a polypropylene-based resin. The mold release film may have a thermal shrinkage rate of approximately 4.0% or less when subjected to a heating treatment under conditions of 160°C and 15 minutes. Further, a mold release film may be prepared to include at least a mold release layer containing a polypropylene-based resin. The mold release film has a thermal shrinkage rate of 4.0% or less when subjected to a heating treatment under conditions of 160°C and 15 minutes.
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公开(公告)号:EP3855542B1
公开(公告)日:2024-10-30
申请号:EP19861507.2
申请日:2019-09-04
Inventor: HORI, Akihiro , HORIUCHI, Yosuke
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公开(公告)号:EP4257582B1
公开(公告)日:2024-10-16
申请号:EP22202071.1
申请日:2022-10-18
Inventor: HEO, Pil Won , LEE, Jong Myung , LEE, Sung Chul , KIM, Ki Hyun , KIM, Byeong Seon , KO, Han Sol , KIM, Mi Jeong , JEONG, Yu Gyeong , HWANG, Sean Soo
IPC: C07C309/10 , H01M8/1004 , H01M8/1027 , H01M8/1032 , H01M8/1039 , H01M8/1067
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公开(公告)号:EP3474357B1
公开(公告)日:2024-10-16
申请号:EP18820849.0
申请日:2018-06-19
Inventor: KIM, Jung-Ho
IPC: H01M4/86 , H01M4/90 , H01M4/88 , H01M8/1004 , H01M8/1018
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公开(公告)号:EP4432407A1
公开(公告)日:2024-09-18
申请号:EP22901663.9
申请日:2022-11-23
Applicant: Kolon Industries, Inc.
Inventor: KIM, Jung Ho , KIM, Jun Young , SONG, Kah Young , KONG, Nak Won , LEE, Eun Su , KIM, Hyeong Su , LEE, Ju Sung , NAM, Kyoung Sik , PARK, Chan Mi
IPC: H01M8/1065 , H01M8/1067 , H01M8/1069 , H01M8/1004 , H01M4/88 , H01M4/86 , H01M8/10
CPC classification number: Y02E60/50 , H01M8/10 , H01M8/1069 , H01M8/1004 , H01M8/1065 , H01M4/86 , H01M8/1067 , H01M4/88
Abstract: A membrane-electrode assembly with improved durability is provided. An embodiment of the present invention provides a membrane-electrode assembly comprising: a polymer electrolyte membrane having concavo-convex portions on at least one surface thereof and a catalyst layer disposed on the polymer electrolyte membrane, wherein the catalyst layer includes a first catalyst layer loaded into the inside of the concavo-convex portion and a second catalyst layer disposed on the polymer electrolyte membrane, the first catalyst layer being interposed between the polymer electrolyte membrane and the second catalyst layer.
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8.
公开(公告)号:EP4428966A1
公开(公告)日:2024-09-11
申请号:EP22901666.2
申请日:2022-11-23
Applicant: Kolon Industries, Inc.
Inventor: PARK, Jung Hwa , LEE, Dong Hoon , SONG, Kum Suck , YUN, Sung Hyun , YUM, Seung Jib , OH, Chang Hoon , LEE, Hye Song , LEE, Eun Su
IPC: H01M8/1058 , H01M8/106 , H01M8/1053 , H01M8/1004
CPC classification number: Y02E60/50 , H01M8/1058 , H01M8/106 , H01M8/1004 , H01M8/1053
Abstract: A reinforced composite membrane with improved ion conductivity and wettability is provided. Provided in one embodiment of the present disclosure is a reinforced composite membrane comprising a porous support and an ionomer layer, which comprises an ion conductor filling the pores inside the porous support, wherein the porous support comprises a first surface and a second surface opposite to the first surface, and the first surface is reformed to contain a first hydrophilic functional group.
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公开(公告)号:EP4421921A1
公开(公告)日:2024-08-28
申请号:EP22883638.3
申请日:2022-10-20
Applicant: Toppan Holdings Inc.
Inventor: MORIOKA, Hiroyuki , OZAWA, Madoka
IPC: H01M4/86 , H01M8/10 , H01M8/1004
CPC classification number: Y02E60/50 , H01M8/10 , H01M8/1004 , H01M4/86
Abstract: A membrane electrode assembly includes: a polymer electrolyte membrane; a pair of electrode catalyst layers disposed with the polymer electrolyte membrane therebetween while being in contact with a surface of the polymer electrolyte membrane; and a gas diffusion layer laminated on each of the pair of electrode catalyst layers. The gas diffusion layer includes a microporous layer in contact with the electrode catalyst layer and a diffusion substrate layer made of a fiber substrate. An average fiber diameter of a fiber material contained in the diffusion substrate layer is 10 times or more and 150 times of less of an average fiber diameter of the fibrous substance contained in the electrode catalyst layer.
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公开(公告)号:EP4420178A1
公开(公告)日:2024-08-28
申请号:EP22884592.1
申请日:2022-10-13
Applicant: UOP LLC
Inventor: LIU, Chunqing , DONG, Xueliang , WU, Jeff , MILLER, Stuart
IPC: H01M8/1053 , H01M8/1058 , H01M8/1081 , H01M8/1004 , H01M8/18
CPC classification number: Y02E60/50 , H01M8/1053 , H01M8/188 , H01M8/1025 , H01M8/106 , H01M8/1081
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